Patents by Inventor Jian Wen

Jian Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12360508
    Abstract: The present disclosure relates to the technical field of cutting machining, and discloses a cross-scale structure feature surface machining method based on a multi-component collaborative vibration. A vibration in a z-axis direction is applied to a servo movement mechanism to realize the cutting of a micron-scale structure and the adjustment of the cutting depth; and the vibration in the z-axis direction is applied to a three-axis movement platform to realize the cutting of a millimeter-scale structure and the adjustment of the cutting depth. A required cross-scale structure feature surface can be machined and formed at one time through a collaborative vibration among a vibrating tool, a servo movement mechanism, and/or a three-axis movement platform according to the structure type contained in the required cross-scale structure, which can simplify a process flow and improve the machining efficiency, and has high economic efficiency.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: July 15, 2025
    Assignee: HARBIN INSTITUTE OF TECHNOLOGY
    Inventors: Yang Yang, Jian Wen
  • Patent number: 12333373
    Abstract: A card reader with a protective mechanism includes an upper shell, a lower shell disposed to a bottom surface of the upper shell, a protective mechanism and a circuit board assembly disposed between the upper shell and the lower shell. The protective mechanism includes a front cover, a rear cover covered to a rear of the front cover, two rollers disposed along an up-down direction, two springs, two supporting structures and a plurality of sealing structures. The two springs elastically abut between an inner surface of a top wall of the front cover and one roller along a vertical direction. The two supporting structures are mounted around two opposite sides of the one roller, and two opposite sides of the other roller. The plurality of the sealing structures are disposed at two outer surfaces of the two supporting structures.
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: June 17, 2025
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Xiao-Xiang Guan, Ming-Wei Lee, Jin-Huai Mo, Wei-Jian Wen
  • Patent number: 12293644
    Abstract: A card reader with a protective mechanism includes an upper shell, a lower shell, a protective mechanism and a circuit board assembly. An upper portion of a front end of the upper shell slantwise extends downward and rearward, and then is bent rearward to form an upper extending portion. A lower portion of the front end of the upper shell extends rearward to form a lower extending portion. The upper extending portion is spaced from the lower extending portion to form an inserting passageway between the upper extending portion and the lower extending portion. The lower shell is mounted to a bottom surface of the upper shell. The protective mechanism is disposed between the upper shell and the lower shell. The circuit board assembly is disposed between the upper shell and the lower shell.
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: May 6, 2025
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Xiao-Xiang Guan, Ming-Wei Lee, Jin-Huai Mo, Wei-Jian Wen
  • Publication number: 20250111174
    Abstract: A card reader with a protective mechanism includes an upper shell, a lower shell disposed to a bottom surface of the upper shell, a protective mechanism and a circuit board assembly disposed between the upper shell and the lower shell. The protective mechanism includes a front cover, a rear cover covered to a rear of the front cover, two rollers disposed along an up-down direction, two springs, two supporting structures and a plurality of sealing structures. The two springs elastically abut between an inner surface of a top wall of the front cover and one roller along a vertical direction. The two supporting structures are mounted around two opposite sides of the one roller, and two opposite sides of the other roller. The plurality of the sealing structures are disposed at two outer surfaces of the two supporting structures.
    Type: Application
    Filed: April 25, 2024
    Publication date: April 3, 2025
    Inventors: XIAO-XIANG GUAN, MING-WEI LEE, JIN-HUAI MO, WEI-JIAN WEN
  • Patent number: D1071396
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 15, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1071397
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 15, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1084556
    Type: Grant
    Filed: June 14, 2023
    Date of Patent: July 15, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1083252
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: July 8, 2025
    Assignee: Shenzhen TIZE Technology Co., LTD.
    Inventor: Jian Wen
  • Patent number: D1082182
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: July 1, 2025
    Assignee: Shenzhen TIZE Technology Co., LTD.
    Inventor: Jian Wen
  • Patent number: D1080797
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: June 24, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1081040
    Type: Grant
    Filed: June 13, 2024
    Date of Patent: June 24, 2025
    Inventor: Jian Wen
  • Patent number: D1079154
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: June 10, 2025
    Assignee: Shenzhen TIZE Technology Co., LTD.
    Inventor: Jian Wen
  • Patent number: D1077971
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1077972
    Type: Grant
    Filed: September 19, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd
    Inventor: Jian Wen
  • Patent number: D1077973
    Type: Grant
    Filed: November 20, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1077975
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., LTD.
    Inventor: Jian Wen
  • Patent number: D1077976
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., LTD.
    Inventor: Jian Wen
  • Patent number: D1078195
    Type: Grant
    Filed: September 19, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., Ltd.
    Inventor: Jian Wen
  • Patent number: D1078196
    Type: Grant
    Filed: December 6, 2023
    Date of Patent: June 3, 2025
    Assignee: Shenzhen TIZE Technology Co., LTD.
    Inventor: Jian Wen
  • Patent number: D1086910
    Type: Grant
    Filed: June 13, 2024
    Date of Patent: August 5, 2025
    Assignee: Shenzhen TIZE Technology Co., ltd
    Inventor: Jian Wen