Abstract: A package structure for a power supply module, can include: a die and a capacitive element that are separated from each other and arranged on different horizontal planes with different heights along a vertical direction of the package structure; connection structures that connect to the die and to the capacitive element; where a current loop comprising at least two parallel current paths on different horizontal planes with different heights along the vertical direction of the package structure is formed; and where the current loop passes through the die, the capacitive element, and the connection structures, and directions of currents of the two parallel current paths are at least partially opposite to each other in order to decrease electromagnetic interference.

Abstract: A transformer can include at least one magnetic core; a substrate having a planar winding inside; and where the substrate is stacked with at least one of the magnetic cores. A package module can include the transformer and a package backplane a package backplane that encapsulates a wafer; and where the package backplane is stacked with the transformer, and an upper surface of the package backplane is in contact with the magnetic core of the transformer.

Abstract: A package assembly can include: a die electrically connected to outer pins of the package assembly; an electronic component located above the die and electrically connected to the die, wherein the electronic component is connected to the outer pins of the package assembly through conductive pillars; and a heat dissipation structure located between the die and the electronic component to facilitate heat dissipation of the electronic component, where the heat dissipation structure physically isolates the die and the electronic component such that electromagnetic interference from the electronic component to the die is substantially prevented.

Abstract: A power transformer can include: a magnet layer that is the only magnet layer in the power transformer; at least one primary winding layer having a plane that is parallel to the magnet layer; at least one secondary winding layer having a plane that is parallel to the magnet layer; and where along a vertical direction of the transformer, both the primary and secondary winding layers are located on a same side of the magnet layer.

Abstract: A package structure for a power supply module, can include: a die and a capacitive element that are separated from each other and arranged on different horizontal planes with different heights along a vertical direction of the package structure; connection structures that connect to the die and to the capacitive element; where a current loop comprising at least two parallel current paths on different horizontal planes with different heights along the vertical direction of the package structure is formed; and where the current loop passes through the die, the capacitive element, and the connection structures, and directions of currents of the two parallel current paths are at least partially opposite to each other in order to decrease electromagnetic interference.

Abstract: A package assembly can include: a die electrically connected to outer pins of the package assembly; an electronic component located above the die and electrically connected to the die, wherein the electronic component is connected to the outer pins of the package assembly through conductive pillars; and a heat dissipation structure located between the die and the electronic component to facilitate heat dissipation of the electronic component, where the heat dissipation structure physically isolates the die and the electronic component such that electromagnetic interference from the electronic component to the die is substantially prevented.

Abstract: A laminated transformer can include: a plurality of magnetic layers; a plurality of coil layers including a primary coil having a first type of coil layer, and a secondary coil having a second type of coil layer, where each coil layer is laminated between a pair of the plurality of magnetic layers; and a plurality of non-magnetic layers, where a first of the plurality of non-magnetic layers is disposed between an adjacent pair of the coil layers in order to increase a coupling coefficient between the primary and secondary coils.

Abstract: A power supply system includes a digital power manager and multiple power blocks each conveying regulated power to a respective load. The power blocks include the power part of non-isolated DC/DC converters, signal sampling and conversion circuits to provide analog voltage signal representing output voltage, output current, temperature, etc., and driving circuits to receive pulse width modulation (PWM) signals and drive switching devices. Closed-loop voltage control and protection functions for the power blocks are integrated into the digital power. The digital power manager includes a non-volatile memory containing registers, including a digital power manager configuration register, a power block set-up register, and a power block monitor register, as well as a user-definable space.

Abstract: A power supply system includes a digital power manager and multiple power blocks each conveying regulated power to a respective load. The power blocks include the power part of non-isolated DC/DC converters, signal sampling and conversion circuits to provide analog voltage signal representing output voltage, output current, temperature, etc., and driving circuits to receive pulse width modulation (PWM) signals and drive switching devices. Closed-loop voltage control and protection functions for the power blocks are integrated into the digital power. The digital power manager includes a non-volatile memory containing registers, including a digital power manager configuration register, a power block set-up register, and a power block monitor register, as well as a user-definable space.