Patents by Inventor Jiakai YANG

Jiakai YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10497897
    Abstract: A patch packaging method and device are provided. The method includes sucking, by a suction mechanism, a loaded cover plate; carrying, by the suction mechanism, the cover plate to move in a direction toward a cavity of a patch packaging mechanism, wherein a substrate to be attached with a patch is placed within the cavity; placing, by the suction mechanism, the cover plate into the cavity, wherein the cover plate, the substrate and side walls of the cavity form an enclosed chamber; extracting, by an air-extraction mechanism, air from the enclosed chamber via an air-outlet hole arranged in the side walls; supplying, by a gas-supply mechanism, a light gas having a density lower than that of the air into the enclosed chamber via a gas-inlet hole arranged in the side walls; and pressing, by a pressing mechanism, the enclosed chamber in such a manner that the cover plate is completely pressed onto the substrate after the light gas is extracted.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: December 3, 2019
    Assignees: BOE TECHNOLOGY GROP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yangkun Jing, Qing Liu, Liangshi Li, Jiakai Yang, Guanghe Ma
  • Publication number: 20180047937
    Abstract: A patch packaging method and device are provided. The method includes sucking, by a suction mechanism, a loaded cover plate; carrying, by the suction mechanism, the cover plate to move in a direction toward a cavity of a patch packaging mechanism, wherein a substrate to be attached with a patch is placed within the cavity; placing, by the suction mechanism, the cover plate into the cavity, wherein the cover plate, the substrate and side walls of the cavity form an enclosed chamber; extracting, by an air-extraction mechanism, air from the enclosed chamber via an air-outlet hole arranged in the side walls; supplying, by a gas-supply mechanism, a light gas having a density lower than that of the air into the enclosed chamber via a gas-inlet hole arranged in the side walls; and pressing, by a pressing mechanism, the enclosed chamber in such a manner that the cover plate is completely pressed onto the substrate after the light gas is extracted.
    Type: Application
    Filed: April 29, 2016
    Publication date: February 15, 2018
    Applicants: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yangkun JING, Qing LIU, Liangshi LI, Jiakai YANG, Guanghe MA