Abstract: Examples of the present application disclose a semiconductor device and a fabrication method thereof and a memory system. The semiconductor device includes: a stack structure including first regions and second regions; channel structures that are located in the first regions and penetrate through the stack structure along a first direction; and gate line isolation structures that are located in the second regions and extend along a second direction, wherein the gate line isolation structures penetrate through the stack structure along the first direction and are in a concavo-convex shape along a third direction.

Abstract: A monitoring system and a monitoring method for a planter includes a computer having an unit speed fusion module, a seeding flow rate monitoring module, and a decision module for theoretical rotation speed of a drive motor, a rotation speed deviation inference module, a controlling parameter tuning module, an adjusting module for rotation speed of a seeding shaft, a controlling module for rotation speed of seeding shaft and a positioning signal receiver fixed on a top of a cab for receiving a geographic position signal. The system monitors operating state parameters of the planter and accurately controls seed amount.

Abstract: A monitoring system for and a monitoring method for a planter includes a computer having an unit speed fusion module, a seeding flow rate monitoring module, and a decision module for theoretical rotation speed of a drive motor, a rotation speed deviation inference module, a controlling parameter tuning module, an adjusting module for rotation speed of a seeding shaft, a controlling module for rotation speed of seeding shaft; and a positioning signal receiver fixed on a top of a cab for receiving a geographic position signal. The system monitors operating state parameters of the planter and accurately controls seed amount.

Abstract: An LED explosion-proof light comprises a front casing, a light source support disposed at a center of a space enclosed by the front casing, and cooling plates disposed between the front casing and the light source support; the cooling plates are in railing shape; a power supply is electrically connected with light emitting components in the light source support. The light emitting components comprise: an LED chip integrally packaged on a front side of a metal base panel; back of the metal base panel is securely attached to a light source backing panel, and their contact surface is applied with high-performance cooling cream. Lens components are disposed at a front side of the LED chip.

Abstract: An LED explosion-proof light comprises a front casing, a light source stand disposed at a center of a space enclosed by the front casing, and cooling plates disposed between the front casing and the light source stand; the cooling plates are in railing shape; a power supply is electrically connected with light emitting components in the light source stand. The light emitting components comprise: an LED chip integrally packaged on a front side of a metal base panel; back of the metal base panel is securely attached to a light source backing panel, and their contact surface is applied with high-performance cooling cream. Lens components are disposed at a front side of the LED chip.