Abstract: An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.

Abstract: An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.

Abstract: An oxygen generator includes a bag body and supporting components. The bag body is configured to contain a reactive liquid, a reactant and a catalyst, and the bag body includes a bag piece, a circumferential sealing part and separation parts. The circumferential sealing part is bound with a part of the periphery of the bag piece, so as to define a range of an inner space, and a range of the rest part of the periphery of the bag piece defines an opening. Both ends of each separation part are connected to the circumferential sealing part so as to separate the inner space into a plurality of separate spaces, and the plurality of separate spaces respectively contain the reactant and the catalyst. The supporting components are contained in one of the plurality of separate spaces, and the positions, corresponding to the supporting components, of the bag body are incompressible.

Abstract: An oxygen generator includes a bag body and supporting components. The bag body is configured to contain a reactive liquid, a reactant and a catalyst, and the bag body includes a bag piece, a circumferential sealing part and separation parts. The circumferential sealing part is bound with a part of the periphery of the bag piece, so as to define a range of an inner space, and a range of the rest part of the periphery of the bag piece defines an opening. Both ends of each separation part are connected to the circumferential sealing part so as to separate the inner space into a plurality of separate spaces, and the plurality of separate spaces respectively contain the reactant and the catalyst. The supporting components are contained in one of the plurality of separate spaces, and the positions, corresponding to the supporting components, of the bag body are incompressible.

Abstract: An oxygen generation apparatus of the first embodiment includes an outer container, a container lid, a piercing member, and an inner container. An annular flange is formed inside the inner container, and a surface of the annular flange is provided with two sealing films to accommodate an oxygen generating agent. The piercing member may move from a first position to a second position relative to the container lid, so as to break the sealing films to mix the oxygen generating agents to generate oxygen; an oxygen generation apparatus of the second embodiment includes two inner containers, where an annular flange is formed on one inner container to dispose a sealing film to accommodate an oxygen generating agent, a bottom surface of another inner container is provided in a concave manner with an accommodation space which accommodates the piercing member.

Abstract: The invention is related to a fluid dynamic bearing design, wherein inner wall of bearing or surface of shaft is made with inner grooves having self-lubricating functions to effect radial pressure waves according to stable bearing operating requirements as well as working and assembly methods. Embodiments of said inner grooves include seal, open and re-circulation types, wherein seal type inner grooves reduces overflow of lubricants, while open type rifling grooves and re-circulation type grooves allows for recirculation of lubricating fluid to promote rotational stability of the shaft.

Abstract: A pressing method for sealing a heat pipe includes steps of providing a tube material or sheet material with/without an intermediate material, pressing by a pair of pressing molds, wherein a plurality of protrusions are formed on at least one of the pressing surface of the pair of the pressing molds. The protrusion pattern of the pressing surface of the pressing molds used in the present pressing method is for enhancing the sealing strength of the heat pipe.

Abstract: A heat pipe has a wick of capillary structure formed on the inner wall of the heat pipe so as to form a working fluid path in the heat pipe, wherein the wick of the capillary structure is un-ringlike or various radially. The cross-section of the working fluid path in the heat pipe is in various shapes, such as in a shape of polygon, poly-petal, poly-serration, arc or semicircle. Thus, the thickness of the capillary wick structure on the inner wall of the heat pipe is various due to the shape of the working fluid path.

Abstract: A flexible metal heat pipe coated or covered with a layer of plastic material to provide the heat pipe the flexibility required in a process to bend the heat pipe without damaging the heat pipe due to over-concentrated stress at a particular section of the heat pipe.

Abstract: A panel-type radiating system includes a panel being provided on at least one side with a plurality of fins, and a plurality of heat conducting tubes having a heat-dissipating end and a heat-absorbing end each. The heat-dissipating ends of the heat conducting tubes are connected to the fins, and are located at a level higher than that of the heat-absorbing ends. With these arrangements, the panel-type radiating system is able to provide the maximum radiating effect via a large-area panel and maintain the panel at a uniform temperature.

Abstract: A method of assembly an integrated circuit die to a heat sink by first providing a lead frame that has a die-attach paddle portion having a top surface, a bottom surface, and an opening therethrough, positioning a heat sink having a raised portion on its top surface abutting the bottom surface of the die-attach paddle portion, and then frictionally engaging the heat sink and the die-attach paddle together and bonding an integrated circuit chip to the top surface of the heat sink with an adhesive material sandwiched therein between such that the assembly can be placed in a mold apparatus for forming a plastic encapsulated package.

Abstract: A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture therethrough, positioning a heat sink abutting the bottom surface of the die paddle portion, and then pressing an integrated circuit die against the top surface of the die paddle portion with an adhesive material sandwiched therein between such that the adhesive flows through at least one aperture in the die paddle portion to bond the integrated circuit die and the heat sink together.

Abstract: A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture therethrough, positioning a heat sink abutting the bottom surface of the die paddle portion, and then pressing an integrated circuit die against the top surface of the die paddle portion with an adhesive material sandwiched therein between such that the adhesive flows through at least one aperture in the die paddle portion to bond the integrated circuit die and the heat sink together.

Abstract: Apparatus for measuring the heat produced by a circuit module that is mounted on a circuit board has a tubular housing of a thermally resistive material such as plastic that is adapted to be placed over the module so that substantially all of the heat from the module flows along the axis of the housing, A thermal resistance is located between two metal partitions in the housing. The temperature drop through the resistance is calculated from the temperatures of the two partitions and the heat is calculated from the temperature drop and the value thermal resistance, The apparatus is adapted to make good thermal contact with the top of the module and cooling apparatus is provided for cooling the upper one of the two partitions. The upper partition is adjustable to vary the length of the thermal resistance in order to keep the temperature drop around 2.degree. C. for modules of different power ratings.

Abstract: An enclosure is described for housing a personal computer. The natural convection system of the present invention for dissipating heat generated by the electronic components of a personal computer consists of a housing defining a cavity containing the electronic components. The major heat-producing components, such as the power supply of the computer and power transistors, are positioned at the top front of the cavity. The components are attached to a heat sink. A typical computer has a master printed circuit board. Additional printed circuit boards are plugged into the master printed circuit board. Further additional printed circuit boards may be added at any time to enhance the functionality of the computer. Therefore, plugging in additional printed circuit boards should be a simple operation. In the present invention, the master printed circuit board is attached to a side in the rear of the cavity. Other printed circuit boards are attached vertically and perpendicularly to the master printed circuit board.