Patents by Inventor Jian-Hung Chen
Jian-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11004720Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.Type: GrantFiled: May 23, 2018Date of Patent: May 11, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Jian-Hung Chen, Meng-Chen Lin, Chung-Hsin Chien, Hsuan Lee, Boris Huang
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Publication number: 20150170798Abstract: A transmission cable includes a tubular outer insulation sheath made of an electrically insulative material having magnetic substances embedded therein, and conducting wires each having an insulation axially inserted in the tubular outer insulation sheath and a metal core surrounded by the insulation. Thus, the transmission cable can be folded back and forth repeatedly to form a bundle, enabling the curved segments of the tubular outer insulation sheath to be secured to one another or a magnetically attraction wall by magnetic attraction.Type: ApplicationFiled: December 13, 2013Publication date: June 18, 2015Applicant: CYBERPOWER SYSTEMS, INC.Inventors: JIAN-HUNG CHEN, CHIH-MING CHEN
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Publication number: 20140332264Abstract: A cable device includes a cable body having at least one prestressed portion for enabling the cable body to be arranged in the shape of a zigzag or circular winding, and a plurality of magnetic attraction devices fixedly mounted around the periphery of the cable body at two sides relative to one respective curved prestressed portion and so configured that each two adjacent magnetic attraction devices are fastenable to each other by magnetic attraction to keep the cable body in the shape of a zigzag or circular winding, preventing tangle or damage of wire, maintaining signal transmission stability, and facilitating easy repeated use and connection.Type: ApplicationFiled: September 3, 2013Publication date: November 13, 2014Applicant: CyberPower Systems, Inc.Inventors: Jian-Hung CHEN, Chih-Ming CHEN
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Patent number: 8825191Abstract: A method for aligning a photolithographic machine in an automated semiconductor manufacturing system is provided. The method may include identifying a maximum precision degree for a wafer and identifying a maximum overlay correction value. The method may simulate one or more algorithms to determine whether an algorithm aligns a leading lot within alignment specifications. The method may align a photolithography machine using an algorithm selected based on the simulations.Type: GrantFiled: May 9, 2013Date of Patent: September 2, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Yao Hsieh, Che-Yu Chiu, Anwei Peng, Jian-Hung Chen, Hsueh-Chen Wu
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Patent number: 8463419Abstract: System and method for automated semiconductor manufacturing is provided. In accordance with one aspect of the present invention, a system for automated semiconductor wafer manufacturing includes a smart overlay control (SOC) database having empirical alignment data related to overlay alignment, and a simulation module communicatively coupled to the SOC database, the simulation module determining a simulated overlay alignment of a wafer on the plurality of photolithography tools in a tool bank based on the empirical alignment data stored in the SOC database. The system also includes a dispatch module communicatively coupled to the SOC database and the simulation module, the dispatch module controlling the dispatch of a wafer to one of a plurality of photolithography tools in a tool bank based at least in part on the simulated overlay alignment.Type: GrantFiled: November 12, 2009Date of Patent: June 11, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Yao Hsieh, Che-Yu Chiu, Anwei Peng, Jian-Hung Chen, Hsueh-Chen Wu
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Patent number: 8303231Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.Type: GrantFiled: September 28, 2007Date of Patent: November 6, 2012Assignee: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Yeh-Hsin Yu, Jian-Hung Chen, Chia Ho Chuang, Hsueh Cheng Wu
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Publication number: 20100185311Abstract: System and method for automated semiconductor manufacturing is provided. In accordance with one aspect of the present invention, a system for automated semiconductor wafer manufacturing includes a smart overlay control (SOC) database having empirical alignment data related to overlay alignment, and a simulation module communicatively coupled to the SOC database, the simulation module determining a simulated overlay alignment of a wafer on the plurality of photolithography tools in a tool bank based on the empirical alignment data stored in the SOC database. The system also includes a dispatch module communicatively coupled to the SOC database and the simulation module, the dispatch module controlling the dispatch of a wafer to one of a plurality of photolithography tools in a tool bank based at least in part on the simulated overlay alignment.Type: ApplicationFiled: November 12, 2009Publication date: July 22, 2010Inventors: Wen-Yao Hsieh, Che-Yu Chiu, Anwei Peng, Jian-Hung Chen, Hsuch-Chen Wu
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Publication number: 20090087287Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.Type: ApplicationFiled: September 28, 2007Publication date: April 2, 2009Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yeh Hsin Yu, Jian Hung Chen, Chia Ho Chuang, Hsueh Cheng Wu
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Patent number: 7413462Abstract: A shell for an electrical appliance includes a base, a cover, and a plug-receiving assembly. The plug-receiving assembly includes a recess attached to the cover for receiving a plug of the electrical appliance. The recess has a bottom and two opposing sides. The bottom supports the plug, and the opposing sides have protrusions for retaining the plug in the recess. The plug-receiving assembly further includes a slanted guide formed on the bottom of the recess for guiding the plug in the recess. A user may remove the plug from the recess by the pulling an electrical wire attached to the plug to move the plug along the slanted guide and out from the recess. Additionally, the plug-receiving assembly may include a mounting grove adjacent to the slanted guide for retaining the electrical wire.Type: GrantFiled: June 12, 2006Date of Patent: August 19, 2008Assignee: Cyber Power System Inc.Inventors: Hsiung-Kuei Cheng, Jian-Hung Chen, Yuan-Liang Hsu, Lien-Hsun Ho
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Publication number: 20070287321Abstract: A shell for an electrical appliance includes a base, a cover, and a plug-receiving assembly. The plug-receiving assembly includes a recess attached to the cover for receiving a plug of the electrical appliance. The recess has a bottom and two opposing sides. The bottom supports the plug, and the opposing sides have protrusions for retaining the plug in the recess. The plug-receiving assembly further includes a slanted guide formed on the bottom of the recess for guiding the plug in the recess. A user may remove the plug from the recess by the pulling an electrical wire attached to the plug to move the plug along the slanted guide and out from the recess. Additionally, the plug-receiving assembly may include a mounting grove adjacent to the slanted guide for retaining the electrical wire.Type: ApplicationFiled: June 12, 2006Publication date: December 13, 2007Applicant: CYBER POWER SYSTEM INC.Inventors: Hsiung-Kuei Cheng, Jian-Hung Chen, Yuan-Liang Hsu, Lien-Hsun Ho
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Publication number: 20030181042Abstract: Method of wet etching a semiconductor wafer comprises immersing the wafer into a chemical bath filled with etchant solution, keeping the wafer in the etchant for predetermined time, and taking it out of the etchant upon completing etching. While in the bath, the wafer is turned upside down around an axis normal to its plane to provide for equalizing etching time for various areas of the wafer and thus to contribute to higher wafer etching uniformity.Type: ApplicationFiled: March 19, 2002Publication date: September 25, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jian Hung Chen, Chih Che Huang, Ming-Hsun Yang, Chii Shing Yang
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Patent number: D516074Type: GrantFiled: August 10, 2004Date of Patent: February 28, 2006Assignee: Cyber Power System Inc.Inventors: Lien-Hsun Ho, Hsiung-Kuei Cheng, Jian-Hung Chen, Chun-Ling Chueh