Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: A current sensor includes: four first uniaxial TMR chips and at least two second uniaxial TMR chips, each first uniaxial TMR chip and each second uniaxial TMR chip being located on the same virtual ring, wherein magnetic sensitive directions of the four first uniaxial TMR chips are perpendicular to a radius of the virtual ring, magnetic sensitive directions of two adjacent first uniaxial TMR chips are perpendicular to each other, magnetic sensitive directions of the two second uniaxial TMR chips are parallel to the radius of the virtual ring and opposite to each other, and the two second uniaxial TMR chips respectively have the same positions as two first uniaxial TMR chips; each first uniaxial TMR chip and each second uniaxial TMR chip are configured to collect a magnetic induction intensity, the magnetic induction intensity is configured to calculate a target current value of a to-be-measured wire.

Abstract: The present disclosure relates to an AC/DC closed-loop current sensor, including a magnetism gathering iron core, a TMR chip, a signal processing circuit, a signal generator, and a feedback coil. The TMR chip is arranged at an air gap of the magnetism gathering iron core and connected to the signal processing circuit. The signal processing circuit is connected to the signal generator. The feedback coil is wound around the magnetism gathering iron core and connected to the signal generator. The signal processing circuit is configured to select from the induced signal of the TMR chip and make an amplification to obtain a current signal component and send the current signal component to the signal generator. The signal generator is configured to adjust a current output to the feedback coil based on the current signal component, and output a measurement result of the selected current signal component.

Abstract: A monitoring system and a monitoring method for a planter includes a computer having an unit speed fusion module, a seeding flow rate monitoring module, and a decision module for theoretical rotation speed of a drive motor, a rotation speed deviation inference module, a controlling parameter tuning module, an adjusting module for rotation speed of a seeding shaft, a controlling module for rotation speed of seeding shaft and a positioning signal receiver fixed on a top of a cab for receiving a geographic position signal. The system monitors operating state parameters of the planter and accurately controls seed amount.

Abstract: A monitoring system for and a monitoring method for a planter includes a computer having an unit speed fusion module, a seeding flow rate monitoring module, and a decision module for theoretical rotation speed of a drive motor, a rotation speed deviation inference module, a controlling parameter tuning module, an adjusting module for rotation speed of a seeding shaft, a controlling module for rotation speed of seeding shaft; and a positioning signal receiver fixed on a top of a cab for receiving a geographic position signal. The system monitors operating state parameters of the planter and accurately controls seed amount.

Abstract: An LED explosion-proof light comprises a front casing, a light source support disposed at a center of a space enclosed by the front casing, and cooling plates disposed between the front casing and the light source support; the cooling plates are in railing shape; a power supply is electrically connected with light emitting components in the light source support. The light emitting components comprise: an LED chip integrally packaged on a front side of a metal base panel; back of the metal base panel is securely attached to a light source backing panel, and their contact surface is applied with high-performance cooling cream. Lens components are disposed at a front side of the LED chip.

Abstract: An LED explosion-proof light comprises a front casing, a light source stand disposed at a center of a space enclosed by the front casing, and cooling plates disposed between the front casing and the light source stand; the cooling plates are in railing shape; a power supply is electrically connected with light emitting components in the light source stand. The light emitting components comprise: an LED chip integrally packaged on a front side of a metal base panel; back of the metal base panel is securely attached to a light source backing panel, and their contact surface is applied with high-performance cooling cream. Lens components are disposed at a front side of the LED chip.