Patents by Inventor Jiang hua Java Zhu

Jiang hua Java Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded SiP package with reinforced solder columns
    Patent number: 8878346
    Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 4, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Method of reducing mechanical stress on a semiconductor die during fabrication
    Patent number: 7435624
    Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: October 14, 2008
    Assignee: SanDisk Corporation
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Molded SiP package with reinforced solder columns
    Publication number: 20070252254
    Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu