Patents by Inventor Jiahong WU

Jiahong WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923138
    Abstract: A collecting device includes a stage configured to place a substrate. A magnetic field generating unit holds, by a magnetic field, a first liquid containing a magnetic fluid and a collecting liquid to bring the first liquid into contact with at least an end portion of the substrate. A collecting unit collects the first liquid from the magnetic field generating unit. A separating unit separates the collecting liquid from the first liquid.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: March 5, 2024
    Assignee: KIOXIA CORPORATION
    Inventors: Sho Kato, Yuji Yamada, Jiahong Wu
  • Patent number: 11837510
    Abstract: The present invention provides a method for analyzing a silicon substrate, by which impurities such as a very small amount of metal in a silicon substrate provided with a thick nitride film can be analyzed with high accuracy with ICP-MS, and is characterized by use of a silicon substrate analysis apparatus including an analysis scan port having a load port, a substrate conveyance robot, an aligner, a drying chamber, a vapor phase decomposition chamber, an analysis stage and a nozzle for analysis of a substrate; an analysis liquid collection unit; and an analyzer for performing inductive coupling plasma analysis.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: December 5, 2023
    Assignee: KIOXIA CORPORATION
    Inventors: Jiahong Wu, Katsuhiko Kawabata, Mitsumasa Ikeuchi, Sungjae Lee
  • Patent number: 11640903
    Abstract: An analysis apparatus includes a stage on which an analysis sample as an analysis target and a first adjustment sample used for adjusting a focus are provided. A laser generation unit generates a laser beam for vaporizing the analysis sample or the first adjustment sample by irradiating the sample with the laser beam. A detection unit detects a signal intensity of an element of the analysis sample or the first adjustment sample vaporized by irradiation with the laser beam. A controller determines a focus position of the laser beam with respect to a front surface position of the first adjustment sample based on the signal intensity of the first adjustment sample, and performs a control such that the focus position of the laser beam corresponds with a front surface of the analysis sample.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: May 2, 2023
    Assignee: KIOXIA CORPORATION
    Inventors: Jiahong Wu, Miki Takimoto
  • Patent number: 11607750
    Abstract: According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: March 21, 2023
    Assignee: KIOXIA CORPORATION
    Inventors: Jiahong Wu, Yuji Yamada
  • Publication number: 20230070820
    Abstract: A collecting device includes a stage configured to place a substrate. A magnetic field generating unit holds, by a magnetic field, a first liquid containing a magnetic fluid and a collecting liquid to bring the first liquid into contact with at least an end portion of the substrate. A collecting unit collects the first liquid from the magnetic field generating unit. A separating unit separates the collecting liquid from the first liquid.
    Type: Application
    Filed: February 28, 2022
    Publication date: March 9, 2023
    Applicant: Kioxia Corporation
    Inventors: Sho KATO, Yuji YAMADA, Jiahong WU
  • Publication number: 20220277946
    Abstract: An analysis apparatus includes a stage on which an analysis sample as an analysis target and a first adjustment sample used for adjusting a focus are provided. A laser generation unit generates a laser beam for vaporizing the analysis sample or the first adjustment sample by irradiating the sample with the laser beam. A detection unit detects a signal intensity of an element of the analysis sample or the first adjustment sample vaporized by irradiation with the laser beam. A controller determines a focus position of the laser beam with respect to a front surface position of the first adjustment sample based on the signal intensity of the first adjustment sample, and performs a control such that the focus position of the laser beam corresponds with a front surface of the analysis sample.
    Type: Application
    Filed: August 17, 2021
    Publication date: September 1, 2022
    Applicant: Kioxia Corporation
    Inventors: Jiahong WU, Miki TAKIMOTO
  • Patent number: 11310232
    Abstract: There are provided a network identity authentication method, a network identity authentication system, a user agent device used in the network identity authentication method and the network identity authentication system, and a computer-readable storage medium. The network identity authentication method includes: acquiring, by a user agent, identity information and a registration rule of a target website via a network terminal; acquiring registration information for the target website based on the identity information or generating registration information for the target website according to the registration rule; transmitting the identity information and the registration information to a server agent and sending, by the server agent based on the identity information and the registration information, an authentication request to a website server to complete an authentication process.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: April 19, 2022
    Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Wenyin Liu, Xin Li, Zhiheng Shen, Jialong Zhang, Shuai Fan, Qixiang Zhang, Jiahong Wu
  • Publication number: 20210118751
    Abstract: The present invention provides a method for analyzing a silicon substrate, by which impurities such as a very small amount of metal in a silicon substrate provided with a thick nitride film can be analyzed with high accuracy with ICP-MS, and is characterized by use of a silicon substrate analysis apparatus including an analysis scan port having a load port, a substrate conveyance robot, an aligner, a drying chamber, a vapor phase decomposition chamber, an analysis stage and a nozzle for analysis of a substrate; an analysis liquid collection unit; and an analyzer for performing inductive coupling plasma analysis.
    Type: Application
    Filed: April 8, 2019
    Publication date: April 22, 2021
    Applicants: Kioxia Corporation, IAS Inc.
    Inventors: Jiahong Wu, Katsuhiko Kawabata, Mitsumasa Ikeuchi, Sungjae Lee
  • Patent number: 10962519
    Abstract: An analysis pretreatment device according to an embodiment includes a chamber capable of containing an analysis object therein. A pressure reducer reduces pressure inside the chamber. An introducing part vaporizes a liquid and introduces the vaporized liquid into the chamber. A first supplier supplies water in a liquid state to the introducing part. A second supplier supplies hydrofluoric acid in a gas state to the introducing part. The introducing part introduces a mixed gas into the chamber. The mixed gas includes vaporized water, which is obtained by vaporizing water in a liquid state, and hydrofluoric acid in a gas state.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: March 30, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Jiahong Wu, Ayako Mizuno, Yuji Yamada
  • Publication number: 20200391328
    Abstract: According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.
    Type: Application
    Filed: February 20, 2020
    Publication date: December 17, 2020
    Applicant: KIOXIA CORPORATION
    Inventors: Jiahong WU, Yuji YAMADA
  • Publication number: 20200014686
    Abstract: There are provided a network identity authentication method, a network identity authentication system, a user agent device used in the network identity authentication method and the network identity authentication system, and a computer-readable storage medium. The network identity authentication method includes: acquiring, by a user agent, identity information and a registration rule of a target website via a network terminal; acquiring registration information for the target website based on the identity information or generating registration information for the target website according to the registration rule; transmitting the identity information and the registration information to a server agent and sending, by the server agent based on the identity information and the registration information, an authentication request to a website server to complete an authentication process.
    Type: Application
    Filed: September 25, 2018
    Publication date: January 9, 2020
    Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Wenyin LIU, Xin LI, Zhiheng SHEN, Jialong ZHANG, Shuai FAN, Qixiang ZHANG, Jiahong WU
  • Patent number: 9658203
    Abstract: A metal collection solution according to an embodiment contains 48 wt % or more of HNO3, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: May 23, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Jiahong Wu, Yuji Yamada, Ayako Mizuno
  • Publication number: 20170072378
    Abstract: An analysis pretreatment device according to an embodiment includes a chamber capable of containing an analysis object therein. A pressure reducer reduces pressure inside the chamber. An introducing part vaporizes a liquid and introduces the vaporized liquid into the chamber. A first supplier supplies water in a liquid state to the introducing part. A second supplier supplies hydrofluoric acid in a gas state to the introducing part. The introducing part introduces a mixed gas into the chamber. The mixed gas includes vaporized water, which is obtained by vaporizing water in a liquid state, and hydrofluoric acid in a gas state.
    Type: Application
    Filed: March 10, 2016
    Publication date: March 16, 2017
    Inventors: Jiahong WU, Ayako MIZUNO, Yuji YAMADA
  • Publication number: 20160209389
    Abstract: A metal collection solution according to an embodiment contains 48 wt % or more of HNO3, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.
    Type: Application
    Filed: August 6, 2015
    Publication date: July 21, 2016
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Jiahong WU, Yuji Yamada, Ayako Mizuno
  • Patent number: 8815107
    Abstract: An aspect of the present invention relates to a method of etching a surface layer portion of a silicon wafer comprising: positioning the silicon wafer within a sealed vessel containing a mixed acid A of hydrofluoric acid and sulfuric acid so that the silicon wafer is not in contact with mixed acid A; introducing a solution B in the form of nitric acid containing nitrogen oxides into the sealed vessel and causing solution B to mix with mixed acid A; and vapor phase decomposing the surface layer portion of the silicon wafer within the sealed vessel within which mixed acid A and solution B have been mixed.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: August 26, 2014
    Assignee: Sumco Corporation
    Inventors: Jiahong Wu, Shabani B. Mohammad
  • Publication number: 20120077290
    Abstract: An aspect of the present invention relates to a method of etching a surface layer portion of a silicon wafer comprising: positioning the silicon wafer within a sealed vessel containing a mixed acid A of hydrofluoric acid and sulfuric acid so that the silicon wafer is not in contact with mixed acid A; introducing a solution B in the form of nitric acid containing nitrogen oxides into the sealed vessel and causing solution B to mix with mixed acid A; and vapor phase decomposing the surface layer portion of the silicon wafer within the sealed vessel within which mixed acid A and solution B have been mixed.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 29, 2012
    Applicant: SUMCO CORPORATION
    Inventors: Jiahong WU, Shabani B. MOHAMMAD