Abstract: An improved structure of a uniform thermal conductive heat dissipation device, having a thermal conductor and a plurality of heat pipes. The thermal conductor includes a convex body member, on which a plurality of parallel connecting parts is formed to allow the heat pipes embedded therein. Each of the heat pipes has a wick structure and a working fluid therein. Each heat pipe has a heat absorbing portion and a heat dissipation portion. The heat absorption portion is closely in contact with the thermal conductor. Thereby, each of the heat is subject to the same amount of heat to result in a uniform thermal conduction and dissipation effect.

Abstract: A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one rim and a hooking projection on an opposite rim. The metallic fins thereby assemble with one another by engagement of the hooking projection of one fin with the groove of one neighboring fin. Below the first folded edge, each fin further forms an inclined edge. The second folded edges of the fins are further in contact with a highly thermal conductive body. With the metallic fins being assembled with one another, a plurality of gaps are constituted between their inclined edges. Via a fan, the air circulation through the gaps is thereby promoted to rapidly dissipate the heat and prevent the hothouse effect.