Patents by Inventor Jian-Zhi Jay Zhang

Jian-Zhi Jay Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11370693
    Abstract: A glass-ceramic article that includes an article having a glass-ceramic composition, the composition including: SiO2 from about 45% to about 65%, Al2O3 from about 14% to about 28%, TiO2 from about 2% to about 4%, ZrO2 from about 3% to about 4.5%, MgO from about 4.5% to about 12%, and ZnO from about 0.1 to about 4% (by weight of oxide). The article can include a coefficient of thermal expansion (CTE) of about 20×10?7 K?1 to about 160×10?7 K?1, as measured over a temperature range from 25° C. to 300° C.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: June 28, 2022
    Assignee: Corning Incorporated
    Inventors: Marie Jacqueline Monique Comte, Indrajit Dutta, Jian-Zhi Jay Zhang
  • Patent number: 11328950
    Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: May 10, 2022
    Assignee: Corning Incorporated
    Inventors: Ya-Huei Chang, Jen-Chieh Lin, Jian-Zhi Jay Zhang
  • Publication number: 20220134475
    Abstract: Embodiments of the present disclosure include a optical assembly comprising: an axicon lens with spherical aberration configured to generate the laser beam focal line, an optical element set spaced part from the optical lens, and a focusing optical element spaced apart from the optical element set, wherein the axicon lens and the optical element set are translatable relative to each other along the laser beam propagation direction and wherein the focusing optical element is in a fixed position along the laser beam propagation direction.
    Type: Application
    Filed: October 26, 2021
    Publication date: May 5, 2022
    Inventors: Andreas Simon Gaab, Anping Liu, Jian-Zhi Jay Zhang
  • Publication number: 20220140227
    Abstract: An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.
    Type: Application
    Filed: November 1, 2021
    Publication date: May 5, 2022
    Inventors: Indrani Bhattacharyya, Julia Anne Dorothee Brueckner, Ya-Huei Chang, Bokyung Kong, Prantik Mazumder, Jun Ro Yoon, Jian-Zhi Jay Zhang
  • Publication number: 20210225693
    Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 22, 2021
    Inventors: Ya-Huei Chang, Jen-Chieh Lin, Jian-Zhi Jay Zhang
  • Publication number: 20210159076
    Abstract: Embodiments of a glass wafer for semiconductor fabrication processes are described herein. In some embodiments, a glass wafer includes: a glass substrate comprising: a top surface, a bottom surface opposing the top surface, and an edge surface between the top surface and the bottom surface; a first coating disposed atop the glass substrate, wherein the first coating is a doped crystalline silicon coating having a sheet-resistance of 100 to 1,000,000 ohm per square; and a second coating having one or more layers disposed atop the glass substrate, wherein the second coating comprises a silicon containing coating, wherein the glass wafer has an average transmittance (T) of less than 50% over an entire wavelength range of 400 nm to 1000 nm.
    Type: Application
    Filed: November 25, 2020
    Publication date: May 27, 2021
    Inventors: Ya-Huei Chang, Karl William Koch, III, Jen-Chieh Lin, Jian-Zhi Jay Zhang
  • Patent number: 10926290
    Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: February 23, 2021
    Assignee: CORNING INCORPORATED
    Inventors: Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack, Jian-Zhi Jay Zhang
  • Publication number: 20200239352
    Abstract: A glass-ceramic article that includes an article having a glass-ceramic composition, the composition including: SiO0 from about 45% to about 65%, Al2O3 from about 14% to about 28%, TiO2 from about 2% to about 4%, ZrO2 from about 3% to about 4.5%, MgO from about 4.5% to about 12%, and ZnO from about 0.1 to about 4% (by weight of oxide). The article can include a coefficient of thermal expansion (CTE) of about 20×10?7K?1 to about 160×10?7K?1, as measured over a temperature range from 25° C. to 300° C.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 30, 2020
    Inventors: Marie Jacqueline Monique Comte, Indrajit Dutta, Jian-Zhi Jay Zhang
  • Publication number: 20200062630
    Abstract: Methods of producing a glass article include melting a first glass composition and feeding a second glass composition into the melter. Both glass compositions include the same combination of components but at least one component has a concentration that is different in each. At least three glass articles may be drawn from the melter, including: a first glass article formed from the first glass composition; at least one intermediate glass article composed of neither the first nor the second glass composition; and a final glass article not composed of the first glass composition. The concentration of the at least one component in the intermediate glass article may be between the concentration in the first and second glass compositions. The first glass article and final glass article may have differing values for certain properties, and the intermediate glass article may have an intermediate set of values for the same properties.
    Type: Application
    Filed: August 16, 2019
    Publication date: February 27, 2020
    Inventors: Indrajit Dutta, Jean Marc Galea, Melinda Ann Hourihan, Lisa Ann Lamberson, Robert Michael Morena, Jian-Zhi Jay Zhang
  • Publication number: 20190126316
    Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 2, 2019
    Inventors: Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack, Jian-Zhi Jay Zhang
  • Patent number: 10195643
    Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: February 5, 2019
    Assignee: Corning Incorporated
    Inventors: Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack, Jian-Zhi Jay Zhang
  • Publication number: 20180104716
    Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
    Type: Application
    Filed: July 26, 2017
    Publication date: April 19, 2018
    Inventors: Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack, Jian-Zhi Jay Zhang
  • Patent number: 9724727
    Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: August 8, 2017
    Assignee: CORNING INCORPORATED
    Inventors: Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack, Jian-Zhi Jay Zhang
  • Publication number: 20150225285
    Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
    Type: Application
    Filed: February 10, 2015
    Publication date: August 13, 2015
    Inventors: Jeffrey John Domey, Matthew Wade Fenton, Govindarajan Natarajan, Paul John Shustack, Jian-Zhi Jay Zhang
  • Patent number: 8640591
    Abstract: The disclosure is directed to a transparent armor laminate having a glass, glass-ceramic or ceramic strike face layer, one or a plurality of glass, glass-ceramic (“GC”), ceramic (“C”) or polymeric (“P”) backing layer behind the strike face layer, one or a plurality of spall catcher (“SC”) layers behind the backing layer(s), and a thin cover glass layer laminated to the strike face, the thin layer being the first layer to be impacted by any incoming projectile or debris. The cover glass has a thickness ?3 mm. In another embodiment the cover glass thickness is ?1 mm. Additionally, a defrosting/defogging element is laminated between the cover glass and the strike face.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: February 4, 2014
    Assignees: Corning Incorporated, The United States of America as Represented by the Secretary of the Army
    Inventors: Leonard Charles Dabich, II, Huan-Hung Sheng, Steven Alvin Tietje, Jian-Zhi Jay Zhang, Parimal J. Patel
  • Publication number: 20120174761
    Abstract: The disclosure is directed to a transparent armor laminate having a glass, glass-ceramic or ceramic strike face layer, one or a plurality of glass, glass-ceramic (“GC”), ceramic (“C”) or polymeric (“P”) backing layer behind the strike face layer, one or a plurality of spall catcher (“SC”) layers behind the backing layer(s), and a thin cover glass layer laminated to the strike face, the thin layer being the first layer to be impacted by any incoming projectile or debris. The cover glass has a thickness ?3 mm. In another embodiment the cover glass thickness is ?1 mm. Additionally, a defrosting/defogging element is laminated between the cover glass and the strike face.
    Type: Application
    Filed: June 27, 2011
    Publication date: July 12, 2012
    Inventors: Leonard Charles Dabich, II, Huan-Hung Sheng, Steven Alvin Tietje, Jian-Zhi Jay Zhang, Parimal J. Patel
  • Patent number: 8161862
    Abstract: A transparent armor laminate system is described that utilizes a glass-ceramic material as the strike-face material, one or a plurality of intermediate layers, and a backing material. This laminate system offers improved performance with reduced weight over conventional all-glass or all-glass-ceramic transparent armor systems. The glass-ceramic material consists of a glass phase and a crystalline phase, the crystalline phase being selected from a group consisting of beta-quartz, mullite and combinations thereof.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: April 24, 2012
    Assignee: Corning Incorporated
    Inventors: Linda Ruth Pinckney, Jian-Zhi Jay Zhang
  • Publication number: 20110088541
    Abstract: This disclosure teaches the use of low density, “open”-structure glasses as backing glasses, behind glass-ceramic strike-faces, in transparent armor composite windows. These low density “open-structure’ glasses are sometimes referred to as “anomalous” glasses. For transparent armor applications both silica, including fused silica, and borosilicate glasses can be used as backing glass. These backing glasses provide improved ballistics performance over that of standard commercial soda lime backing glass. These glasses should be used either in their as-formed state (e.g. float surfaces) or should be finished using a process designed for minimizing sub-surface damage.
    Type: Application
    Filed: September 29, 2010
    Publication date: April 21, 2011
    Inventors: Linda Ruth Pinckney, Robert A. Schaut, Steven Alvin Tietje, Jian-Zhi Jay Zhang
  • Patent number: 7875565
    Abstract: The invention is directed to transparent glass-ceramic materials for use in transparent armor systems. Applications include armor systems for ground vehicles and aircraft as well as personal protective equipment. The glass-ceramic materials according to the invention exhibit a ballistic limit vs. areal density line slope of 1.0 or greater, preferably 1.1 or greater and more preferably 1.2 or greater. The crystalline phase of the glass ceramic materials may include ?-quartz, spinel, spinel solid solutions, mullite and phases known in the art to be transparent.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: January 25, 2011
    Assignee: Corning Incorporated
    Inventors: Linda Ruth Pinckney, Jian-Zhi Jay Zhang, Carl Franklin Cline
  • Publication number: 20100275767
    Abstract: A transparent armor laminate system includes a plurality of sub-stacks separated by an interlayer. The sub-stacks include a plurality of layers including a glass ceramic front strike-face layer, a backing layer comprising a spall-resistant material, and at least one glass layer laminated between the strike-face and backing layers. The interlayer isolates cracks between sub-stacks, and may include an isolating material such as a polymer, gas, or liquid. The laminate system offers improved performance with reduced weight over conventional all-glass or all-glass-ceramic transparent armors.
    Type: Application
    Filed: August 27, 2008
    Publication date: November 4, 2010
    Inventors: Linda Ruth Pinckney, Huan-Hung Sheng, Steven Alvin Tietje, Jian-Zhi Jay Zhang