Patents by Inventor Jianhua Xu

Jianhua Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12295153
    Abstract: The present application discloses a method for manufacturing a metal gate of a PMOS, comprising: step 1, forming a P-type work function metal layer; step 2, depositing an N-type work function metal layer by means of a PVD process, wherein over a bottom surface of a gate trench, the N-type work function metal layer has a hill profile; step 3, forming a first top barrier metal sublayer by means of a conformal growth process, wherein the first top barrier metal sublayer completely fills a sharp corner area of the N-type work function metal layer at a corner of the gate trench; step 4, growing a second top barrier metal sublayer by means of a PVD bombardment process; step 5, forming a third top barrier metal sublayer and a fourth top barrier metal sublayer; and step 6, forming a metal conductive material layer.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: May 6, 2025
    Assignee: Shanghai Huali Integrated Circuit Corporation
    Inventors: Zhaoqin Zeng, Yu Zhang, Jingxun Fang, Yu Bao, Jianhua Xu
  • Publication number: 20240162988
    Abstract: A system includes a baseband component, an optical transceiver component, a first pluggable radio frequency component, and a wireless head-end component. The baseband component is configured to provide a radio frequency signal to the first pluggable radio frequency component through the optical transceiver component. The optical transceiver component is connected to the first pluggable radio frequency component through an optical fiber. The first pluggable radio frequency component is connected to the wireless head-end component in a plugging manner.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 16, 2024
    Inventors: Jinxin Ge, Xiaoliang Gong, Jianhua Xu, Shuai Yuan, Chao Ren
  • Publication number: 20240117170
    Abstract: A composition for electroless plating comprises: from 9 to 29 weight percent, 9.7 to 29 weight percent, or 10 to 29 weight percent, of a first graft rubber copolymer which comprises the polymerized form of at least one conjugated diene monomer and at least one monovinyl aromatic monomer, from 70 to 90 weight percent, preferably 70-89.7 weight percent, more preferably 70 to 85 weight percent, of ungrafted styrenic polymer, from 0.1 to 10 weight percent of a core/shell diene-based rubber having particle size of 100 to 500 nanometers (nm), one or more of a stabilizer and/or antioxidant in total amount of from 0.1 to 5 weight percent, a fatty acid or a salt of fatty acid in an amount of from 0.1 to 2 weight percent, 0 to 5 weight percent of a mold release agent, 0 to 1 weight percent of a metal oxide, 0 to 3 weight percent of a lubricant, and 0 to 20 weight percent of polycarbonate wherein weight percent and ppm are based on total weight of the composition.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 11, 2024
    Inventors: Chen WAN, Stephen TAYLOR, Bing ZHOU, Jeffrey ESHENAUR, Robert Russell GALLUCCI, Jianhua XU
  • Publication number: 20230273672
    Abstract: This application discloses a power supply management system, and a power supply management method and apparatus applied to the system. The system includes a power sourcing equipment, a powered device, and a power supply line. The power sourcing equipment sends a second voltage to the powered device to determine a first voltage. The first voltage is a maximum power supply voltage agreed on by the power sourcing equipment and the powered device. The power sourcing equipment supplies power to the powered device based on the first voltage. In this application, the power sourcing equipment supplies power to the powered device based on the maximum power supply voltage that can be supported by the powered device, so that a loss on the power supply line is reduced.
    Type: Application
    Filed: May 5, 2023
    Publication date: August 31, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jincan Cao, Chao Ren, Jianhua Xu, Yu Ding
  • Patent number: 11694855
    Abstract: An MOFs composite electrode material for supercapacitors includes: a Ni-BSC matrix, and a PEDOT coating layer coated on the Ni-BTC matrix, wherein a molar ratio of EDOT to Ni-BTC is 1:(1-4) based on a molar amount of EDOT monomer. A method for preparing the MOFs composite electrode material includes steps of: using nickel nitrate hexahydrate and benzenetricarboxylic acid as raw materials to synthesize Ni-BTC by a hydrothermal method; and using a liquid phase method to grow PEDOT on a surface of the Ni-BTC. An MOFs composite electrode slurry and a working electrode for the supercapacitors including the above MOFs composite electrode material or a MOFs composite electrode material prepared by the above method are also provided. The MOFs composite electrode material provided by the present invention combines advantages of Ni-BTC and PEDOT.
    Type: Grant
    Filed: November 14, 2020
    Date of Patent: July 4, 2023
    Assignee: University of Electronic Science and Technology of China
    Inventors: Yajie Yang, Liuwei Shi, Runhui Xi, Chengpeng Wang, Zhaokun Wu, Weiye Sun, Xiaoting Zha, Dan Tu, Jianhua Xu
  • Publication number: 20230132408
    Abstract: The present application discloses a method for manufacturing a metal gate of a PMOS, comprising: step 1, forming a P-type work function metal layer; step 2, depositing an N-type work function metal layer by means of a PVD process, wherein over a bottom surface of a gate trench, the N-type work function metal layer has a hill profile; step 3, forming a first top barrier metal sublayer by means of a conformal growth process, wherein the first top barrier metal sublayer completely fills a sharp corner area of the N-type work function metal layer at a corner of the gate trench; step 4, growing a second top barrier metal sublayer by means of a PVD bombardment process; step 5, forming a third top barrier metal sublayer and a fourth top barrier metal sublayer; and step 6, forming a metal conductive material layer.
    Type: Application
    Filed: September 15, 2022
    Publication date: May 4, 2023
    Applicant: Shanghai Huali Integrated Circuit Corporation
    Inventors: Zhaoqin Zeng, Yu Zhang, Jingxun Fang, Yu Bao, Jianhua Xu
  • Publication number: 20230053977
    Abstract: Disclosed is a composite from about 50 wt. % to about 90 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polycarbonate polysiloxane copolymer; and from about 10 wt. % to about 50 wt. % of a carbon-based filler. The composite exhibits a dielectric constant ?? of between 5 and 20 and a dissipation loss ?? of between 0.1 and 6, measured at frequencies between about 10 and 120 GHz.
    Type: Application
    Filed: December 31, 2020
    Publication date: February 23, 2023
    Inventors: Norberto SILVI, Martin SAS, Joel THAMBI, Wei ZHAO, Jianhua XU
  • Publication number: 20230035471
    Abstract: Embodiments of the present disclosure are directed to an antenna system and a mobile terminal. The antenna system includes a metal antenna, a radio frequency module, and an antenna tuning switch. The mobile terminal includes the antenna system mentioned above. An embodiment of the present disclosure is capable of improving the stability of sensor detection and prevent the whole machine from being in a state of power reduction for a long time, resulting in signal deterioration.
    Type: Application
    Filed: February 20, 2020
    Publication date: February 2, 2023
    Applicant: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD
    Inventors: Jianhua XU, Fangshao ZOU
  • Publication number: 20220130974
    Abstract: The present application discloses a contact, which comprises a contact opening, and a Ti layer, a glue layer and a tungsten layer which completely fill the contact opening; the Ti layer is subjected to annealing treatment; the tungsten layer comprises a tungsten seed layer and a tungsten body layer; the glue layer consists of a TiN layer which is divided into a plurality of TiN sub-layers, all or part of the TiN sub-layers are subjected to the annealing treatment, and the size of grains of the TiN sub-layer subjected to the annealing treatment is limited by the thickness of the corresponding TiN sub-layer. The present application further discloses a method for making a contact. The present application can prevent the annealing treatment of the TiSi layer from producing large lattice grains in the glue layer, thus can make the tungsten seed layer be a continuous structure.
    Type: Application
    Filed: February 2, 2021
    Publication date: April 28, 2022
    Applicant: Shanghai Huali Integrated Circuit Corporation
    Inventors: Jianhua Xu, Zhaoqin Zeng
  • Publication number: 20220119635
    Abstract: A method of forming articles from acrylonitrile-butadiene-styrene, the method comprising: feeding a monomer stream comprising a petrochemical monomer into a reactor; contacting the petrochemical monomer with a polymerization activator within the reactor to produce a polymerized stream comprising rubber, latex, or a combination thereof and withdrawing the polymerized stream from the reactor; passing the polymerized stream through a filter to produce a filtered product stream, wherein the filter is a continuously self-cleaning filter; passing the filtered product stream through a grafting unit comprising acrylonitrile and styrene to produce acrylonitrile-butadiene-styrene; and forming an article from the acrylonitrile-butadiene-styrene, wherein the article is an extruded sheet, a molded part, or a combination thereof.
    Type: Application
    Filed: February 14, 2020
    Publication date: April 21, 2022
    Inventors: Cameron Royal YOUNGSTROM, Chen CHEN, Jianhua XU, Vern LOWRY, Bing ZHOU, Chen WAN, Drew Prentice MANICA
  • Patent number: 11302788
    Abstract: A semiconductor device, comprising: a semiconductor substrate; a source, a gate and a drain fabricated on one side of the semiconductor substrate; a via hole region reserved in the region of the source; and an etching stopping layer made in the via hole region as well as a via hole under the etching stopping layer penetrating through the semiconductor substrate.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: April 12, 2022
    Assignee: Dynax Semiconductor Inc.
    Inventors: Pan Pan, Naiqian Zhang, Xi Song, Jianhua Xu
  • Patent number: 11090837
    Abstract: A process for the production of an elastomer agglomerate composition wherein the process comprises the steps in this order: (a) providing a slurry comprising elastomeric particles having an average particle size of ?150 nm in water; and (b) forcing the slurry from (a) through an aperture at a flow velocity of at least 500 m/s. The elastomer agglomerate compositions produced via such process demonstrate a particularly desirable high average particle size.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 17, 2021
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Ahmed Abouelfetouh Youssef, Vern Lowry, Dane Ferraris, Jianhua Xu
  • Publication number: 20210167809
    Abstract: The present application discloses a mobile terminal having a shared radio frequency antenna, comprising a PCB; the PCB is provided thereon with a distance sensing module, a radio frequency module, a filtering module for preventing a signal, that is not needed by the operation of the distance sensing module, from passing, and a radio frequency antenna module for generating a resonance frequency that is needed by the operation of the distance sensing module and a resonance frequency that is needed by the operation of the radio frequency module; the distance sensing module is connected to the radio frequency antenna module by means of the filtering module; and the radio frequency antenna module is further connected to the radio frequency module.
    Type: Application
    Filed: August 24, 2018
    Publication date: June 3, 2021
    Applicant: JRD Communication (Shenzhen) LTD.
    Inventors: Jianhua XU, Fan HUANG
  • Publication number: 20210065997
    Abstract: An MOFs composite electrode material for supercapacitors includes: a Ni-BSC matrix, and a PEDOT coating layer coated on the Ni-BTC matrix, wherein a molar ratio of EDOT to Ni-BTC is 1:(1-4) based on a molar amount of EDOT monomer. A method for preparing the MOFs composite electrode material includes steps of: using nickel nitrate hexahydrate and benzenetricarboxylic acid as raw materials to synthesize Ni-BTC by a hydrothermal method; and using a liquid phase method to grow PEDOT on a surface of the Ni-BTC. An MOFs composite electrode slurry and a working electrode for the supercapacitors including the above MOFs composite electrode material or a MOFs composite electrode material prepared by the above method are also provided. The MOFs composite electrode material provided by the present invention combines advantages of Ni-BTC and PEDOT.
    Type: Application
    Filed: November 14, 2020
    Publication date: March 4, 2021
    Inventors: Yajie Yang, Liuwei Shi, Runhui Xi, Chengpeng Wang, Zhaokun Wu, Weiye Sun, Xiaoting Zha, Dan Tu, Jianhua Xu
  • Patent number: D1011170
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: January 16, 2024
    Inventor: Jianhua Xu
  • Patent number: D1016911
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: March 5, 2024
    Assignee: Hangzhou Yinghua Handicraft Co., LTD
    Inventor: Jianhua Xu
  • Patent number: D1020430
    Type: Grant
    Filed: November 22, 2023
    Date of Patent: April 2, 2024
    Inventor: Jianhua Xu
  • Patent number: D1029102
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: May 28, 2024
    Assignee: Hangzhou Yinghua Handicraft Co., LTD
    Inventor: Jianhua Xu
  • Patent number: D1038232
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: August 6, 2024
    Assignee: Hangzhou Yinghua Handicraft Co., LTD
    Inventor: Jianhua Xu
  • Patent number: D1044338
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: October 1, 2024
    Assignee: Hangzhou Yinghua Handicraft Co., LTD
    Inventor: Jianhua Xu