Abstract: A train having a protection device with self-adaptive crashworthiness is disclosed, which relates to the technical field of safety protection of trains. The train includes multiple vehicles, a head vehicle is located at the head end of the train, and a head vehicle energy absorbing coupler mechanism is mounted at the front end of the head vehicle, each two adjacent vehicles are connected to each other by a middle vehicle energy absorbing coupler mechanism. An image acquisition mechanism and a radar detector are mounted at the head vehicle for monitoring whether there is an obstacle ahead the train, measuring distance and collision speed between the train and the obstacle, and for transmitting measured data to a processing center of the train, the processing center optimizes and adjusts impact force at the head vehicle energy absorbing coupler mechanism and the middle vehicle energy absorbing coupler mechanisms based on a collision situation.

Abstract: Various embodiments detect and manage target vegetation in vegetation areas, including crop beds, between crop beds, and turfgrasses. In one embodiment, a machine learning model is trained to detect target vegetation in captured images. An information processing system is programmed utilizing the machine learning model. One or more images of a particular area are captured, and target vegetation is detected within the one or more images. A position of the detected target vegetation is determined within the one or more images. An applicator disposed on an agrochemical applicator system that is mapped to the position of the detected target vegetation within the one or more images is determined. The applicator is activated based on a current speed of a vehicle coupled to the agrochemical applicator system, and further based on configuration data associated with the applicator. Activating the applicator selectively applies an agrochemical to the detected target vegetation.

Abstract: Various embodiments detect and manage target vegetation in vegetation areas, including crop beds, between crop beds, and turfgrasses. In one embodiment, a machine learning model is trained to detect target vegetation in captured images. An information processing system is programmed utilizing the machine learning model. One or more images of a particular area are captured, and target vegetation is detected within the one or more images. A position of the detected target vegetation is determined within the one or more images. An applicator disposed on an agrochemical applicator system that is mapped to the position of the detected target vegetation within the one or more images is determined. The applicator is activated based on a current speed of a vehicle coupled to the agrochemical applicator system, and further based on configuration data associated with the applicator. Activating the applicator selectively applies an agrochemical to the detected target vegetation.

Abstract: Techniques are disclosed herein for collecting objective activity data that represents the experiences and reactions of a viewer of content shared by a sales representative. The content may include a series of slides that include information regarding a product or service pitched by the sales representative to the viewer (e.g., a prospective customer). Objective activity data indicative of viewer interactions with the content can be generated by the scripting computer language codes and automatically uploaded to an analytics platform via one or more application programming interfaces. The analytics platform can apply one or more predictive modeling techniques to the objective activity data in order to measure the actual engagement of the viewer with the content shared by the sales representative.

Abstract: Disclosed is a method for grinding a spring with high quality and high efficiency, comprising the steps as follows: firstly, at least one of an upper grinding wheel (1) and a lower grinding wheel (2) is configured to comprise an inner grinding wheel (21) and an outer grinding wheel (24), wherein the inner grinding wheel (21) is fitted in the outer grinding wheel (24); the inner grinding wheel (21) or the outer grinding wheel (24) is driven by a transmission mechanism, the inner grinding wheel (21) and the outer grinding wheel (24) rotating in opposite directions; after a complete spring is fed to a space between the upper grinding wheel (1) and the lower grinding wheel (2), the complete spring is moved back and forth in the plane of the grinding wheels; and then the upper grinding wheel (1) is moved downwardly such that two end faces of the spring are ground by the grinding wheels, and when the height of the ground spring meets the requirement, the upper grinding wheel (1) is stopped moving downwardly and is

Abstract: Disclosed is a method for grinding a spring with high quality and high efficiency, comprising the steps as follows: firstly, at least one of an upper grinding wheel (1) and a lower grinding wheel (2) is configured to comprise an inner grinding wheel (21) and an outer grinding wheel (24), wherein the inner grinding wheel (21) is fitted in the outer grinding wheel (24); the inner grinding wheel (21) or the outer grinding wheel (24) is driven by a transmission mechanism, the inner grinding wheel (21) and the outer grinding wheel (24) rotating in opposite directions; after a complete spring is fed to a space between the upper grinding wheel (1) and the lower grinding wheel (2), the complete spring is moved back and forth in the plane of the grinding wheels; and then the upper grinding wheel (1) is moved downwardly such that two end faces of the spring are ground by the grinding wheels, and when the height of the ground spring meets the requirement, the upper grinding wheel (1) is stopped moving downwardly and is

Abstract: Integrated circuits with tungsten components having a smooth surface and methods for producing such integrated circuits are provided. A method of producing the integrated circuits includes forming a nucleation layer overlying a substrate and within a cavity, where the nucleation layer includes tungsten. A nucleation layer thickness is reduced, and a fill layer if formed overlying the nucleation layer.

Abstract: Integrated circuits with tungsten components having a smooth surface and methods for producing such integrated circuits are provided. A method of producing the integrated circuits includes forming a nucleation layer overlying a substrate and within a cavity, where the nucleation layer includes tungsten. A nucleation layer thickness is reduced, and a fill layer if formed overlying the nucleation layer.

Abstract: Integrated circuits with smooth metal gates and methods for fabricating integrated circuits with smooth metal gates are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a partially fabricated integrated circuit including a dielectric layer formed with a trench bound by a trench surface. The method deposits metal in the trench and forms an overburden portion of metal overlying the dielectric layer. The method includes selectively etching the metal with a chemical etchant and removing the overburden portion of metal.

Abstract: Contact structures and methods of fabricating contact structures of semiconductor devices are provided. One method includes, for instance: obtaining a substrate including a dielectric layer over the substrate; patterning the dielectric layer with at least one contact opening; providing a contact liner within the at least one contact opening in the dielectric layer; and filling the contact liner with a conductive material. In enhanced aspects, providing the contact liner within the at least one contact opening includes: depositing a first layer within the at least one contact opening in the dielectric layer; depositing a second layer over the first layer within the at least one contact opening; depositing at least one intermediate layer over the second layer within the at least one contact opening; and depositing a top layer over the at least one intermediate layer within the at least one contact opening.

Abstract: A conductive structure(s), such as a gate electrode(s) or a contact structure(s), and methods of fabrication thereof are provided. The conductive structure(s) includes a first conductive layer of a first conductive material, and a second conductive layer of a second conductive material. The second conductive layer is disposed over the first conductive layer, and at least a portion of the first conductive material includes grains having a size larger than a defined value, and at least a second portion of the second conductive material includes grains having a size less than the defined value. In one embodiment, the first and second conductive materials are the same conductive material, with different-sized grains.

Abstract: A conductive structure(s), such as a gate electrode(s) or a contact structure(s), and methods of fabrication thereof are provided. The conductive structure(s) includes a first conductive layer of a first conductive material, and a second conductive layer of a second conductive material. The second conductive layer is disposed over the first conductive layer, and at least a portion of the first conductive material includes grains having a size larger than a defined value, and at least a second portion of the second conductive material includes grains having a size less than the defined value. In one embodiment, the first and second conductive materials are the same conductive material, with different-sized grains.