Patents by Inventor Jian-Cheng WU

Jian-Cheng WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071776
    Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 29, 2024
    Inventors: DEI-CHENG LIU, CHIA-SHUAI CHANG, MING-YEN PAN, JIAN-YU SHIH, JHIH-WEI LAI, SHIH-HAN WU
  • Patent number: 9336317
    Abstract: A search system for collecting aliases associated with an entity name, includes a storage module configured to store at least one first lexical pattern, a search module coupled to the storage module and configured to obtain a plurality of first snippets from a database according to the entity name, and an alias extracting module coupled to the storage module and the search module separately and configured to, according to the entity name and the first lexical pattern, determine whether any first alias exists in the first snippets. If a first alias exists, the alias extracting module extracts it out and stores it in the storage module.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: May 10, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Hsien Li, Jason S. Chang, Jian-Cheng Wu, Hung-Ting Hsieh
  • Publication number: 20140324898
    Abstract: A search system for collecting aliases associated with an entity name, includes a storage module configured to store at least one first lexical pattern, a search module coupled to the storage module and configured to obtain a plurality of first snippets from a database according to the entity name, and an alias extracting module coupled to the storage module and the search module separately and configured to, according to the entity name and the first lexical pattern, determine whether any first alias exists in the first snippets. If a first alias exists, the alias extracting module extracts it out and stores it in the storage module.
    Type: Application
    Filed: March 21, 2014
    Publication date: October 30, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Hsien LI, Jason S. CHANG, Jian-Cheng WU, Hung-Ting HSIEH