Patents by Inventor Jianbin TU

Jianbin TU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode (LED) package and method for manufacturing the same
    Patent number: 12237452
    Abstract: A light emitting diode (LED) package includes a substrate, a metal stage, at least one LED chip and a packaging material. The substrate has an super surface, and a lower surface opposite to the upper surface. The metal stage is formed on the upper surface of the substrate, and has a lumpy structure. The LED chip is mounted on the metal stage. The packaging material covers the LED chip, the metal stage and the substrate. The packaging material and the lumpy structure of the metal stage are engaged with each other.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: February 25, 2025
    Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Jianbin Tu, Junpeng Shi, Weng-Tack Wong, Yanqiu Liao, Chen-ke Hsu
  • Packaged ultraviolet light-emitting device and production method thereof
    Patent number: 12046704
    Abstract: A packaged ultraviolet light-emitting device includes a support member, at least one ultraviolet light-emitting chip, and an encapsulating cover. The support member has opposite top and bottom surfaces, a side surface interconnecting the top and bottom surfaces, and at least one indentation. The ultraviolet light-emitting chip is disposed on the top surface of the support member. The encapsulating cover is made from a fluorine-containing resin, and is disposed over and in contact with the ultraviolet light-emitting chip and the top surface and the indentation of the support member. The encapsulating cover extends into the indentation. A production method of the packaged ultraviolet light-emitting device is also disclosed.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: July 23, 2024
    Assignee: Xiamen San'An Optoelectronics Technology Co., Ltd.
    Inventors: Jianbin Tu, Yanqiu Liao, Junpeng Shi, Chih-wei Chao, Weng-Tack Wong, Chen-ke Hsu
  • LIGHT EMITTING DIODE (LED) PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210343916
    Abstract: A light emitting diode (LED) package includes a substrate, a metal stage, at least one LED chip and a packaging material. The substrate has an super surface, and a lower surface opposite to the upper surface. The metal stage is formed on the upper surface of the substrate, and has a lumpy structure. The LED chip is mounted on the metal stage. The packaging material covers the LED chip, the metal stage and the substrate. The packaging material and the lumpy structure of the metal stage are engaged with each other.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Inventors: Jianbin Tu, Junpeng Shi, Weng-Tack Wong, Yanqiu Liao, Chen-ke Hsu
  • PACKAGED ULTRAVIOLET LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF
    Publication number: 20210184087
    Abstract: A packaged ultraviolet light-emitting device includes a support member, at least one ultraviolet light-emitting chip, and an encapsulating cover. The support member has opposite top and bottom surfaces, a side surface interconnecting the top and bottom surfaces, and at least one indentation. The ultraviolet light-emitting chip is disposed on the top surface of the support member. The encapsulating cover is made from a fluorine-containing resin, and is disposed over and in contact with the ultraviolet light-emitting chip and the top surface and the indentation of the support member. The encapsulating cover extends into the indentation. A production method of the packaged ultraviolet light-emitting device is also disclosed.
    Type: Application
    Filed: March 1, 2021
    Publication date: June 17, 2021
    Inventors: Jianbin TU, Yanqiu LIAO, Junpeng SHI, Chih-wei CHAO, Weng-Tack WONG