Abstract: A shape follow-up support device for selective laser melting and a method thereof are provided. The device includes a lifting base, where the lifting base is provided with an inner cavity, and a top wall of the lifting base is provided with multiple first through holes communicated with the inner cavity of the lifting base, and the multiple first through holes are arranged at equal intervals. Multiple driving assemblies are arranged in the lifting base; output ends of the driving assemblies extend out of the lifting base through the first through holes and are provided with support rods, and protruding ends of the support rods are detachably connected with sacrificial assemblies. A porous substrate is provided with multiple second through holes, and the multiple second through holes are in one-to-one correspondence with the multiple first through holes and communicate with the multiple first through holes.