Abstract: The present invention discloses a method of treating Gefitinib-resistant non-small-cell lung cancer, comprising administering an effective amount of an alkaloid. A pharmaceutical composition comprising an alkaloid admixed with a pharmaceutical carrier for treating Gefitinib-resistant non-small-cell lung cancer is also disclosed therein.

Abstract: A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.

Abstract: An ultrasonic spray coating system includes a piezoelectric transducer, a spray-forming head and a liquid supply applicator. The spray-forming head has an air-entrainment mechanism. The air-entrainment mechanism has an air-stream channel that is formed inside a main body and a bottom body of the spray-forming head for connection with a high-pressure air source, and an air vent formed in a bottom surface of the bottom body and communicates with the air-stream channel. A length of the air vent in a horizontal direction is greater than that of the air-stream channel. The liquid supply applicator has a discharge orifice, and a control component for controlling the size of the discharge orifice.

Abstract: A green phosphorescent iridium complex represented by Formula (I) is provided. In Formula (I), R1, R2 and R3 are, independently, hydrogen, halogen, substituted or non-substituted C1-6 alkyl, C1-6 alkoxy, cycloalkyl, substituted or non-substituted aryl, amino or heteroaryl, and L is a heterocyclic ring containing N—N or N—O ligand. The invention also provides a method for fabricating the green phosphorescent iridium complex and an organic light-emitting diode including the green phosphorescent iridium complex.

Abstract: A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A green phosphorescent iridium complex represented by Formula (I) is provided. In Formula (I), R1, R2 and R3 are, independently, hydrogen, halogen, substituted or non-substituted C1-6 alkyl, C1-6 alkoxy, cycloalkyl, substituted or non-substituted aryl, amino or heteroaryl, and L is a heterocyclic ring containing N—N or N—O ligand. The invention also provides a method for fabricating the green phosphorescent iridium complex and an organic light-emitting diode including the green phosphorescent iridium complex.