Patents by Inventor Jiajia Sui

Jiajia Sui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11778772
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 3, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin
  • Publication number: 20220338372
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 20, 2022
    Inventors: Jiajia SUI, Quanming LI, Guo YANG, Shuainan LIN
  • Patent number: 11419238
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Grant
    Filed: October 27, 2018
    Date of Patent: August 16, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin
  • Publication number: 20210185854
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Application
    Filed: October 27, 2018
    Publication date: June 17, 2021
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin