Patents by Inventor Jian-yong Liu

Jian-yong Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a semiconductor package and structure thereof
    Patent number: 8138584
    Abstract: An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (34, 46) over an encapsulant (32). The conductive layer includes a combination of a conductive glue (38, 48, 52) and a metal paint (36, 50). A wire loop (30) is coupled to the conductive layer and a leadframe (10).
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: March 20, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Zhi-jie Wang, Jian-yong Liu
  • METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF
    Publication number: 20090184403
    Abstract: An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (34, 46) over an encapsulant (32). The conductive layer includes a combination of a conductive glue (38, 48, 52) and a metal paint (36, 50). A wire loop (30) is coupled to the conductive layer and a leadframe (10).
    Type: Application
    Filed: September 14, 2005
    Publication date: July 23, 2009
    Applicant: FREESCALE SEMICONDUCTOR. INC.
    Inventors: Zhi-Jie Wang, Jian-Yong Liu