Patents by Inventor Jiamiao(John) Tang

Jiamiao(John) Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate with lossy material insert
    Patent number: 7714430
    Abstract: In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: May 11, 2010
    Assignee: Intel Corporation
    Inventors: Xiang Yin Zeng, Daoqiang (Daniel) Lu, Jiangqi He, Jiamiao(John) Tang
  • Substrate with lossy material insert
    Publication number: 20080102565
    Abstract: In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed.
    Type: Application
    Filed: September 28, 2006
    Publication date: May 1, 2008
    Inventors: Xiang Yin Zeng, Daoqiang (Daniel) Lu, Jiangqi He, Jiamiao (John) Tang