Abstract: A vacuum suction nozzle is provided, including a first housing, a second housing, an accommodating space, a gap, and a clamping assembly. The first housing includes a first lateral wall, a first lower surface, a channel, and a through hole. The through hole is formed on the first lateral wall. The second housing is fixedly connected to the first housing, and includes a second lateral wall and a second lower surface. The accommodating space is formed between the first lateral wall and the second lateral wall, and the through hole is opened onto the channel and the accommodating space. The gap is formed between the first lower surface and the second lower surface, and is opened onto the accommodating space. The clamping assembly is disposed in the accommodating space.

Abstract: An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

Abstract: A vacuum suction nozzle is provided, including a first housing, a second housing, an accommodating space, a gap, and a clamping assembly. The first housing includes a first lateral wall, a first lower surface, a channel, and a through hole. The through hole is formed on the first lateral wall. The second housing is fixedly connected to the first housing, and includes a second lateral wall and a second lower surface. The accommodating space is formed between the first lateral wall and the second lateral wall, and the through hole is opened onto the channel and the accommodating space. The gap is formed between the first lower surface and the second lower surface, and is opened onto the accommodating space. The clamping assembly is disposed in the accommodating space.

Abstract: An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

Abstract: A calibration device is provided. The calibration device includes a frame, a first optical sensing device, a second optical sensing device and a third optical sensing device. The frame includes a bottom plate and at least four sidewalls, wherein the sidewalls have a first grating hole, a second grating hole, a third grating hole and a fourth grating hole at a first height. The bottom plate has an image recognition pattern, a first measurement point, a second measurement point and a third measurement point.

Abstract: A calibration device is provided. The calibration device includes a frame, a first optical sensing device, a second optical sensing device and a third optical sensing device. The frame includes a bottom plate and at least four sidewalls, wherein the sidewalls have a first grating hole, a second grating hole, a third grating hole and a fourth grating hole at a first height. The bottom plate has an image recognition pattern, a first measurement point, a second measurement point and a third measurement point.

Abstract: The invention provides an optical module including a circuit board, an optical component and an electrical interface, and the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface-emitting laser chip array and a photodetector chip array, and the signal rate transmission chip is electrically connected with the laser driver chip and the transimpedance limiting amplifier chip through the first microstrip line, and the optical component includes an interface end MT ferrule, and a light-emitting ribbon optical cable and a light-receiving ribbon optical cable both connected with the interface end MT ferrule, the light-emitting ribbon optical cable is coupled and aligned with the vertical cavity surface-emitting laser chip array, and the light-receiving ribbon optical cable is coupled and aligned with the photodetector chip array, and the electrical interface includes a gold finger disposed on one side of circuit board

Abstract: Transmission equipment is provided. The transmission equipment includes a carrier and a transmission rail. The carrier includes at least one carrier guiding structure. The transmission rail includes a first rail, a second rail and a turning unit. The first rail includes at least one first transmission member. The second rail includes at least one second transmission member. The turning unit includes a first guiding slot, a second guiding slot and a turning member. At least one portion of the first guiding slot is parallel to the first rail. At least one portion of the second guiding slot is parallel to the second rail. The turning member moves between a first position and a second position.

Abstract: Transmission equipment is provided. The transmission equipment includes a carrier and a transmission rail. The carrier includes at least one carrier guiding structure. The transmission rail includes a first rail, a second rail and a turning unit. The first rail includes at least one first transmission member. The second rail includes at least one second transmission member. The turning unit includes a first guiding slot, a second guiding slot and a turning member. At least one portion of the first guiding slot is parallel to the first rail. At least one portion of the second guiding slot is parallel to the second rail. The turning member moves between a first position and a second position.

Abstract: Methods, systems, and devices are disclosed for detecting molecular interactions.

Abstract: Transmission equipment is provided. The transmission equipment includes a carrier and a transmission rail. The carrier includes at least one carrier guiding structure. The transmission rail includes a first rail, a second rail and a turning unit. The first rail includes at least one first transmission member. The second rail includes at least one second transmission member. The turning unit includes a first guiding slot, a second guiding slot and a turning member. At least one portion of the first guiding slot is parallel to the first rail. At least one portion of the second guiding slot is parallel to the second rail. The turning member moves between a first position and a second position.

Abstract: Transmission equipment is provided. The transmission equipment includes a carrier and a transmission rail. The carrier includes at least one carrier guiding structure. The transmission rail includes a first rail, a second rail and a turning unit. The first rail includes at least one first transmission member. The second rail includes at least one second transmission member. The turning unit includes a first guiding slot, a second guiding slot and a turning member. At least one portion of the first guiding slot is parallel to the first rail. At least one portion of the second guiding slot is parallel to the second rail. The turning member moves between a first position and a second position.

Abstract: Methods, systems, and devices are disclosed for detecting molecular interactions.

Abstract: A semiconductor device comprises a substrate, a patterned conductive layer, a first transistor structure and a second transistor structure. The patterned conductive layer is formed on the substrate. The first transistor structure includes a first source, a first gate and a first drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The second transistor structure includes a second source, a second gate and a second drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The first gate is electrically connected to the second source through the patterned conductive layer, and the first source is electrically connected to the second drain through the patterned conductive layer.

Abstract: A semiconductor device comprises a substrate, a patterned conductive layer, a first transistor structure and a second transistor structure. The patterned conductive layer is formed on the substrate. The first transistor structure includes a first source, a first gate and a first drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The second transistor structure includes a second source, a second gate and a second drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The first gate is electrically connected to the second source through the patterned conductive layer, and the first source is electrically connected to the second drain through the patterned conductive layer.

Abstract: A biosensor with a dual gate structure is disclosed herein. The biosensor comprises: a transistor, a sensing pad, and a plurality of nanostructures. The sensing pad has a conductive area working as another gate and neighboring to the channel layer of the transistor, and a sensing area extended outward from the conductive area to be far away from the channel layer of the transistor, wherein the gate and the conductive area of the sensing pad are separated from each other by the channel layer. The plurality of nanostructures are utilized to bind a first protein to generate a drain current value, when the first protein is combined with the target protein and another drain current value is generated, whereby a variation between the two drain current values is calculated to obtain the concentration of the target protein in the protein solution.

Abstract: A battery module includes a frame, at least one first batteries array, at least one second batteries array, at least one heat dissipation slot and at least one modular heat dissipation structure. The first batteries array is accommodated in the frame, and includes a plurality of first batteries substantially arranged along a first direction. The second batteries array is accommodated in the frame, and includes a plurality of second batteries substantially arranged along the first direction. The modular heat dissipation structure is inserted into the heat dissipation slot and thermally contacts the first batteries and the second batteries, wherein the modular heat dissipation structure can be chosen as various types according to heat dissipation demands.

Abstract: A battery module includes a housing, a plurality of thermally conductive plates, a plurality of flat cells and a fixing unit. The thermally conductive plates and the flat cells are received in the housing. At least one of the thermally conductive plates is received between two of the flat cells and contacts with at least one of the two of the flat cells. Each of the flat cells respectively has a cell body and at least an electrode connected to and extended from the cell body. The fixing unit is received in the housing, and the electrode is fixed on the fixing unit. The battery module is applied advantageously to integrate the thermal dissipation system with the fixing structure. Additionally, the particular configuration used herein is beneficial to reduce the risk of electrode breakage.

Abstract: An oxide semiconductor thin-film transistor, comprising: a source electrode and a drain electrode formed on a substrate; a composite semiconductor active layer formed between the source electrode and the drain electrode; a gate dielectric layer formed on the source electrode, the composite semiconductor active layer and the drain electrode; and a gate electrode formed on the gate dielectric layer and corresponding to the composite semiconductor active layer; wherein the composite semiconductor active layer comprises a low carrier-concentration first oxide semiconductor layer and a high carrier-concentration second oxide semiconductor layer.