Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract: A waterproof ring unit is located in the opening of a socket. A ring ditch is made around the inner surface of the waterproof ring unit. When a flanged light emitting diode (LED) lamp is inserted into the socket, the ring ditch structurally couples to the flange. The waterproof ring embraces the lamp body to form a waterproof module for the LED lamp.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract: A metal base has a mounting hole made in the wall for housing a light unit, and a reflection surface opposite to the hole for reflecting the light from the light unit to form a reflection lamp with high heat dissipation ability.

Abstract: A light emitting device with a top electrode and a bottom electrode is pushed by a plug to make contacts with either an upper metal plate or a lower metal plate each serving as one of the leads for an electrode of the light emitting devices. The plug is inserted through an opening larger than the light emitting device in the metal plate not in contact with the light emitting device but serving as another lead for the light emitting device. The plug is locked in place by means of threaded screw heads, snug-fit, snap-on buttons or an elastic sleeve. Thus, the light emitting device can be easily replaced without any wire bonding. A plurality of the light unit can be sandwiched between the upper metal plate and the lower metal plate.

Abstract: A diode chip is mounted on two bottom metal leads of a surface-mount package through two flexible links. The links are zigzag cantilevers attached to the metallic plates. The cantilevers serve as springs to support the device and to cushion any temperature stress or bending stress so as not to damage the connection between the device and the metallic leads.

Abstract: A plurality of LED lamps are mounted on a substrate and sealed within a lamp house to form a closed LED lamp. A circulation fan is installed inside the air-tight LED lamp, with the guidance of a sleeve frame which encloses at least partial of the fan to form partial portion of an air circulation path. An air inlet is made on the sleeve frame behind or in the lateral of the fan, and an air outlet is made on the frame before the fan. The air circulates between inside the sleeve frame and outside the sleeve frame within the sealed lamp housing so as to make the temperature even distribution inside the lamp.

Abstract: An electronic device such as a light device or a voice device which has two electrodes; one of the electrodes electrically couples to a freely swinging lead. A first terminal of a power supply couples to a first electrode of the device, a second terminal is configured in a position within a swinging range of the chain lead; the electronic device is turned on/off when the chain lead swings to touch/leave the second electrode. A tilt indicator, vibration indicator, a voice toy or a light emitting toy actuated by vibration or tilt can be made according to the invention.

Abstract: A chess piece is embedded with a light unit; a central lead and peripheral lead are made on its bottom. A chess board comprises a top electrode plate and a bottom electrode place. The top electrode plate has a plurality holes where the central leads electrically couples to a bottom electrode plate. The chess piece is lit when placed in position on a chess board where the central lead electrically couples to the bottom electrode plate and the peripheral lead electrically couples to the top electrode plate.

Abstract: A thin resistive layer is connected in series and integrated with a light emitting device as a ballast to stabilize the current through the light emitting device.

Abstract: A metal base has a mounting hole made in the wall for housing a light unit, and a reflection surface opposite to the hole for reflecting the light from the light unit to form a reflection lamp with high heat dissipation ability.

Abstract: A light board is made with a receptacle substrate for holding cassette light units. The convenience of assembly and disassembly of the light units from the receptacle substrate makes the product easily to be maintained for changing different color light units, changing different displaying patterns, and removing or replacing a failure light unit.

Abstract: A lighting board is made with a receptacle substrate accommodated to accept cassette light units. The convenience of assembly and disassembly of the light unit from the receptacle substrate makes the product easily to be maintained for changing different color light units, changing different displaying patterns, remove or replace a failed light unit in the lighting board.

Abstract: The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting layer for contacting said outer layer, and an insulating layer between the top and the bottom layer. For LED with a bottom electrode and a top electrode, the LED can be mounted on the planar tops of the inner lead and the top electrode wire bonded to the outer lead, or the LED can be mounted on the side surface of the inner lead and the top electrode wire bonded to the outer lead. For LED with two bottom electrode, the LED electrodes can straddle over the planar tops of the inner lead and the outer lead, or the LED electrodes can straddle over the telescopic side surfaces of the two leads.