Patents by Inventor Jian-Sheng Hsieh

Jian-Sheng Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9833159
    Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: December 5, 2017
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Fang-Hsien Chu, Chih-Chung Lin, Yi-Ting Hsieh, Chia-Min Chuang, Saou-Wen Su, Bin-Chyi Tseng, Jian-Sheng Hsieh, Tsung-Chieh Yen
  • Publication number: 20160062417
    Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.
    Type: Application
    Filed: April 16, 2015
    Publication date: March 3, 2016
    Inventors: Fang-Hsien Chu, Chih-Chung Lin, Yi-Ting Hsieh, Chia-Min Chuang, Saou-Wen Su, Bin-Chyi Tseng, Jian-Sheng Hsieh, Tsung-Chieh Yen
  • Publication number: 20080049411
    Abstract: An I/O shield used in an electronic apparatus is provided. The electronic apparatus comprises a casing having an opening. The I/O shield comprises a body and at least a flexible lateral plate. The body has an edge with many protrusions arranged thereon. The flexible lateral plate has a first lateral edge and a second lateral edge parallel to the first lateral edge. The first lateral edge is disposed on the edge. The flexible lateral plate tilts towards the protrusions, and a surface of the flexible lateral plate faces the protrusions. When a rim of the opening is situated between the protrusions and the flexible lateral plate, the flexible lateral plate forms a bend structure between the first lateral edge and the second lateral edge, so that part of the surface near the second lateral edge presses the rim and clamps the rim of the opening together with the protrusions.
    Type: Application
    Filed: July 5, 2007
    Publication date: February 28, 2008
    Inventors: Chun-Min Wang, Sheng-Hung Wang, Jian-Sheng Hsieh