Abstract: An array substrate has a display area and a bonding area located on a side of the display area. The array substrate includes a base, a plurality of first transistors, a plurality of conductive pins and a plurality of conductive electrodes. The plurality of first transistors are disposed on a side of the base and located in the display area; a first transistor includes a first gate, a first source and a first drain. The plurality of conductive pins are disposed on the side of the base and located in the bonding area, and are disposed in a same layer as the first gate. The plurality of conductive electrodes are each disposed on a respective one of surfaces of the plurality of conductive pins away from the base.

Abstract: A transaction data processing method includes: determining one or more transaction key values and one or more transaction feature values of a to-be-processed transaction according to transaction information of the to-be-processed transaction; determining a rule union corresponding to the to-be-processed transaction according to the one or more transaction key values, the rule union including a plurality of to-be-matched rules; matching the one or more transaction feature values of the to-be-processed transaction sequentially with the plurality of to-be-matched rules in the rule union to obtain a rule matching result of the to-be-processed transaction; and performing a billing process of the to-be-processed transaction according to the rule matching result.

Abstract: A payment code generation method and device, for use in solving the problem that additional information prompt cannot be performed due to less information in a payment code. The method comprises: receiving a payment code generation request sent by a terminal, the payment code generation request comprising a payment-related object identifier (301); obtaining payment information of a payment-related object and an affiliated feature identifier of the payment-related object according to the payment-related object identifier (302); determining affiliated information of the payment-related object according to the affiliated feature identifier of the payment-related object (303); and generating a payment code generation response according to the payment information and affiliated information of the payment-related object, and sending the payment code generation response to the terminal, such that the terminal generates a payment code according to the payment code generation response (304).

Abstract: The present disclosure provides a thin-film transistor and a method for manufacturing the same, an array substrate, and a display device. The thin film transistor of the present disclosure include a plurality of insulating layers, among which at least one insulating layer on the low temperature polysilicon layer comprises organic material, so vias could be formed in the organic material by an exposing and developing process, thereby effectively avoiding the over-etching problem of the low temperature polycrystalline silicon layer caused by dry etching process. By adopting the method for manufacturing the film transistors of the present disclosure, the contact area and uniformity of the drain electrode and the low temperature polysilicon material layer can be increased; the conductivity can be improved; and the production cycle of products can be greatly reduced and thereby improving the equipment capacity.

Abstract: An array substrate has a display area and a bonding area located on a side of the display area. The array substrate includes a base, a plurality of first transistors, a plurality of conductive pins and a plurality of conductive electrodes. The plurality of first transistors are disposed on a side of the base and located in the display area; a first transistor includes a first gate, a first source and a first drain. The plurality of conductive pins are disposed on the side of the base and located in the bonding area, and are disposed in a same layer as the first gate. The plurality of conductive electrodes are each disposed on a respective one of surfaces of the plurality of conductive pins away from the base.

Abstract: The present disclosure provides a thin-film transistor and a method for manufacturing the same, an array substrate, and a display device. The thin film transistor of the present disclosure include a plurality of insulating layers, among which at least one insulating layer on the low temperature polysilicon layer comprises organic material, so vias could be formed in the organic material by an exposing and developing process, thereby effectively avoiding the over-etching problem of the low temperature polycrystalline silicon layer caused by dry etching process. By adopting the method for manufacturing the film transistors of the present disclosure, the contact area and uniformity of the drain electrode and the low temperature polysilicon material layer can be increased; the conductivity can be improved; and the production cycle of products can be greatly reduced and thereby improving the equipment capacity.

Abstract: Disclosed in the present invention are a method and a device for foreign exchange purchase transactions, said method comprising: predicting, according to historical transaction data, a predicted total foreign exchange purchase amount within a first set deadline; within an exchange rate stabilization period of the first set deadline, initiating a foreign exchange purchase transaction request according to the predicted total foreign exchange purchase amount, the foreign exchange purchase transaction request being used for purchasing, according to the exchange rate within the exchange rate stabilization period, foreign exchange of the predicted total foreign exchange purchase amount; after the first predetermined deadline expires, acquiring an actual total foreign exchange purchase amount within the first predetermined deadline; and performing transaction clearing according to the actual total foreign exchange purchase amount and the predicted total foreign exchange purchase amount.

Abstract: A backlight module and a display device are provided. The backlight module includes a back plate, a reflector plate provided on a bottom surface of the back plate, and a spacer provided between the bottom surface of the back plate and the reflector plate and configured to keep a certain spacing between the bottom surface of the back plate and the reflector plate. The display device includes the backlight module. The display device has improved display quality.

Abstract: The present disclosure discloses a display module support frame and a display device. A display module support frame includes a machine support that is detachably connected to a display module. The machine support includes a horizontal supporting beam, two vertical supporting beams and two auxiliary supporting beams. The two vertical supporting beams are parallel, and face to each other. One end of each of the two vertical supporting beams is fixedly connected to the horizontal supporting beam. One end of each of the auxiliary supporting beams is fixedly connected to the horizontal supporting beam, and the other end thereof is fixedly connected to the vertical supporting beam.

Abstract: The present subject matter provides a packaging assembly. The packaging assembly includes an inner protection layer which fits and is in contact with a surface of an object to be packaged, and an outer protection layer which covers the inner protection layer. The materials of the outer protection layer and the inner protection layer have different elastic coefficients.

Abstract: Embodiments of the an adhesive bonded structure of a support component of a display device includes a first structural member, a second structural member, and an adhesive bonding the first structural member and the second structural member together. The adhesive includes a first adhesive and a second adhesive. The first adhesive has a better deformation resistance than that of the second adhesive, and the second adhesive has a better bonding property than that of the first adhesive.

Abstract: Disclosed are a system and method for controlling dynamic backlight source of ELED, wherein the backlight source signal processing circuit is used for obtaining SOC picture signals, decoding the SOC picture signals into light and dark signals, and transmitting the light and dark signals to the optical processing board; the optical processing board is provided with a transparent substrate; the optical processing board receives the light and dark signals, and controls the on and off states of light valves on the transparent substrate in real time according to the light and dark signals; the backlight source driving board provides electric power for the backlight source signal processing circuit and the static plane backlight source; and the static plane backlight source is used for providing a dynamic light source for a liquid crystal display panel through the transparent substrate. Thus the disclosure realizes a dynamic picture display.

Abstract: The present disclosure discloses a display module support frame and a display device. This display module support frame includes a machine support that is detachably connected to a display module. The machine support includes a horizontal supporting beam, two vertical supporting beams and two auxiliary supporting beams. The two vertical supporting beams are parallel, and face to each other. One end of each of the two vertical supporting beams is fixedly connected to the horizontal supporting beam. One end of each of the auxiliary supporting beams is fixedly connected to the horizontal supporting beam, and the other end thereof is fixedly connected to the vertical supporting beam.

Abstract: A backlight module and a display device including the backlight module are provided. The backlight module includes a rear plate and a light guide plate, the rear plate includes a side wall and an accommodating groove defined at least partially by the side wall; the light guide plate is located in the accommodating groove and a resilient part is provided between at least one lateral surface of the light guide plate and the side wall, opposite to the lateral surface, of the rear plate. The resilient part may be elastically compressed in a case of the thermal expansion of the light guide plate, to provide cushion for the extending deformation of the light guide plate, and thus to effectively depress the arch deformation of the light guide plate.

Abstract: The present invention provides a packaging assembly. The packaging assembly comprises: an inner protection layer which fits and is in contact with a surface of an object to be packaged, and an outer protection layer which covers the inner protection layer, wherein materials of the outer protection layer and the inner protection layer have different elastic coefficients.

Abstract: A backlight module and a display device are provided. The backlight module includes a back plate, a reflector plate provided on a bottom surface of the back plate, and a spacer provided between the bottom surface of the back plate and the reflector plate and configured to keep a certain spacing between the bottom surface of the back plate and the reflector plate. The display device includes the backlight module. The display device has improved display quality.