Abstract: A thin film solar cell module of see-through type having cells connected in series and disposed on an opaque substrate with holes is provided. The thin film solar cell module includes a first electrode, a second electrode, and a photoelectric conversion layer disposed between the first electrode and the second electrode. The first electrode is disposed on the opaque substrate and is composed of a first comb electrode and block-like first electrodes. The second electrode is disposed above the first electrode and is composed of a second comb electrode and block-like second electrodes. A portion of the block-like first electrodes, a portion of the opaque substrate, and the holes are exposed between the second comb electrode and the block-like second electrodes. The second comb electrode and the first comb electrode are disposed symmetrically, and the block-like first electrodes and the block-like second electrodes are disposed by parallel displacement.

Abstract: A thin film solar cell module of see-through type having cells connected in series and disposed on an opaque substrate with holes is provided. The thin film solar cell module includes a first electrode, a second electrode, and a photoelectric conversion layer disposed between the first electrode and the second electrode. The first electrode is disposed on the opaque substrate and is composed of a first comb electrode and block-like first electrodes. The second electrode is disposed above the first electrode and is composed of a second comb electrode and block-like second electrodes. A portion of the block-like first electrodes, a portion of the opaque substrate, and the holes are exposed between the second comb electrode and the block-like second electrodes. The second comb electrode and the first comb electrode are disposed symmetrically, and the block-like first electrodes and the block-like second electrodes are disposed by parallel displacement.

Abstract: A thin film solar cell module of see-through type and method of fabricating the same is provided. The method includes forming scribe lines in two directions in a first electrode material layer disposed on an opaque substrate so as to avoid short circuit caused by a high-temperature laser scribing process and reduction of the process yield. Moreover, the thin film solar cell module of see-through type has holes through the opaque substrate so that the cell module increases the transmittance of the cells.

Abstract: A bifacial thin film solar cell and method for fabricating the same are provided. The solar cell has a first and a second transparent substrates, a first and a second solar cell modules, and an insulating layer. The first solar cell module is formed on the first transparent substrate, and has a metal layer as one of the electrodes of the first solar cell module and as a light reflection layer. The insulating layer is formed on the metal layer of the first solar cell module. The second solar cell module is formed between the insulating layer and the second transparent substrate.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract: A bifacial thin film solar cell and method for fabricating the same are provided. The solar cell has a first and a second transparent substrates, a first and a second solar cell modules, and an insulating layer. The first solar cell module is formed on the first transparent substrate, and has a metal layer as one of the electrodes of the first solar cell module and as a light reflection layer. The insulating layer is formed on the metal layer of the first solar cell module. The second solar cell module is formed between the insulating layer and the second transparent substrate.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract: A thin film solar cell module of see-through type and method of fabricating the same is provided. The method includes forming scribe lines in two directions in a first electrode material layer disposed on an opaque substrate so as to avoid short circuit caused by a high-temperature laser scribing process and reduction of the process yield. Moreover, the thin film solar cell module of see-through type has holes through the opaque substrate so that the cell module increases the transmittance of the cells.

Abstract: A thin film solar cell module of see-through type and a method of fabricating the same are provided. First, bi-directional openings are formed in the transparent electrode material layer to avoid problems that affect the production yield such as short-circuit resulted by the high-temperature laser scribing process. Moreover, the thin film solar cell module of see-through type has openings that expose the transparent substrate without covering the transparent electrode material layer to increase the transmittance of the cells.

Abstract: A device capable of converting solar radiation into electrical energy includes a substrate, and a plurality of cells formed over the substrate extending in parallel to each other, each of the plurality of cells including at least one thin film layer and having a size dependent on a film thickness distribution of a machine capable of forming the at least one thin film layer.

Abstract: A method of fabricating a flexible thin film transistor array substrate is provided. First, a rigid substrate is provided, and a polymer material layer is coated on the rigid substrate. Then, an insulating layer is coated over the polymer material layer by a spin coating process. The insulating layer covers the sides of the polymer material layer. Thereafter, a thin film transistor array is formed over the insulating layer. Then, the polymer material layer having the thin film transistor array is separated from the rigid substrate.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract: A method of fabricating a flexible thin film transistor array substrate is provided. First, a rigid substrate is provided, and a polymer material layer is coated on the rigid substrate. Then, an insulating layer is coated over the polymer material layer by a spin coating process. The insulating layer covers the sides of the polymer material layer. Thereafter, a thin film transistor array is formed over the insulating layer. Then, the polymer material layer having the thin film transistor array is separated from the rigid substrate.

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.