Patents by Inventor Jiahong WU
Jiahong WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923138Abstract: A collecting device includes a stage configured to place a substrate. A magnetic field generating unit holds, by a magnetic field, a first liquid containing a magnetic fluid and a collecting liquid to bring the first liquid into contact with at least an end portion of the substrate. A collecting unit collects the first liquid from the magnetic field generating unit. A separating unit separates the collecting liquid from the first liquid.Type: GrantFiled: February 28, 2022Date of Patent: March 5, 2024Assignee: KIOXIA CORPORATIONInventors: Sho Kato, Yuji Yamada, Jiahong Wu
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Patent number: 11837510Abstract: The present invention provides a method for analyzing a silicon substrate, by which impurities such as a very small amount of metal in a silicon substrate provided with a thick nitride film can be analyzed with high accuracy with ICP-MS, and is characterized by use of a silicon substrate analysis apparatus including an analysis scan port having a load port, a substrate conveyance robot, an aligner, a drying chamber, a vapor phase decomposition chamber, an analysis stage and a nozzle for analysis of a substrate; an analysis liquid collection unit; and an analyzer for performing inductive coupling plasma analysis.Type: GrantFiled: April 8, 2019Date of Patent: December 5, 2023Assignee: KIOXIA CORPORATIONInventors: Jiahong Wu, Katsuhiko Kawabata, Mitsumasa Ikeuchi, Sungjae Lee
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Patent number: 11640903Abstract: An analysis apparatus includes a stage on which an analysis sample as an analysis target and a first adjustment sample used for adjusting a focus are provided. A laser generation unit generates a laser beam for vaporizing the analysis sample or the first adjustment sample by irradiating the sample with the laser beam. A detection unit detects a signal intensity of an element of the analysis sample or the first adjustment sample vaporized by irradiation with the laser beam. A controller determines a focus position of the laser beam with respect to a front surface position of the first adjustment sample based on the signal intensity of the first adjustment sample, and performs a control such that the focus position of the laser beam corresponds with a front surface of the analysis sample.Type: GrantFiled: August 17, 2021Date of Patent: May 2, 2023Assignee: KIOXIA CORPORATIONInventors: Jiahong Wu, Miki Takimoto
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Patent number: 11607750Abstract: According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.Type: GrantFiled: February 20, 2020Date of Patent: March 21, 2023Assignee: KIOXIA CORPORATIONInventors: Jiahong Wu, Yuji Yamada
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Publication number: 20230070820Abstract: A collecting device includes a stage configured to place a substrate. A magnetic field generating unit holds, by a magnetic field, a first liquid containing a magnetic fluid and a collecting liquid to bring the first liquid into contact with at least an end portion of the substrate. A collecting unit collects the first liquid from the magnetic field generating unit. A separating unit separates the collecting liquid from the first liquid.Type: ApplicationFiled: February 28, 2022Publication date: March 9, 2023Applicant: Kioxia CorporationInventors: Sho KATO, Yuji YAMADA, Jiahong WU
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Publication number: 20220277946Abstract: An analysis apparatus includes a stage on which an analysis sample as an analysis target and a first adjustment sample used for adjusting a focus are provided. A laser generation unit generates a laser beam for vaporizing the analysis sample or the first adjustment sample by irradiating the sample with the laser beam. A detection unit detects a signal intensity of an element of the analysis sample or the first adjustment sample vaporized by irradiation with the laser beam. A controller determines a focus position of the laser beam with respect to a front surface position of the first adjustment sample based on the signal intensity of the first adjustment sample, and performs a control such that the focus position of the laser beam corresponds with a front surface of the analysis sample.Type: ApplicationFiled: August 17, 2021Publication date: September 1, 2022Applicant: Kioxia CorporationInventors: Jiahong WU, Miki TAKIMOTO
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Patent number: 11310232Abstract: There are provided a network identity authentication method, a network identity authentication system, a user agent device used in the network identity authentication method and the network identity authentication system, and a computer-readable storage medium. The network identity authentication method includes: acquiring, by a user agent, identity information and a registration rule of a target website via a network terminal; acquiring registration information for the target website based on the identity information or generating registration information for the target website according to the registration rule; transmitting the identity information and the registration information to a server agent and sending, by the server agent based on the identity information and the registration information, an authentication request to a website server to complete an authentication process.Type: GrantFiled: September 25, 2018Date of Patent: April 19, 2022Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGYInventors: Wenyin Liu, Xin Li, Zhiheng Shen, Jialong Zhang, Shuai Fan, Qixiang Zhang, Jiahong Wu
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Publication number: 20210118751Abstract: The present invention provides a method for analyzing a silicon substrate, by which impurities such as a very small amount of metal in a silicon substrate provided with a thick nitride film can be analyzed with high accuracy with ICP-MS, and is characterized by use of a silicon substrate analysis apparatus including an analysis scan port having a load port, a substrate conveyance robot, an aligner, a drying chamber, a vapor phase decomposition chamber, an analysis stage and a nozzle for analysis of a substrate; an analysis liquid collection unit; and an analyzer for performing inductive coupling plasma analysis.Type: ApplicationFiled: April 8, 2019Publication date: April 22, 2021Applicants: Kioxia Corporation, IAS Inc.Inventors: Jiahong Wu, Katsuhiko Kawabata, Mitsumasa Ikeuchi, Sungjae Lee
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Patent number: 10962519Abstract: An analysis pretreatment device according to an embodiment includes a chamber capable of containing an analysis object therein. A pressure reducer reduces pressure inside the chamber. An introducing part vaporizes a liquid and introduces the vaporized liquid into the chamber. A first supplier supplies water in a liquid state to the introducing part. A second supplier supplies hydrofluoric acid in a gas state to the introducing part. The introducing part introduces a mixed gas into the chamber. The mixed gas includes vaporized water, which is obtained by vaporizing water in a liquid state, and hydrofluoric acid in a gas state.Type: GrantFiled: March 10, 2016Date of Patent: March 30, 2021Assignee: TOSHIBA MEMORY CORPORATIONInventors: Jiahong Wu, Ayako Mizuno, Yuji Yamada
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Publication number: 20200391328Abstract: According to one embodiment, an analysis apparatus includes a stage on which to place a sample, a light source, a film thickness measurement unit, and a controller. The light source generates a laser beam to irradiate the sample with the laser beam to cause vaporization of the sample. The film thickness measurer measures a thickness of the sample at a first position where the laser beam irradiates the sample. The controller controls at least one irradiation condition of the laser beam based on the measured thickness of the sample.Type: ApplicationFiled: February 20, 2020Publication date: December 17, 2020Applicant: KIOXIA CORPORATIONInventors: Jiahong WU, Yuji YAMADA
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Publication number: 20200014686Abstract: There are provided a network identity authentication method, a network identity authentication system, a user agent device used in the network identity authentication method and the network identity authentication system, and a computer-readable storage medium. The network identity authentication method includes: acquiring, by a user agent, identity information and a registration rule of a target website via a network terminal; acquiring registration information for the target website based on the identity information or generating registration information for the target website according to the registration rule; transmitting the identity information and the registration information to a server agent and sending, by the server agent based on the identity information and the registration information, an authentication request to a website server to complete an authentication process.Type: ApplicationFiled: September 25, 2018Publication date: January 9, 2020Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGYInventors: Wenyin LIU, Xin LI, Zhiheng SHEN, Jialong ZHANG, Shuai FAN, Qixiang ZHANG, Jiahong WU
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Patent number: 9658203Abstract: A metal collection solution according to an embodiment contains 48 wt % or more of HNO3, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.Type: GrantFiled: August 6, 2015Date of Patent: May 23, 2017Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Jiahong Wu, Yuji Yamada, Ayako Mizuno
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Publication number: 20170072378Abstract: An analysis pretreatment device according to an embodiment includes a chamber capable of containing an analysis object therein. A pressure reducer reduces pressure inside the chamber. An introducing part vaporizes a liquid and introduces the vaporized liquid into the chamber. A first supplier supplies water in a liquid state to the introducing part. A second supplier supplies hydrofluoric acid in a gas state to the introducing part. The introducing part introduces a mixed gas into the chamber. The mixed gas includes vaporized water, which is obtained by vaporizing water in a liquid state, and hydrofluoric acid in a gas state.Type: ApplicationFiled: March 10, 2016Publication date: March 16, 2017Inventors: Jiahong WU, Ayako MIZUNO, Yuji YAMADA
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Publication number: 20160209389Abstract: A metal collection solution according to an embodiment contains 48 wt % or more of HNO3, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.Type: ApplicationFiled: August 6, 2015Publication date: July 21, 2016Applicant: Kabushiki Kaisha ToshibaInventors: Jiahong WU, Yuji Yamada, Ayako Mizuno
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Patent number: 8815107Abstract: An aspect of the present invention relates to a method of etching a surface layer portion of a silicon wafer comprising: positioning the silicon wafer within a sealed vessel containing a mixed acid A of hydrofluoric acid and sulfuric acid so that the silicon wafer is not in contact with mixed acid A; introducing a solution B in the form of nitric acid containing nitrogen oxides into the sealed vessel and causing solution B to mix with mixed acid A; and vapor phase decomposing the surface layer portion of the silicon wafer within the sealed vessel within which mixed acid A and solution B have been mixed.Type: GrantFiled: September 21, 2011Date of Patent: August 26, 2014Assignee: Sumco CorporationInventors: Jiahong Wu, Shabani B. Mohammad
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Publication number: 20120077290Abstract: An aspect of the present invention relates to a method of etching a surface layer portion of a silicon wafer comprising: positioning the silicon wafer within a sealed vessel containing a mixed acid A of hydrofluoric acid and sulfuric acid so that the silicon wafer is not in contact with mixed acid A; introducing a solution B in the form of nitric acid containing nitrogen oxides into the sealed vessel and causing solution B to mix with mixed acid A; and vapor phase decomposing the surface layer portion of the silicon wafer within the sealed vessel within which mixed acid A and solution B have been mixed.Type: ApplicationFiled: September 21, 2011Publication date: March 29, 2012Applicant: SUMCO CORPORATIONInventors: Jiahong WU, Shabani B. MOHAMMAD