Abstract: Disclosed is a high-precision dynamic real-time 360-degree omnidirectional point cloud acquisition method based on fringe projection. The method comprises: firstly, by means of the fringe projection technology based on a stereoscopic phase unwrapping method, and with the assistance of an adaptive dynamic depth constraint mechanism, acquiring high-precision three-dimensional (3D) data of an object in real time without any additional auxiliary fringe pattern; and then, after a two-dimensional (2D) matching points optimized by the means of corresponding 3D information is rapidly acquired, by means of a two-thread parallel mechanism, carrying out coarse registration based on Simultaneous Localization and Mapping (SLAM) technology and fine registration based on Iterative Closest Point (ICP) technology.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: A current sensor includes: four first uniaxial TMR chips and at least two second uniaxial TMR chips, each first uniaxial TMR chip and each second uniaxial TMR chip being located on the same virtual ring, wherein magnetic sensitive directions of the four first uniaxial TMR chips are perpendicular to a radius of the virtual ring, magnetic sensitive directions of two adjacent first uniaxial TMR chips are perpendicular to each other, magnetic sensitive directions of the two second uniaxial TMR chips are parallel to the radius of the virtual ring and opposite to each other, and the two second uniaxial TMR chips respectively have the same positions as two first uniaxial TMR chips; each first uniaxial TMR chip and each second uniaxial TMR chip are configured to collect a magnetic induction intensity, the magnetic induction intensity is configured to calculate a target current value of a to-be-measured wire.

Abstract: The present disclosure relates to an AC/DC closed-loop current sensor, including a magnetism gathering iron core, a TMR chip, a signal processing circuit, a signal generator, and a feedback coil. The TMR chip is arranged at an air gap of the magnetism gathering iron core and connected to the signal processing circuit. The signal processing circuit is connected to the signal generator. The feedback coil is wound around the magnetism gathering iron core and connected to the signal generator. The signal processing circuit is configured to select from the induced signal of the TMR chip and make an amplification to obtain a current signal component and send the current signal component to the signal generator. The signal generator is configured to adjust a current output to the feedback coil based on the current signal component, and output a measurement result of the selected current signal component.

Abstract: A method for preparing aluminum foam sandwich material by rotating friction extrusion and electromagnetic pulse hybrid process includes: step 1: preparing the filler; step 2: processing the filler to prepare a plurality of preforms; step 3: clamping and fixing the plurality of preforms to form a preform assembly; step 4: welding the panel on the surface of the preform assembly to form an non-foaming sandwich material; step 5: heating and foaming the non-foaming sandwich material through a foaming mold; step 6: insulating the foaming mold after completion of foaming; injecting cooling water into the foaming mold after completion of insulation to maintain pressure and shape, forming the aluminum foam sandwich material of the required shape. The aluminum foam sandwich material produced by this method has good interface bonding, no adverse interface reaction, high bending resistance, impact resistance, and excellent sound absorption and insulation properties.

Abstract: Embodiments disclosed herein relate to the field of plant molecular biology, specifically to DNA constructs for conferring insect resistance to a plant. Embodiments disclosed herein relate to insect resistant corn plant containing event DP-910521-2, and to assays for detecting the presence of event DP-910521-2 in samples and compositions thereof.