Abstract: A numerically controlled rotary probe switching device based on an environment-controllable atomic force microscope (AFM) includes a cavity upper cover and a probe switching structure. The cavity upper cover is provided with an irregular rectangular boss, an inner groove, a rectangular optical window structure and a sealing flange structure. The irregular rectangular boss is provided with the rectangular optical window structure; a front end of the boss is provided with the sealing flange structure; and a lower portion of the boss is provided with an inner groove for accommodating the probe switching structure and a transition groove for matching with a linear movement of a sample carrier and a rotary switching of probes. The probe switching structure is configured inside the inner groove, and the probe switching structure is provided with at least one probe assembly.

Abstract: A method for designing and processing a microcantilever-based probe with an irregular cross section applied in the ultra-low friction coefficient measurement at a nanoscale single-point contact includes: first, establishing a universal theoretical model of the friction coefficient measurement; then, combined with the structural features of the microcantilever-based probe with the irregular cross section, establishing a specific theoretical model of the friction coefficient measurement suitable for the microcantilever-based probe with the irregular cross section; and based on above, combined with constraint conditions such as the friction coefficient resolution, the loadable maximum positive pressure or the measurable minimum friction force, and the atomic force microscope characteristics, etc., designing the microcantilever-based probe with the irregular cross section meeting the measurement requirements.

Abstract: A method for designing and processing a microcantilever-based probe with an irregular cross section applied in the ultra-low friction coefficient measurement at a nanoscale single-point contact includes: first, establishing a universal theoretical model of the friction coefficient measurement; then, combined with the structural features of the microcantilever-based probe with the irregular cross section, establishing a specific theoretical model of the friction coefficient measurement suitable for the microcantilever-based probe with the irregular cross section; and based on above, combined with constraint conditions such as the friction coefficient resolution, the loadable maximum positive pressure or the measurable minimum friction force, and the atomic force microscope characteristics, etc., designing the microcantilever-based probe with the irregular cross section meeting the measurement requirements.

Abstract: A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.

Abstract: A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.

Abstract: A device for measuring a thickness of a slurry used in a chemical mechanical polishing apparatus and a method using the same are provided. The chemical mechanical polishing apparatus comprises a polishing head (10), a rotary table (20), a polishing platen (30) and a polishing pad (40). The device for measuring the thickness of the slurry comprises: a distance sensor (50) disposed in the polishing platen (30) for measuring a distance between the distance sensor (50) and a wafer (11) in the polishing head (10); a processing unit (70) (60) disposed in the rotary table (20) and connected to the distance sensor (50) for converting a measuring signal from the distance sensor (50) into standard electrical signal; a processing unit (70) connected to distance converters (60) for acquiring the standard electrical signal to obtain a thickness of the slurry between the polishing head (10) and the polishing pad (40).

Abstract: The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry.

Abstract: The pad conditioner head for conditioning a polishing pad comprises a bearing seat, a spindle, a protective cover, an annular pressure plate, a self-adaptive platen, a diamond disk and a flexible ring. A flange is mounted on the lower end of the spindle. A press ring is mounted onto a lower surface of the flange. The flexible ring has an upper edge sandwiched between the flange and the press ring and a lower edge sandwiched between the protective cover and the annular pressure plate. The flexible ring, the flange, the annular pressure plate and the self-adaptive platen define a sealed chamber (M). The protective cover, the annular pressure plate, the self-adaptive platen and the diamond disk are rotatable along with the spindle through the flexible ring and movable in an up and down direction relative to the spindle via a deformation of the flexible ring.

Abstract: A carbon nanotube-based solar cell and fabricating method thereof are provided. The method is achieved by applying carbon nanotube film (1) photoelectric conversion material and an upper electrode simultaneously. The method improves photoelectric conversion efficiency and life time of the solar cell, the fabricating method of the solar cell is simple, and the fabricating cost is low.