Patents by Inventor Jiale WU

Jiale WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Information processing method, device, apparatus and system, medium, andprogram
    Patent number: 11928449
    Abstract: An embodiment of the present application discloses an information processing method, device and apparatus, a medium, and a program.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 12, 2024
    Assignees: CHINA MOBILE (SUZHOU) SOFTWARE TECHNOLOGY CO., LTD., CHINA MOBILE COMMUNICATIONS GROUP CO., LTD.
    Inventors: Chunxiu Chen, Jiale Li, Jingkai Wu, Zhiling Hu
  • FULL CONTINUOUS-FLOW PREPARATION METHOD OF (+)-BIOTIN
    Publication number: 20230183260
    Abstract: A full continuous-flow preparation method of (+)-biotin, including: subjecting a cyclic anhydride and a chiral biphenyl propylene glycol to asymmetric ring-opening reaction to produce a first intermediate, which undergoes selective reduction with a borohydride and cyclization with an inorganic mineral acid to produce (3aS, 6aR)-lactone; subjecting the (3aS, 6aR)-lactone and a sulfenylating reagent to sulfenylation to produce (3aS, 6aR)-thiolactone, which undergoes Fukuyama coupling with a zinc reagent in the presence of a palladium catalyst and elimination reaction in the presence of an inorganic mineral acid to produce an alkenyl valerate compound; subjecting the alkenyl valerate compound to reduction in the presence of a Pd/C catalyst to produce a valerate ester, which undergoes hydrolysis to produce a valeric acid salt; and subjecting the valeric acid salt to debenzylation in the presence of an inorganic mineral acid to produce the target product (+)-biotin.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Fener CHEN, Dang CHENG, Jiale WU, Meifen JIANG, Li WAN, Jiaqi WANG
  • HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLY
    Publication number: 20220293488
    Abstract: A heat sink for an IC component and an IC heat sink assembly are provided. The heat sink for an IC component has a contact surface suitable for thermally contacting with the IC component. A groove is provided in the contact surface. The IC heat sink assembly includes: a heat sink for an IC component; an IC component thermally connected to the heat sink; and a thermally conductive interface material provided between the heat sink and the IC component.
    Type: Application
    Filed: August 7, 2020
    Publication date: September 15, 2022
    Inventors: Jinqiang CHU, Mieslinger ALEXANDER, Jiale WU, Huobing HUANG
  • MP53 RESCUE COMPONDS AND METHODS OF TREATING A P53 DISORDER
    Publication number: 20210205260
    Abstract: Novel mp53 rescue compounds and the pharmaceutical composition, and methods of treating a p53 disorder.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 8, 2021
    Inventors: Min LU, Jiale WU, Huaxin SONG
  • PANDA AS NOVEL THERAPEUTIC
    Publication number: 20210188930
    Abstract: Disclosed herein is a novel p53 complex and a collection of compounds that can tightly associate with p53 to efficiently rescue wildtype p53 structure and function, and the methods of making and using the complex and the compounds, including for diagnosis, prognosis, and treatment of p53 related disorders such as cancer and aging.
    Type: Application
    Filed: April 28, 2018
    Publication date: June 24, 2021
    Inventors: Min LU, Jiale WU, Huaxin SONG