Abstract: A self-powered piezoelectric energy harvesting microsystem device has CMOS integrated circuit elements, contacts and interconnections formed at a proof mass portion of a die region of a semiconductor wafer. Piezoelectric energy harvesting unit components connected to the integrated circuit elements are formed at a thinned beam portion of the die region that connects the proof mass portion for vibration relative to a surrounding anchor frame portion. A battery provided on the proof mass portion connects to the integrated circuit elements. In a cantilever architectural example, the battery is advantageously located at a distal end of the proof mass portion, opposite the joinder with frame portion via the beam portion.

Abstract: A self-powered piezoelectric energy harvesting microsystem device has CMOS integrated circuit elements, contacts and interconnections formed at a proof mass portion of a die region of a semiconductor wafer. Piezoelectric energy harvesting unit components connected to the integrated circuit elements are formed at a thinned beam portion of the die region that connects the proof mass portion for vibration relative to a surrounding anchor frame portion. A battery provided on the proof mass portion connects to the integrated circuit elements. In a cantilever architectural example, the battery is advantageously located at a distal end of the proof mass portion, opposite the joinder with frame portion via the beam portion.

Abstract: A self-powered piezoelectric energy harvesting microsystem device has CMOS integrated circuit elements, contacts and interconnections formed at a proof mass portion of a die region of a semiconductor wafer. Piezoelectric energy harvesting unit components connected to the integrated circuit elements are formed at a thinned beam portion of the die region that connects the proof mass portion for vibration relative to a surrounding anchor frame portion. A battery provided on the proof mass portion connects to the integrated circuit elements. In a cantilever architectural example, the battery is advantageously located at a distal end of the proof mass portion, opposite the joinder with frame portion via the beam portion.

Abstract: A piezoelectric energy harvester device has a cantilevered structure with a rectangular proof mass portion defined by holes through a substrate along three sides of a proof mass portion and supported by a thinned hinge portion for free pivotal movement relative to an anchor portion. Elongated strips of piezoelectric energy harvesting units are formed in side-by-side spaced positions on the hinge portion and aligned parallel or perpendicular to a stress direction. Multiplexing electronics coupled to contact pads on the anchor portion selectively connects different strip combinations to power management circuitry, responsive to variations in vibration magnitude or modes.

Abstract: A piezoelectric energy harvester device has a cantilevered structure with a rectangular proof mass portion defined by holes through a substrate along three sides of a proof mass portion and supported by a thinned hinge portion for free pivotal movement relative to an anchor portion. Elongated strips of piezoelectric energy harvesting units are formed in side-by-side spaced positions on the hinge portion and aligned parallel or perpendicular to a stress direction. Multiplexing electronics coupled to contact pads on the anchor portion selectively connects different strip combinations to power management circuitry, responsive to variations in vibration magnitude or modes.

Abstract: A self-powered piezoelectric energy harvesting microsystem device has CMOS integrated circuit elements, contacts and interconnections formed at a proof mass portion of a die region of a semiconductor wafer. Piezoelectric energy harvesting unit components connected to the integrated circuit elements are formed at a thinned beam portion of the die region that connects the proof mass portion for vibration relative to a surrounding anchor frame portion. A battery provided on the proof mass portion connects to the integrated circuit elements. In a cantilever architectural example, the battery is advantageously located at a distal end of the proof mass portion, opposite the joinder with frame portion via the beam portion.