Patents by Inventor Jiang Java Zhu

Jiang Java Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing mechanical stress on a semiconductor die during fabrication
    Publication number: 20070254407
    Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Java Zhu, Jack Chang-Chien, Cheemen Yu