Patents by Inventor Jian-Shian Lin
Jian-Shian Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240087933Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: YOU-CHENG YEH, MAO-CHIH HUANG, YEN-CHING HUANG, YU HSUAN CHUANG, TAI-HSIANG LIN, JIAN-SHIAN LIN
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Patent number: 11854848Abstract: A container includes a container body and an air processing system. The container body includes a plurality of walls defining an interior space for receiving wafers. The air processing system is attached to the container body. The air processing system includes an exchange module, an air extraction module, a first contaminant removal module, a processing module, a second contaminant removal module, a controller module and a power module. The exchange module is coupled to one of the walls of the container body. The air extraction module extracts air from the container body. The first contaminant removal module is coupled to the air extraction module and the exchange module. The processing module is coupled to the air extraction module. The second contaminant removal module is coupled to the processing module and the exchange module. The controller module is configured to turn the air extraction module on and off.Type: GrantFiled: February 24, 2021Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: You-Cheng Yeh, Mao-Chih Huang, Yen-Ching Huang, Yu Hsuan Chuang, Tai-Hsiang Lin, Jian-Shian Lin
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Patent number: 11633834Abstract: A method for repairing a polishing pad in real time includes a trimming step, a detection step, and a reconstruction and analysis step. A surface morphology of the polishing pad is reconstructed through detection, and analysis is performed according to the reconstruction, to ensure that a surface of the polishing pad can recover its function after the surface of the polishing pad is trimmed, so that the polishing pad can be used effectively to reduce costs.Type: GrantFiled: August 13, 2020Date of Patent: April 25, 2023Assignee: TA LIANG TECHNOLOGY CO., LTD.Inventors: Chao-Chang Chen, Jian-Shian Lin, Chun-Chen Chen, Jen-Chien Li, Hsien-Ming Lee, Ching-Tang Hsueh
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Patent number: 11359906Abstract: A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.Type: GrantFiled: May 29, 2020Date of Patent: June 14, 2022Assignee: TA LIANG TECHNOLOGY CO., LTD.Inventors: Chao-Chang Chen, Jen-Chieh Li, Yong-Jie Ciou, Hsien-Ming Lee, Jian-Shian Lin, Chun-Chen Chen, Ching-Tang Hsueh
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Publication number: 20220139746Abstract: A container includes a container body and an air processing system. The container body includes a plurality of walls defining an interior space for receiving wafers. The air processing system is attached to the container body. The air processing system includes an exchange module, an air extraction module, a first contaminant removal module, a processing module, a second contaminant removal module, a controller module and a power module. The exchange module is coupled to one of the walls of the container body. The air extraction module extracts air from the container body. The first contaminant removal module is coupled to the air extraction module and the exchange module. The processing module is coupled to the air extraction module. The second contaminant removal module is coupled to the processing module and the exchange module. The controller module is configured to turn the air extraction module on and off.Type: ApplicationFiled: February 24, 2021Publication date: May 5, 2022Inventors: YOU-CHENG YEH, MAO-CHIH HUANG, YEN-CHING HUANG, YU HSUAN CHUANG, TAI-HSIANG LIN, JIAN-SHIAN LIN
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Publication number: 20210372764Abstract: A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.Type: ApplicationFiled: May 29, 2020Publication date: December 2, 2021Inventors: Chao-Chang Chen, Jen-Chieh Li, Yong-Jie Ciou, Hsien-Ming Lee, Jian-Shian Lin, Chun-Chen Chen, Ching-Tang Hsueh
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Publication number: 20210046606Abstract: A method for repairing a polishing pad in real time includes a trimming step, a detection step, and a reconstruction and analysis step. A surface morphology of the polishing pad is reconstructed through detection, and analysis is performed according to the reconstruction, to ensure that a surface of the polishing pad can recover its function after the surface of the polishing pad is trimmed, so that the polishing pad can be used effectively to reduce costs.Type: ApplicationFiled: August 13, 2020Publication date: February 18, 2021Applicant: Ta Liang Technology Co., Ltd.Inventors: Chao-Chang Chen, Jian-Shian Lin, Chun-Chen Chen, Jen-Chien Li, Hsien-Ming Lee, Ching-Tang Hsueh
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Patent number: 9127979Abstract: An optical measuring device includes a case, a reflective layer and a light collecting lens module. A measuring chamber and a channel, which is connected to the measuring chamber and is connected to an opening of the case, reside in the case. The reflective layer is disposed onto an inner surface of the measuring chamber. The light collecting lens module is located inside the channel. A light beam emits into the channel of the optical measuring device through an opening, passes through the light collecting lens module and enters the measuring chamber afterward.Type: GrantFiled: September 13, 2013Date of Patent: September 8, 2015Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chen-Chin Cheng, Jian-Shian Lin, Min-Chieh Chou, Yu-Tang Chen
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Publication number: 20140175495Abstract: A die bonding method and a die bonding structure of a light emitting diode package are provided. The die bonding structure includes a light transmissive adhesive layer formed on a surface of a base plate of a light emitting diode chip, a first metal layer formed on the adhesive layer, a second metal layer formed on a packaging base plate and multiple metallic compound layers. The metallic compound layers are formed by spreading a third metal layer disposed on at least one of the first metal layer and the second metal layer into the first metal layer and the second metal layer after the third metal layer is heated up. The melting points of the first metal layer and the second metal layer are higher than the melting point of the third metal layer.Type: ApplicationFiled: May 24, 2013Publication date: June 26, 2014Inventors: Tung-Han Chuang, Jian-Shian Lin, Ying-Tsun Su, Meng-Chi Huang
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Patent number: 8716737Abstract: An LED includes a first intermetallic layer, a first metal thin film layer, an LED chip, a substrate, a second metal thin film layer, and a second intermetallic layer. The first metal thin film layer is located on the first intermetallic layer. The LED chip is located on the first metal thin film layer. The second metal thin film layer is located on the substrate. The second intermetallic layer is located on the second metal thin film layer, and the first intermetallic layer is located on the second intermetallic layer. Materials of the first and the second metal thin film layer are selected from a group consisting of Au, Ag, Cu, and Ni. Materials of the intermetallic layers are selected from a group consisting of a Cu—In—Sn intermetallics, an Ni—In—Sn intermetallics, an Ni—Bi intermetallics, an Au—In intermetallics, an Ag—In intermetallics, an Ag—Sn intermetallics, and an Au—Bi intermetallics.Type: GrantFiled: June 22, 2012Date of Patent: May 6, 2014Assignee: Industrial Technology Research InstituteInventors: Hsiu Jen Lin, Jian Shian Lin, Shau Yi Chen, Chieh Lung Lai
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Publication number: 20140078496Abstract: An optical measuring device includes a case, a reflective layer and a light collecting lens module. A measuring chamber and a channel, which is connected to the measuring chamber and is connected to an opening of the case, reside in the case. The reflective layer is disposed onto an inner surface of the measuring chamber. The light collecting lens module is located inside the channel. A light beam emits into the channel of the optical measuring device through an opening, passes through the light collecting lens module and enters the measuring chamber afterward.Type: ApplicationFiled: September 13, 2013Publication date: March 20, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chen-Chin CHENG, Jian-Shian LIN, Min-Chieh CHOU, Yu-Tang CHEN
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Patent number: 8659160Abstract: A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.Type: GrantFiled: July 19, 2011Date of Patent: February 25, 2014Assignee: Industrial Technology Research InstituteInventors: Meng-Chi Huang, Han-Ping Yang, Min-Chieh Chou, Tune-Hune Kao, Jung-Kang Peng, Cheng-Hsuan Lin, Jian-Shian Lin
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Publication number: 20130334561Abstract: A method for bonding an LED wafer, a method for manufacturing an LED chip, and a bonding structure are provided. The method for bonding an LED wafer includes the following steps. A first metal film is formed on an LED wafer. A second metal film is formed on a substrate. A bonding material layer whose melting point is lower than or equal to about 110° C. is formed on the surface of the first metal film. The LED wafer is placed on the substrate. The bonding material layer is heated at a pre-solid reaction temperature for a pre-solid time to perform a pre-solid reaction. The bonding material layer is heated at a diffusion reaction temperature for a diffusing time to perform a diffusion reaction, wherein the melting points of the first and the second inter-metallic layers after diffusion reaction are higher than about 110° C.Type: ApplicationFiled: June 19, 2012Publication date: December 19, 2013Inventors: Hsiu-Jen LIN, Jian-Shian Lin, Shau-Yi Chen, Jen-Hui Tsai
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Publication number: 20130139808Abstract: The disclosure relates to a solar heating device comprising at least one incidence collector and a thermal container. The thermal container includes at least one light absorbing recess, wherein at least one of the incidence collectors focuses solar beams on a focal point, which is located inside the light absorbing recess. The inner surface of the light absorbing recess converts the energy of the solar beams into radiant heating.Type: ApplicationFiled: July 23, 2012Publication date: June 6, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: JIAN SHIAN LIN, YAO CHI PENG, TUNG CHUAN WU, TUNG CHENG PAN, YU TANG CHEN, WEN HUA ZHANG
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Publication number: 20130005055Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.Type: ApplicationFiled: July 6, 2012Publication date: January 3, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jian-Shian Lin, Chieh-Lung Lai, Hsiu-Jen Lin, Weng-Jung Lu, Yi-Ping Huang, Ya-Chun Tu
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Publication number: 20120256228Abstract: An LED includes a first intermetallic layer, a first metal thin film layer, an LED chip, a substrate, a second metal thin film layer, and a second intermetallic layer. The first metal thin film layer is located on the first intermetallic layer. The LED chip is located on the first metal thin film layer. The second metal thin film layer is located on the substrate. The second intermetallic layer is located on the second metal thin film layer, and the first intermetallic layer is located on the second intermetallic layer. Materials of the first and the second metal thin film layer are selected from a group consisting of Au, Ag, Cu, and Ni. Materials of the intermetallic layers are selected from a group consisting of a Cu—In—Sn intermetallics, an Ni—In—Sn intermetallics, an Ni—Bi intermetallics, an Au—In intermetallics, an Ag—In intermetallics, an Ag—Sn intermetallics, and an Au—Bi intermetallics.Type: ApplicationFiled: June 22, 2012Publication date: October 11, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsiu Jen Lin, Jian Shian Lin, Shau Yi Chen, Chieh Lung Lai
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Patent number: 8235551Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.Type: GrantFiled: December 9, 2009Date of Patent: August 7, 2012Assignee: Industrial Technology Research InstituteInventors: Jian-Shian Lin, Chieh-Lung Lai, Hsiu-Jen Lin, Weng-Jung Lu, Yi-Ping Huang, Ya-Chun Tu
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Patent number: 8236687Abstract: A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid -solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time for performing a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.Type: GrantFiled: August 11, 2010Date of Patent: August 7, 2012Assignee: Industrial Technology Research InstituteInventors: Hsiu-Jen Lin, Jian-Shian Lin, Shau-Yi Chen, Chieh-Lung Lai
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Publication number: 20120168950Abstract: A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.Type: ApplicationFiled: July 19, 2011Publication date: July 5, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Meng-Chi Huang, Han-Ping Yang, Min-Chieh Chou, Tune-Hune Kao, Jung-Kang Peng, Cheng-Hsuan Lin, Jian-Shian Lin
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Publication number: 20110156071Abstract: A multi-stack package light emitting diode (LED) includes an LED chip, a first fluorescent powder layer, a first optical bandpass filter layer and a second fluorescent powder layer. The LED chip generates an LED light. The first fluorescent powder layer and the second fluorescent powder layer respectively have a first fluorescent powder and a second fluorescent powder. The first fluorescent powder and the second fluorescent powder are excited by the LED light to respectively generate a first excitation light and a second excitation light. The first optical bandpass filter layer allows the LED light and the first excitation light to pass and reflects the second excitation light. A wavelength of the LED light is shorter than a wavelength of the second excitation light. The wavelength of the second excitation light is shorter than a wavelength of the first excitation light. Therefore, the multi-stack package LED improves a light emission efficiency.Type: ApplicationFiled: December 22, 2010Publication date: June 30, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chia Shen Cheng, Jian Shian Lin, Shau Yi Chen, Hsiu Jen Lin, Yao Chi Peng