Abstract: A bi-directional and multi-channel optical module incudes an encapsulation casing, a TOSA, a plurality of ROSAs and a plurality of optical folding elements. The TOSA is accommodated in the encapsulation casing. The TOSA includes a light emitting element and a thin film LiNbOx modulator, and a light receiving end of the thin film LiNbOx modulator is optically coupled with the light emitting element. The ROSAs are accommodated in the encapsulation casing. The ROSAs are configured to receive external optical signals propagating into the encapsulation casing. The optical folding elements are optically coupled with a plurality of light propagation ends of the thin film LiNbOx modulator, respectively, for changing a traveling direction of light emitted by the TOSA. Each of the optical folding elements is configured to enable one of the ROSAs share a fiber access terminal with the TOSA.

Abstract: An optical module configuration includes a circuit board and a transmitter optical subassembly. The circuit board includes an accommodation through opening. The transmitter optical subassembly includes a light emitting unit and a thin film LiNbOx modulator. The thin film LiNbOx modulator is optically coupled with the light emitting unit, and the thin film LiNbOx modulator is disposed in the accommodation through opening. The accommodation through opening allows placement of various thin film LiNbOx modulators supportive of different optical module specifications.

Abstract: A bidirectional optical module includes a TOSA, a ROSA and an optical filter. The TOSA includes a light emitting unit and a thin film LiNbOx modulator, and the thin film LiNbOx modulator is optically coupled with the light emitting unit. The ROSA is connected with the TOSA. The optical filter is provided for a fiber port which the TOSA shares with the ROSA.

Abstract: A multi-channel parallel optical communication module includes a casing having an airtight cavity, an optical communication assembly accommodated in the airtight cavity, and a temperature controller in thermal contact with the optical communication assembly. The optical communication assembly includes a plurality of optical communication units disposed at same level, and a number of the plurality of optical communication units is greater than four.

Abstract: A multi-channel light emitting module includes a base, at least one light emitting unit provided on the base, an optical modulation chip provided on the base, and an optical transmission component. The optical modulation chip includes an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure. The thin film LiNbOx modulator is optically coupled with the at least one light emitting unit, and the light emitting unit is provided outside the encapsulation structure. The optical transmission component is optically coupled with the thin film LiNbOx modulator.

Abstract: An optical module includes a housing, a plurality of active optical components and a path changer component. The housing has an airtight chamber. The active optical components are provided in the airtight chamber. The path changer component is provided in the airtight chamber, and the path changer component is configured to change an optical path of at least one of the active optical components.

Abstract: Related to an optical communication module, the optical communication module comprises a main body, an optical communication assembly and a second circuit board. The main body comprises a housing and a first circuit board disposed on the housing. The housing and the first circuit board together form an airtight cavity of the main body, and the first circuit board comprises two first electric interfaces. The optical communication assembly is accommodated in the airtight cavity and comprises a substrate, an optical communication element and a second electric interface. The optical communication element disposed on the substrate. One of the two first electric interfaces of the first circuit board is electrically connected to the second electric interface. The second circuit board comprises a third electric interface and the other one of the two first electric interfaces of the first circuit board is electrically connected to the third electric interface.

Abstract: A multi-channel light emitting module includes a base, at least one light emitting unit provided on the base, an optical modulation chip provided on the base, and an optical transmission component. The optical modulation chip includes an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure. The thin film LiNbOx modulator is optically coupled with the at least one light emitting unit, and the light emitting unit is provided outside the encapsulation structure. The optical transmission component is optically coupled with the thin film LiNbOx modulator.

Abstract: A multi-channel wavelength division multiplexing light emitting device includes a casing and an optical communication assembly accommodated in the casing. The optical communication assembly includes a substrate, a plurality of first light emitting units disposed on the substrate, a plurality of second light emitting units disposed on the substrate, a first wavelength division multiplexer, and a second wavelength division multiplexer. The first light emitting units are arranged to correspond with the first wavelength division multiplexer. The second light emitting units are arranged to correspond with the second wavelength division multiplexer.

Abstract: A multi-channel parallel optical communication module includes a casing having an airtight cavity, an optical communication assembly accommodated in the airtight cavity, and a temperature controller in thermal contact with the optical communication assembly. The optical communication assembly includes a plurality of optical communication units disposed at same level, and a number of the plurality of optical communication units is greater than four.

Abstract: A multi-channel wavelength division multiplexing light emitting device includes a casing and an optical communication assembly accommodated in the casing. The optical communication assembly includes a substrate, a plurality of first light emitting units disposed on the substrate, a plurality of second light emitting units disposed on the substrate, a first wavelength division multiplexer, and a second wavelength division multiplexer. The first light emitting units are arranged to correspond with the first wavelength division multiplexer. The second light emitting units are arranged to correspond with the second wavelength division multiplexer.

Abstract: An optical emitting device includes a base, a thermoelectric cooler, an optical communication assembly and a circuit board. The base includes a main body and a stem connected with each other. The stem extends from a basal surface of the main body, and a normal of a supporting surface of the stem is non-parallel to a normal of the basal surface of the main body. The thermoelectric cooler is disposed on the supporting surface of the stem. The optical communication assembly is disposed on the thermoelectric cooler, and the thermoelectric cooler is between the optical communication assembly and the stem. The circuit board is disposed on the base and passes through the main body and electrically connected with the optical communication assembly.

Abstract: Related to an optical communication module, the optical communication module comprises a main body, an optical communication assembly and a second circuit board. The main body comprises a housing and a first circuit board disposed on the housing. The housing and the first circuit board together form an airtight cavity of the main body, and the first circuit board comprises two first electric interfaces. The optical communication assembly is accommodated in the airtight cavity and comprises a substrate, an optical communication element and a second electric interface. The optical communication element disposed on the substrate. One of the two first electric interfaces of the first circuit board is electrically connected to the second electric interface. The second circuit board comprises a third electric interface and the other one of the two first electric interfaces of the first circuit board is electrically connected to the third electric interface.

Abstract: The present disclosure discloses a high speed optical module having a PCBA component and a passive optical element. The PCBA component includes a receiver and a transmitter. The transmitter includes an amplifier chip and a photodiode array connected to pins of the amplifier chip. The transmitter includes a laser driving chip and a base. Multiple lasers are arranged side by side in the base. The lasers are connected to the laser driving chip. A plurality of fiber interfaces are arranged on output light paths corresponding to the plurality of lasers. The passive optical element includes ferrules corresponding to the plurality of fiber interfaces, and the ferrules are correspondingly inserted into the plurality of fiber interfaces in a one-to-one relationship. The passive optical element is inserted into the PCBA component by fiber interfaces arranged on the PCBA component.

Abstract: The present disclosure provides a multi-channel parallel optical receiving device, including a carrier, a light receiving chip, a plurality of optoelectronic diodes disposed on a top surface of an end of the carrier, an optical fiber connector disposed in another end of the carrier, and an arrayed waveguide grating disposed on the top surface of the carrier. The plurality of optoelectronic diodes is electrically connected to the light receiving chip, and an input end of the arrayed waveguide grating is connected to the optical fiber connector for receiving an optical signal from the optical fiber. The optical signals are divided into multi-channel optical signals in parallel. The top surface of an output end of the arrayed waveguide grating is at a predetermined angle, causing the multi-channel optical signals to be reflected by the top surface and to photosensitive surfaces of the optoelectronic diodes arranged in parallel.

Abstract: The present disclosure discloses a high speed optical module having a PCBA component and a passive optical element. The PCBA component includes a receiver and a transmitter. The transmitter includes an amplifier chip and a photodiode array connected to pins of the amplifier chip. The transmitter includes a laser driving chip and a base. Multiple lasers are arranged side by side in the base. The lasers are connected to the laser driving chip. A plurality of fiber interfaces are arranged on output light paths corresponding to the plurality of lasers. The passive optical element includes ferrules corresponding to the plurality of fiber interfaces, and the ferrules are correspondingly inserted into the plurality of fiber interfaces in a one-to-one relationship. The passive optical element is inserted into the PCBA component by fiber interfaces arranged on the PCBA component.

Abstract: The present disclosure provides a multi-channel parallel optical transceiver module. The disclosed optical transceiver module/device may include a shell body and a circuit board located in the shell body, and an optical emitter base soldered to a first end of the circuit board. A notch located on the base, for engaging the first end of the circuit board, and the optical emitter base engaged with the first end of the circuit board may be soldered to two sides of the circuit board. The optical emitters may be disposed in parallel on the base, and separated from each other by a block. A lens and a laser may be disposed at a first side of each of the optical emitters that is adjacent to the circuit board, and an optical monitor may be disposed on a second end of the circuit board adjacent to the laser.

Abstract: A multi-channel laser device with a fiber array includes a housing and a ferrule. In the housing, laser components are arranged side by side, and each of the laser components is connected to a fiber array module through an optical isolator. The fiber array module includes thermal expanded fibers, and fibers out of the fiber array module are collected by the ferrule. The laser components are disposed on the same module board, and laser light radiated from the front end of a laser chip in each of the laser components is projected onto the optical isolator through a convex lens and then enters into the thermal expanded fiber. Such a structure may reach a relatively-high coupling efficiency and implement the coupling of arrayed laser components.

Abstract: A light emission module includes a base, a laser diode driver, a laser diode and a monitor photodiode. The laser diode driver, the laser diode and the monitor photodiode are disposed on the base. The monitor photodiode and the laser diode are located close to a front end of the laser diode driver. A rear side of the laser diode facing the front end of the laser diode driver. A end surface at the front end of the laser diode driver, a side surface at the rear side of the laser diode and a light receiving surface of the monitor photodiode are arranged in a triangle shape for reflecting a light emitted from the rear side of the laser diode to the light receiving surface of the monitor photodiode by the end surface of the laser diode driver.

Abstract: The present disclosure provides a multi-channel parallel optical receiving device, including a carrier, a light receiving chip, a plurality of optoelectronic diodes disposed on a top surface of an end of the carrier, an optical fiber connector disposed in another end of the carrier, and an arrayed waveguide grating disposed on the top surface of the carrier. The plurality of optoelectronic diodes is electrically connected to the light receiving chip, and an input end of the arrayed waveguide grating is connected to the optical fiber connector for receiving an optical signal from the optical fiber. The optical signals are divided into multi-channel optical signals in parallel. The top surface of an output end of the arrayed waveguide grating is at a predetermined angle, causing the multi-channel optical signals to be reflected by the top surface and to photosensitive surfaces of the optoelectronic diodes arranged in parallel.