Abstract: Embodiments of a glass wafer for semiconductor fabrication processes are described herein. In some embodiments, a glass wafer includes: a glass substrate comprising: a top surface, a bottom surface opposing the top surface, and an edge surface between the top surface and the bottom surface; a first coating disposed atop the glass substrate, wherein the first coating is a doped crystalline silicon coating having a sheet-resistance of 100 to 1,000,000 ohm per square; and a second coating having one or more layers disposed atop the glass substrate, wherein the second coating comprises a silicon containing coating, wherein the glass wafer has an average transmittance (T) of less than 50% over an entire wavelength range of 400 nm to 1000 nm.

Abstract: Methods of producing a glass article include melting a first glass composition and feeding a second glass composition into the melter. Both glass compositions include the same combination of components but at least one component has a concentration that is different in each. At least three glass articles may be drawn from the melter, including: a first glass article formed from the first glass composition; at least one intermediate glass article composed of neither the first nor the second glass composition; and a final glass article not composed of the first glass composition. The concentration of the at least one component in the intermediate glass article may be between the concentration in the first and second glass compositions. The first glass article and final glass article may have differing values for certain properties, and the intermediate glass article may have an intermediate set of values for the same properties.

Abstract: Methods of producing a glass article include melting a first glass composition and feeding a second glass composition into the melter. Both glass compositions include the same combination of components but at least one component has a concentration that is different in each. At least three glass articles may be drawn from the melter, including: a first glass article formed from the first glass composition; at least one intermediate glass article composed of neither the first nor the second glass composition; and a final glass article not composed of the first glass composition. The concentration of the at least one component in the intermediate glass article may be between the concentration in the first and second glass compositions. The first glass article and final glass article may have differing values for certain properties, and the intermediate glass article may have an intermediate set of values for the same properties.

Abstract: Methods of producing a glass article include melting a first glass composition and feeding a second glass composition into the melter. Both glass compositions include the same combination of components but at least one component has a concentration that is different in each. At least three glass articles may be drawn from the melter, including: a first glass article formed from the first glass composition; at least one intermediate glass article composed of neither the first nor the second glass composition; and a final glass article not composed of the first glass composition. The concentration of the at least one component in the intermediate glass article may be between the concentration in the first and second glass compositions. The first glass article and final glass article may have differing values for certain properties, and the intermediate glass article may have an intermediate set of values for the same properties.

Abstract: A glass-ceramic article that includes an article having a glass-ceramic composition, the composition including: SiO2 from about 45% to about 65%, Al2O3 from about 14% to about 28%, TiO2 from about 2% to about 4%, ZrO2 from about 3% to about 4.5%, MgO from about 4.5% to about 12%, and ZnO from about 0.1 to about 4% (by weight of oxide). The article can include a coefficient of thermal expansion (CTE) of about 20×10?7 K?1 to about 160×10?7 K?1, as measured over a temperature range from 25° C. to 300° C.

Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.

Abstract: Embodiments of the present disclosure include a optical assembly comprising: an axicon lens with spherical aberration configured to generate the laser beam focal line, an optical element set spaced part from the optical lens, and a focusing optical element spaced apart from the optical element set, wherein the axicon lens and the optical element set are translatable relative to each other along the laser beam propagation direction and wherein the focusing optical element is in a fixed position along the laser beam propagation direction.

Abstract: An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.

Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.

Abstract: Embodiments of a glass wafer for semiconductor fabrication processes are described herein. In some embodiments, a glass wafer includes: a glass substrate comprising: a top surface, a bottom surface opposing the top surface, and an edge surface between the top surface and the bottom surface; a first coating disposed atop the glass substrate, wherein the first coating is a doped crystalline silicon coating having a sheet-resistance of 100 to 1,000,000 ohm per square; and a second coating having one or more layers disposed atop the glass substrate, wherein the second coating comprises a silicon containing coating, wherein the glass wafer has an average transmittance (T) of less than 50% over an entire wavelength range of 400 nm to 1000 nm.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A glass-ceramic article that includes an article having a glass-ceramic composition, the composition including: SiO0 from about 45% to about 65%, Al2O3 from about 14% to about 28%, TiO2 from about 2% to about 4%, ZrO2 from about 3% to about 4.5%, MgO from about 4.5% to about 12%, and ZnO from about 0.1 to about 4% (by weight of oxide). The article can include a coefficient of thermal expansion (CTE) of about 20×10?7K?1 to about 160×10?7K?1, as measured over a temperature range from 25° C. to 300° C.

Abstract: Methods of producing a glass article include melting a first glass composition and feeding a second glass composition into the melter. Both glass compositions include the same combination of components but at least one component has a concentration that is different in each. At least three glass articles may be drawn from the melter, including: a first glass article formed from the first glass composition; at least one intermediate glass article composed of neither the first nor the second glass composition; and a final glass article not composed of the first glass composition. The concentration of the at least one component in the intermediate glass article may be between the concentration in the first and second glass compositions. The first glass article and final glass article may have differing values for certain properties, and the intermediate glass article may have an intermediate set of values for the same properties.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: The disclosure is directed to a transparent armor laminate having a glass, glass-ceramic or ceramic strike face layer, one or a plurality of glass, glass-ceramic (“GC”), ceramic (“C”) or polymeric (“P”) backing layer behind the strike face layer, one or a plurality of spall catcher (“SC”) layers behind the backing layer(s), and a thin cover glass layer laminated to the strike face, the thin layer being the first layer to be impacted by any incoming projectile or debris. The cover glass has a thickness ?3 mm. In another embodiment the cover glass thickness is ?1 mm. Additionally, a defrosting/defogging element is laminated between the cover glass and the strike face.

Abstract: The disclosure is directed to a transparent armor laminate having a glass, glass-ceramic or ceramic strike face layer, one or a plurality of glass, glass-ceramic (“GC”), ceramic (“C”) or polymeric (“P”) backing layer behind the strike face layer, one or a plurality of spall catcher (“SC”) layers behind the backing layer(s), and a thin cover glass layer laminated to the strike face, the thin layer being the first layer to be impacted by any incoming projectile or debris. The cover glass has a thickness ?3 mm. In another embodiment the cover glass thickness is ?1 mm. Additionally, a defrosting/defogging element is laminated between the cover glass and the strike face.