Patents by Inventor Jian Wei Lim

Jian Wei Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME
    Publication number: 20240014083
    Abstract: A method of making a semiconductor device assembly is provided. The method comprises attaching a first semiconductor device to an upper surface of a substrate and disposing a stencil over the upper surface of the substrate. The stencil includes (i) an opening and (ii) a cavity in which the first semiconductor device is disposed. The method further comprises screen-printing an epoxy material into the opening and onto the upper surface of the substrate, removing the stencil, and planarizing an upper surface of the epoxy material to form an epoxy spacer.
    Type: Application
    Filed: July 3, 2023
    Publication date: January 11, 2024
    Inventors: Hem P. Takiar, Raj K. Bansal, Jian Wei Lim, Li Wang, Jungbae Lee