Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: A multi-purpose engine-driven heat pump system which used solenoid valves, 3-way valves and 4-way valves to control the circulation path of coolant and water to perform various air-conditioning functions as follows: the house-cooling function only, a combination of the house-cooling function and the hot water generating function, the house-heating function only, a combination of the house-heating function and the hot water generating function, a combination of the house-heating function and the ice water generating function, the defumidifying function only, a combination of the dehumidifying function and the hot water generating function, the defrosting function only, and a combination of the ice water generating function and the hot water generating function.