Patents by Inventor Jian-Huah CHIOU

Jian-Huah CHIOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanisms for processing wafer
    Patent number: 9575494
    Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes creating an exhaust flow in a fluid conduit assembly that is connected to a process module used for processing the wafer. The method also includes detecting the exhaust pressure in the fluid conduit assembly. The method further includes determining whether the exhaust pressure meets a set point. In addition, the method includes regulating the exhaust flow if the exhaust pressure fails to meet the set point.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: February 21, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: You-Hua Chou, Shih-Hung Chen, Jian-Huah Chiou
  • MECHANISMS FOR PROCESSING WAFER
    Publication number: 20150129044
    Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes creating an exhaust flow in a fluid conduit assembly that is connected to a process module used for processing the wafer. The method also includes detecting the exhaust pressure in the fluid conduit assembly. The method further includes determining whether the exhaust pressure meets a set point. In addition, the method includes regulating the exhaust flow if the exhaust pressure fails to meet the set point.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: You-Hua CHOU, Shih-Hung CHEN, Jian-Huah CHIOU
  • Wafer transfer pod for reducing wafer particulate contamination
    Patent number: 8544651
    Abstract: A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween. The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: October 1, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying Zhang, Tien-Chih Cheng, Shu-Huei Suen, Yu-Cheng Liu, Jian-Huah Chiou
  • WAFER TRANSFER POD FOR REDUCING WAFER PARTICULATE CONTAMINATION
    Publication number: 20130186803
    Abstract: A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween, The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.
    Type: Application
    Filed: January 20, 2012
    Publication date: July 25, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ying ZHANG, Tien-Chih CHENG, Shu-Huei SUEN, Yu-Cheng LIU, Jian-Huah CHIOU