Abstract: An energy storage device can include a cathode, an anode, and a separator between the cathode and the anode, and an electrolyte where the electrolyte includes one or more additives and/or solvent components selected from vinylene carbonate (VC), vinyl ethylene carbonate (VEC), dimethylacetamide (DMAc), hydro fluorinated ether branched cyclic carbonate, a hydro fluorinated ether ethylene carbonate (HFEEC), hydro fluorinated ether (HFE), and fluorinated ethylene carbonate (FEC). The electrolyte may include a carbonate based solvent and one or more solvent components and/or one or more of vinylene carbonate (VC), vinyl ethylene carbonate (VEC), dimethylacetamide (DMAc), hydro fluorinated ether branched cyclic carbonate, a hydro fluorinated ether ethylene carbonate (HFEEC), hydro fluorinated ether (HFE), and fluorinated ethylene carbonate (FEC).

Abstract: A small format lithium-ion battery cell pre-lithiation assembly includes an enclosure having a first portion corresponding to a first battery cell terminal and a second portion corresponding to a second battery cell terminal. The assembly also includes an electrical insulator contacting the first portion and the second portion, a first lithium metal foil disposed in the enclosure and abutting the first portion, and a second lithium metal foil disposed in the enclosure and abutting the second portion. The assembly also includes an electrode assembly disposed in the enclosure between the first lithium metal foil and the second lithium metal foil.

Abstract: A movable medical bed system may include a bed body and a power supply apparatus. The power supply apparatus may include an electrical energy receiver and an electrical energy transmitter. The electrical energy receiver is arranged on the bed body. The electrical energy transmitter is configured to be connected to a power source. The bed body is able to move to a working position relative to the electrical energy transmitter. When the bed body is located at the working position, the electrical energy receiver can engage in electrical energy transmission with the electrical energy transmitter without plugging-in. The movable medical bed system helps to make the supply of power more convenient.

Abstract: A package component includes a first substrate and a first conductive layer. The first substrate has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed over the first surface of the first substrate. The first conductive layer includes a first conductive feature and a second conductive feature over the first conductive feature. The second conductive features covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the second conductive feature. The first substrate includes a single-sided or a double-sided copper-clad laminate.

Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.

Abstract: A drainage switch that can be used to extract and clean impurities is provided, which is mainly equipped with a set of elastic water stop plugs. The elastic water stop plug is composed of a main body around with elastic blocks, a pressure positioning piece, a lifting piece, and springs that are arranged inside the shaft tube of the main body, and a plug cap that is locked in the pressure positioning piece. The elastic blocks can be elastically against with a water pipe, so that the elastic water stop plug can be elastically clamped in a water pipe, which is easy to install and replace, and easy to take out and clean dirt.

Abstract: The method for co-sintering transformer includes the following steps: a preparation step providing a copper conductor strip and an iron core; a coating step applying a layer of nickel coating, or a layer of precious metal coating, or both on the copper conductor strip from the preparation step; an assembly step putting the copper conductor strip from the coating step and the iron core from the preparation step together to form a transformer; a pressing step pressing the assembled copper conductor strip and the iron core from the assembly step, together with iron power, in a mold into an integrally formed transformer; and a sintering step sintering the pressed transformer from the pressing step in an atmospheric environment. The present method is able to conduct sintering directly under the atmospheric environment without reducing oxygen content. Iron powder also exhibits improved characteristics after sintering in the atmospheric environment.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A battery pre-lithiation assembly includes an anode having first holes and a cathode having second holes. The first holes and the second holes are configured to enable an electrolyte to pass therethrough. Further, the first holes and the second holes are configured to enable movement of Li+ ions associated with the lithium metal during a pre-lithiation process. The lithium metal may be coated on the anode (e.g., on active material of the anode), or the lithium metal may correspond to at least one lithium metal electrode, such as first and second lithium metal electrodes disposed on opposing sides of an electrode stack (e.g., a jelly roll) including the anode, the cathode, and a separator.

Abstract: The present invention provides novel compounds which activate the Kv7 potassium channels. Separate aspects of the invention are directed to pharmaceutical compositions comprising said compounds and uses of the compounds to treat disorders responsive to the activation of Kv7 potassium channels.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A bi-directional and multi-channel optical module incudes a casing, an optical transmitter assembly, an optical receiver assembly and an optical fiber adaptor. The optical transmitter assembly is disposed in an accommodation space of the casing. The optical transmitter assembly includes a plurality of light emission units and a wavelength division multiplexer disposed corresponding to the plurality of light emission units. The optical receiver assembly is disposed in the accommodation space. The optical receiver assembly includes a plurality of light receiving units and a wavelength demultiplexer disposed corresponding to the plurality of light receiving units. The optical fiber adaptor is disposed on the casing.

Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.

Abstract: This application describes examples of a differential device, a powertrain, and a vehicle. In one example, the differential device includes a housing, three planetary gears, two side gears, and at least one window. Each of the three planetary gears is mounted on an inner wall of the housing through a pin shaft, the three planetary gears are disposed spaced from each other along a circumferential direction of the housing. The two side gears are disposed on two sides of the three planetary gears along the axial direction of the housing and meshed with the three planetary gears. The main reduction gear drives the housing to rotate around the axial direction of the housing, so that the three planetary gears drive the two side gears to drive two drive shafts respectively.

Abstract: A computer peripheral device is provided. The computer peripheral device is adapted to be installed in an electronic device supporting signal transmission of a first signal frequency. The computer peripheral device includes a human interface device (HID) and a bridging device. The HID includes a control unit to support signal transmission of a second signal frequency. The bridging device includes a first universal serial bus (USB) interface unit and a second USB interface unit. The first USB interface unit is adapted to be electrically connected to the electronic device, and supports signal transmission of the first signal frequency. The second USB interface unit is adapted to be electrically connected to the HID. The second USB interface unit regards the HID as a communication device class (CDC) device, instructs the control unit to generate an input signal at a timing corresponding to the first signal frequency, and transmits the input signal to the electronic device.

Abstract: A bi-directional and multi-channel optical module incudes an encapsulation casing, a TOSA, a plurality of ROSAs and a plurality of optical folding elements. The TOSA is accommodated in the encapsulation casing. The TOSA includes a light emitting element and a thin film LiNbOx modulator, and a light receiving end of the thin film LiNbOx modulator is optically coupled with the light emitting element. The ROSAs are accommodated in the encapsulation casing. The ROSAs are configured to receive external optical signals propagating into the encapsulation casing. The optical folding elements are optically coupled with a plurality of light propagation ends of the thin film LiNbOx modulator, respectively, for changing a traveling direction of light emitted by the TOSA. Each of the optical folding elements is configured to enable one of the ROSAs share a fiber access terminal with the TOSA.

Abstract: A semiconductor arrangement includes a heat source above an interconnect layer and below a heat conductor. The heat conductor is coupled to a heat sink by a thermally conductive bonding layer. Heat from the heat source is conducted through the heat conductor in a direction opposite the direction of the interconnect layer, through the thermally conductive bonding layer, and to a heat sink. The heat conductor includes an arrangement of dielectric layers, dummy metal layers, and dummy VIA layers.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A semiconductor arrangement includes a heat source above an interconnect layer and below a heat conductor. The heat conductor is coupled to a heat sink by a thermally conductive bonding layer. Heat from the heat source is conducted through the heat conductor in a direction opposite the direction of the interconnect layer, through the thermally conductive bonding layer, and to a heat sink. The heat conductor includes an arrangement of dielectric layers, dummy metal layers, and dummy VIA layers.

Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.