Patents by Inventor Jian-Qing Sheng

Jian-Qing Sheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7644751
    Abstract: A heat sink clip (100) includes a spring member (10), a moveable locking member (20) and an actuating member (30). The spring member includes an elongated main body (11) and a first locking leg (14) connecting at one end of the main body. The locking member is coupled at the other end of the main body, including an engaging plate (22) and a second locking leg (26) extending from the engaging plate. The actuating member includes a handle (32) and an extension portion (34) formed at one end of the handle. The handle and the extension portion form an angle therebetween. The extension portion is operatively engageable with the engaging plate of the locking member.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: January 12, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tong-Hua Lin, Chin-Lung Chen, Jian-Qing Sheng
  • Patent number: 7575045
    Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: August 18, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7349210
    Abstract: A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53) between the base wall and the sidewalls, a holding space in an upper portion of the protecting space, and two projections (54). The protecting space is for accommodating the grease. The holding space is for receiving the heat sink therein. The projections extend from two opposite sidewalls of the grease cover. A top surface of each of the projections spaces a distance from the base wall, for supporting the bottom surface of the heat sink to enable the grease away from the base wall, when the heat sink is received in the holding space.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: March 25, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian-Qing Sheng, Chin-Lung Chen
  • Publication number: 20070079485
    Abstract: A heat sink clip (100) includes a spring member (10), a moveable locking member (20) and an actuating member (30). The spring member includes an elongated main body (11) and a first locking leg (14) connecting at one end of the main body. The locking member is coupled at the other end of the main body, including an engaging plate (22) and a second locking leg (26) extending from the engaging plate. The actuating member includes a handle (32) and an extension portion (34) formed at one end of the handle. The handle and the extension portion form an angle therebetween. The extension portion is operatively engageable with the engaging plate of the locking member.
    Type: Application
    Filed: July 20, 2006
    Publication date: April 12, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Tong-Hua Lin, Chin-Lung Chen, Jian-Qing Sheng
  • Publication number: 20070012421
    Abstract: A grease protecting apparatus (10) includes a heat sink (12), and a grease cover (14). The heat sink includes a bottom surface (122) for contacting with a heat-generating component. A layer of thermal grease (16) is spread on the bottom surface of the heat sink. The grease cover is attached to the bottom surface of the heat sink and covers the grease to protect the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, and two wings (144) extending from two opposite sides of the main body for attaching the grease cover to the bottom surface of the heat sink. The wings defines a plurality of perforations (148) therein to make the wings be capable of tilted upwardly and downwardly.
    Type: Application
    Filed: December 21, 2005
    Publication date: January 18, 2007
    Inventors: Yeu-Lih Lin, Chin-Lung Chen, Jian-Qing Sheng
  • Publication number: 20060268513
    Abstract: A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53) between the base wall and the sidewalls, a holding space in an upper portion of the protecting space, and two projections (54). The protecting space is for accommodating the grease. The holding space is for receiving the heat sink therein. The projections extend from two opposite sidewalls of the grease cover. A top surface of each of the projections spaces a distance from the base wall, for supporting the bottom surface of the heat sink to enable the grease away from the base wall, when the heat sink is received in the holding space.
    Type: Application
    Filed: November 18, 2005
    Publication date: November 30, 2006
    Inventors: Jian-Qing Sheng, Chin-Lung Chen
  • Patent number: 7028758
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: April 18, 2006
    Assignee: HON HAI Precision Industry Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7025125
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: April 11, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050263265
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
    Type: Application
    Filed: December 21, 2004
    Publication date: December 1, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050257920
    Abstract: A heat dissipating device includes a heat receiver, a fin member including a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding hole. The at least one heat pipe is U-shaped and includes an evaporative section attached to the heat receiver, a pair of condesative sections received in the holes of the fins, and a pair of curved sections connected between opposite ends of the evaporative section and the condensative sections respectively and received in the enlarged openings.
    Type: Application
    Filed: April 15, 2005
    Publication date: November 24, 2005
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050247434
    Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.
    Type: Application
    Filed: March 29, 2005
    Publication date: November 10, 2005
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20050167087
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.
    Type: Application
    Filed: July 15, 2004
    Publication date: August 4, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin