Patents by Inventor Jiahao XU

Jiahao XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124365
    Abstract: A preparation method of submicron powder of high-entropy nitride via nitride thermal reduction with mechano-chemical assistance, comprising material preparation—grinding—activation—preforming—reaction. In the present invention, high-entropy metal nitride and silicon nitride is used as raw materials, soft mechanochemical activation technologies are used to reduce reaction activation energy of the system, thereafter, by thermal reduction of the nitride, high-purity high-entropy nitride powder is prepared with solid phase methods, and the shortage of high-purity high-entropy nitride powder is addressed. There is no impure phase in the (Hf0.2Zr0.2Ti0.2Nb0.2Ta0.2)N high entropy powder prepared according to the present invention, and a single phase solid solution of good crystallinity is formed, and distribution of elements and ingredients in the powder is even, no foreign element is present, and oxygen content is controlled to be less than 0.3%.
    Type: Application
    Filed: June 14, 2023
    Publication date: April 18, 2024
    Inventors: Youjun LU, Lutong YANG, Xiang LIU, Chuyun WANG, Wuyang SONG, Jiahao XU
  • Publication number: 20240105187
    Abstract: Embodiments of this application disclose a three-dimensional audio signal processing method and apparatus, to implement sound field classification of a three-dimensional audio signal, to accurately identify the three-dimensional audio signal. An embodiment of this application provides a three-dimensional audio signal processing method, including: performing linear decomposition on a current frame of a three-dimensional audio signal, to obtain a linear decomposition result; obtaining, based on the linear decomposition result, a sound field classification parameter corresponding to the current frame; and determining a sound field classification result of the current frame based on the sound field classification parameter.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Publication number: 20240087578
    Abstract: A three-dimensional audio signal coding method, apparatus, and encoder are described. The method includes, after obtaining a first correlation between a current frame of a three-dimensional audio signal and a representative virtual speaker set for a previous frame, the encoder determines whether the first correlation satisfies a reuse condition, where the first correlation is used to determine whether to reuse the representative virtual speaker set for the previous frame when the current frame is encoded. The method further encodes the current frame based on the representative virtual speaker set for the previous frame when the first correlation satisfies the reuse condition, to obtain a bitstream. A virtual speaker in the representative virtual speaker set for the previous frame is a virtual speaker used for encoding the previous frame of the three-dimensional audio signal.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Publication number: 20240087579
    Abstract: This application discloses a three-dimensional audio signal coding method and apparatus, and an encoder, and relates to the multimedia field. The method includes: After determining a first quantity of virtual speakers and a first quantity of vote values based on a current frame of a three-dimensional audio signal, a candidate virtual speaker set, and a voting round quantity, the encoder selects a second quantity of representative virtual speakers for the current frame from the first quantity of virtual speakers based on the first quantity of vote values, and further encodes the current frame based on the second quantity of representative virtual speakers for the current frame to obtain a bitstream. This achieves efficient data compression.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Publication number: 20240077716
    Abstract: A micromirror assembly comprises a first position-limiting part, a micromirror chip, and a second position-limiting part that are stacked. The micromirror chip includes a fastening frame, a movable part, and a first cantilever, where the movable part is connected to the fastening frame by the first cantilever. The first position-limiting part and the second position-limiting part are separately connected to the fastening frame, the first position-limiting part and the second position-limiting part have a hollow area, and the hollow areas are opposite to the movable part. The first position-limiting part and the second position-limiting part are configured to absorb shock from a collision with the micromirror chip, and a projection of a collision part of the first position-limiting part on the micromirror chip intersects with a central axis of the first cantilever.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Fei Zhao, Huai Yuan Chu, Jinghui Xu, Jiahao Wu
  • Patent number: 11923688
    Abstract: An exemplary two-step method for power system inertia online estimation is described. The first step is to accurately estimate the POI-level aggregated inertia. The second step is to calculate the system-level inertia constant by weighting all the POI-level aggregated inertia and to monitor the inertia spatial distribution. In one example embodiment, the PMU is installed at POI, the frequency spatial difference is considered, and the mechanical power is carefully treated.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: March 5, 2024
    Assignee: NORTH CHINA ELECTRIC POWER UNIVERSITY
    Inventors: Tianshu Bi, Cheng Wang, Jiahao Liu, Guoyi Xu
  • Publication number: 20230421978
    Abstract: A method for obtaining a higher-order ambisonics (HOA) coefficient includes obtaining location information of a virtual speaker on a preset spherical surface, where the preset spherical surface includes M circles of longitude and N circles of latitude, and obtaining, based on the location information and a preset reference trigonometric function table, a trigonometric function value corresponding to the location information, where the reference trigonometric function table includes an elevation trigonometric function table and/or an azimuth trigonometric function table, and obtaining an HOA coefficient for the virtual speaker based on the trigonometric function value corresponding to the location information.
    Type: Application
    Filed: September 5, 2023
    Publication date: December 28, 2023
    Inventors: Yuan Gao, Shuai Liu, Bin Wang, Zhe Wang, Tianshu Qu, Jiahao Xu
  • Publication number: 20230412981
    Abstract: This application provides a method and an apparatus for determining a virtual speaker set. The method for determining a virtual speaker set includes: determining a target virtual speaker from F preset virtual speakers based on a to-be-processed audio signal, where each of the F virtual speakers corresponds to S virtual speakers, F is a positive integer, and S is a positive integer greater than 1; and obtaining, from a preset virtual speaker distribution table, respective position information of S virtual speakers corresponding to the target virtual speaker, where the virtual speaker distribution table includes position information of K virtual speakers, the position information includes an elevation angle index and an azimuth angle index, K is a positive integer greater than 1, F?K, and F×S?K. This application can improve audio signal playback effect.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Publication number: 20230298600
    Abstract: An audio encoding and decoding method and apparatus, and a non-transitory readable storage medium are provided. The encoding method includes: selecting a first target virtual speaker from a preset virtual speaker set based on a current scene audio signal; generating a first virtual speaker signal based on the current scene audio signal and attribute information of the first target virtual speaker; and encoding the first virtual speaker signal to obtain a bitstream. According to the encoding method, an amount of encoded data is reduced, to improve encoding efficiency.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Publication number: 20230298601
    Abstract: Audio encoding and decoding methods and apparatuses are disclosed, to reduce an amount of encoded and decoded data, so as to improve encoding and decoding efficiency. The method includes: selecting a first target virtual speaker from a preset virtual speaker set based on a first scene audio signal; generating a first virtual speaker signal based on the first scene audio signal and attribute information of the first target virtual speaker; obtaining a second scene audio signal using the attribute information of the first target virtual speaker and the first virtual speaker signal; generating a residual signal based on the first scene audio signal and the second scene audio signal; and encoding the first virtual speaker signal and the residual signal, to produce encoded signals, and writing the encoded signals into a bitstream.
    Type: Application
    Filed: May 28, 2023
    Publication date: September 21, 2023
    Inventors: Yuan GAO, Shuai LIU, Bin WANG, Zhe WANG, Tianshu QU, Jiahao XU
  • Patent number: 11647646
    Abstract: A method for encapsulating openings in a display area includes: forming an intermediate layer having an isolation hole and an assembly via on a substrate, the isolation hole dividing the intermediate layer into separate display portion and isolation portion and the assembly via being spaced apart from the isolation hole by the isolation portion; forming a groove on a side of the isolation portion facing the display portion and/or on a side of the isolation portion away from the display portion; forming a light emitting layer including a first light emitting portion, a second light emitting portion, a third light emitting portion, and a fourth light emitting portion, wherein the third light emitting portion is separate from at least one of the second light emitting portion and the fourth light emitting portion; and forming an encapsulation layer that covers the light emitting layer and the isolation portion, and is filled in a groove.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: May 9, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yufei Ji, Dong Yang, Jiahao Xu, Jianglin Wang, Dongliang Lu, Liang Song, Hao Cheng
  • Publication number: 20230050620
    Abstract: The present disclosure relates to a display substrate and a display device thereof. The display substrate comprises: a substrate; a first wiring extending in a first direction on the substrate; a first dielectric layer on the substrate and the first wiring; a second wiring extending in the first direction on the first dielectric layer, wherein an orthographic projection of the second wiring on the substrate at least partially overlaps with an orthographic projection of the first wiring on the substrate; a conformal dielectric layer on the first dielectric layer and the second wiring; a third wiring and a fourth wiring disposed at spacings in the first direction on the conformal dielectric layer, wherein orthographic projections of the third wiring and the fourth wiring on the substrate at least partially overlap with the orthographic projections of the first wiring and the second wiring on the substrate.
    Type: Application
    Filed: August 5, 2021
    Publication date: February 16, 2023
    Inventors: Liang SONG, Jiahao XU, Dongliang LU, Fei LIAO, Donghua JIANG, Guobo YANG, Pengyu LIAO, Wuyang ZHAO
  • Patent number: 11443661
    Abstract: A flexible display substrate and a method for manufacturing the same are provided. The method includes: forming a first insulating layer on a flexible base substrate; forming an etching barrier layer on a side of the first insulating layer away from the flexible base substrate; forming a second insulating layer covering the etching barrier layer on the side of the first insulating layer away from the flexible base substrate; and forming a first opening in the first insulating layer and a second opening in the second insulating layer through one patterning process, so that an orthographic projection of the first opening on the flexible base substrate falls within an orthographic projection of the second opening on the flexible base substrate, so as to form a step portion at a connection position where the first opening is connected to the second opening.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 13, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Liang Song, Yufei Ji, Pengyu Liao, Jiahao Xu, Hao Cheng, Wuyang Zhao, Long Jiang, Fei Ou, Jun Peng
  • Publication number: 20210272485
    Abstract: A flexible display substrate and a method for manufacturing the same are provided. The method includes: forming a first insulating layer on a flexible base substrate; forming an etching barrier layer on a side of the first insulating layer away from the flexible base substrate; forming a second insulating layer covering the etching barrier layer on the side of the first insulating layer away from the flexible base substrate; and forming a first opening in the first insulating layer and a second opening in the second insulating layer through one patterning process, so that an orthographic projection of the first opening on the flexible base substrate falls within an orthographic projection of the second opening on the flexible base substrate, so as to form a step portion at a connection position where the first opening is connected to the second opening.
    Type: Application
    Filed: April 10, 2020
    Publication date: September 2, 2021
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Liang Song, Yufei Ji, Pengyu Liao, Jiahao Xu, Hao Cheng, Wuyang Zhao, Long Jiang, Fei Ou, Jun Peng
  • Publication number: 20210226163
    Abstract: A method for encapsulating openings in a display area includes: forming an intermediate layer having an isolation hole and an assembly via on a substrate, the isolation hole dividing the intermediate layer into separate display portion and isolation portion and the assembly via being spaced apart from the isolation hole by the isolation portion; forming a groove on a side of the isolation portion facing the display portion and/or on a side of the isolation portion away from the display portion; forming a light emitting layer including a first light emitting portion, a second light emitting portion, a third light emitting portion, and a fourth light emitting portion, wherein the third light emitting portion is separate from at least one of the second light emitting portion and the fourth light emitting portion; and forming an encapsulation layer that covers the light emitting layer and the isolation portion, and is filled in a groove.
    Type: Application
    Filed: December 19, 2019
    Publication date: July 22, 2021
    Inventors: Yufei JI, Dong YANG, Jiahao XU, Jianglin WANG, Dongliang LU, Liang SONG, Hao CHENG