Patents by Inventor Jiang Jun
Jiang Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12336139Abstract: A server device includes a casing, a flow equalizing plate and a server. The casing has an accommodating space, a liquid inlet and a liquid outlet. The accommodating space accommodates a cooling liquid. The accommodating space is in fluid communication with the liquid inlet and the liquid outlet. The flow equalizing plate is detachably located in the accommodating space. The flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace. The flow equalizing plate has through holes. The through holes are in fluid communication with the upper subspace and the lower subspace. The liquid inlet is in fluid communication with the lower subspace. The liquid outlet is in fluid communication with the upper subspace. The server is located in the upper subspace. The liquid inlet and the liquid outlet are in fluid communication with the server. Sizes of the through holes are different.Type: GrantFiled: June 14, 2023Date of Patent: June 17, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC TECHNOLOGY CORPORATIONInventors: Jiaqing Ji, Jiang-Jun Wu, Ke Sun
-
Patent number: 12317448Abstract: A liquid cooling plate is configured to be in thermal contact with at least one first heat source and at least one second heat source. The liquid cooling plate includes at least one first heat dissipation part and a second heat dissipation part. The first heat dissipation part is configured to be in thermal contact with the first heat source and has a fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and configured to be in thermal contact with the second heat source. The second heat dissipation part has a fluid channel, and the fluid channel is in fluid communication with the fluid chamber.Type: GrantFiled: June 14, 2023Date of Patent: May 27, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-jun Wu, Jingnan Zhao, Peng Yu
-
Patent number: 12295123Abstract: A liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connection tube and a second connection tube. The first liquid cooling plate includes a first heat dissipation part and a second heat dissipation part connected to each other. The first heat dissipation part has a first fluid chamber. The second heat dissipation part has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and a fourth heat dissipation part connected to each other. The third heat dissipation part has a second fluid chamber. The fourth heat dissipation part has a second fluid channel in fluid communication with the second fluid chamber. The first connection tube communicates the second fluid chamber with the first fluid chamber. The second connection tube communicates the second fluid channel with the first fluid channel.Type: GrantFiled: June 14, 2023Date of Patent: May 6, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-jun Wu, Jingnan Zhao, Peng Yu
-
Patent number: 12274028Abstract: The present disclosure provides a liquid cooling system for dissipating heat from a heat source, including a liquid cooling module and a liquid leakage detecting module. The liquid cooling module includes a liquid cooling component. The liquid cooling component includes a liquid cooling plate, a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline and the liquid return pipeline are in communication with the liquid cooling plate receptively. The liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches. The liquid leakage detection branches are electrically connected to the hub in parallel, and are provided in the liquid supply pipeline and the liquid return pipeline respectively. The main wire electrically connects the hub to the monitoring device.Type: GrantFiled: March 20, 2023Date of Patent: April 8, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-Jun Wu, Yi-Dong Ji, Pin-Yi Xiang
-
Patent number: 12267986Abstract: The present disclosure provides a cooling device, including a cooling plate and a mounting cover. A lower flow channel is provided in the cooling plate, a top of the cooling plate is provided with a water outlet and two openings. The water outlet is located between the two openings. The mounting cover is sealed on the top of the cooling plate. The mounting cover comprises a first mounting cover and a second mounting cover. The first mounting cover and the cooling plate form an intermediate flow channel, the second mounting cover and the cooling plate form a branch flow channel. The intermediate flow channel is in communication with the two branch flow channels, The first mounting cover is provided with a water inlet, and the two branch flow channels are in communication with the lower flow channel through the two openings.Type: GrantFiled: March 20, 2023Date of Patent: April 1, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-Jun Wu, Yi-Dong Ji, Cheng Han
-
Patent number: 12250790Abstract: A liquid cooling device includes a base plate, a cooling body, and a cover plate. The cooling body includes a frame. A cooling layer is provided in the frame and a reflux layer is provided above the cooling layer. The cooling layer is provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame. The reflux layer is provided with a plurality of reflux channels in communication with the plurality of cooling channels. A periphery of the reflux layer is provided with a drainage flow channel in communication with the plurality of the reflux channels. A center portion of the cover plate being provided with a liquid inlet in communication with the plurality of cooling channels, and the cover plate is further provided with a liquid outlet in communication with the drainage flow channel.Type: GrantFiled: March 20, 2023Date of Patent: March 11, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-Jun Wu, Yi-Dong Ji, Shu-Kang Han, Ke Sun
-
Patent number: 12222261Abstract: A liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches electrically connected to the hub in parallel. The hub is electrically connected to the monitoring device though the main wire.Type: GrantFiled: November 11, 2022Date of Patent: February 11, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-Jun Wu, Pin-Yi Xiang
-
Publication number: 20240414890Abstract: A liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connection tube and a second connection tube. The first liquid cooling plate includes a first heat dissipation part and a second heat dissipation part connected to each other. The first heat dissipation part has a first fluid chamber. The second heat dissipation part has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and a fourth heat dissipation part connected to each other. The third heat dissipation part has a second fluid chamber. The fourth heat dissipation part has a second fluid channel in fluid communication with the second fluid chamber. The first connection tube communicates the second fluid chamber with the first fluid chamber. The second connection tube communicates the second fluid channel with the first fluid channel.Type: ApplicationFiled: June 14, 2023Publication date: December 12, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-jun WU, Jingnan ZHAO, Peng YU
-
Publication number: 20240414879Abstract: A liquid cooling plate is configured to be in thermal contact with at least one first heat source and at least one second heat source. The liquid cooling plate includes at least one first heat dissipation part and a second heat dissipation part. The first heat dissipation part is configured to be in thermal contact with the first heat source and has a fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and configured to be in thermal contact with the second heat source. The second heat dissipation part has a fluid channel, and the fluid channel is in fluid communication with the fluid chamber.Type: ApplicationFiled: June 14, 2023Publication date: December 12, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiang-jun WU, Jingnan ZHAO, Peng YU
-
Publication number: 20240407131Abstract: A server device includes a casing, a flow equalizing plate and a server. The casing has an accommodating space, a liquid inlet and a liquid outlet. The accommodating space accommodates a cooling liquid. The accommodating space is in fluid communication with the liquid inlet and the liquid outlet. The flow equalizing plate is detachably located in the accommodating space. The flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace. The flow equalizing plate has through holes. The through holes are in fluid communication with the upper subspace and the lower subspace. The liquid inlet is in fluid communication with the lower subspace. The liquid outlet is in fluid communication with the upper subspace. The server is located in the upper subspace. The liquid inlet and the liquid outlet are in fluid communication with the server. Sizes of the through holes are different.Type: ApplicationFiled: June 14, 2023Publication date: December 5, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Jiaqing JI, Jiang-jun WU, Ke SUN
-
Publication number: 20240090167Abstract: The present disclosure provides a liquid cooling system for dissipating heat from a heat source, including a liquid cooling module and a liquid leakage detecting module. The liquid cooling module includes a liquid cooling component. The liquid cooling component includes a liquid cooling plate, a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline and the liquid return pipeline are in communication with the liquid cooling plate receptively. The liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches. The liquid leakage detection branches are electrically connected to the hub in parallel, and are provided in the liquid supply pipeline and the liquid return pipeline respectively. The main wire electrically connects the hub to the monitoring device.Type: ApplicationFiled: March 20, 2023Publication date: March 14, 2024Inventors: JIANG-JUN WU, YI-DONG JI, PIN-YI XIANG
-
Publication number: 20240085262Abstract: A liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches electrically connected to the hub in parallel. The hub is electrically connected to the monitoring device though the main wire.Type: ApplicationFiled: November 11, 2022Publication date: March 14, 2024Inventors: JIANG-JUN WU, PIN-YI XIANG
-
Publication number: 20240090168Abstract: A liquid cooling device includes a base plate, a cooling body, and a cover plate. The cooling body includes a frame. A cooling layer is provided in the frame and a reflux layer is provided above the cooling layer. The cooling layer is provided with a plurality of cooling channels extending from a center portion of the cooling body to the frame. The reflux layer is provided with a plurality of reflux channels in communication with the plurality of cooling channels. A periphery of the reflux layer is provided with a drainage flow channel in communication with the plurality of the reflux channels. A center portion of the cover plate being provided with a liquid inlet in communication with the plurality of cooling channels, and the cover plate is further provided with a liquid outlet in communication with the drainage flow channel.Type: ApplicationFiled: March 20, 2023Publication date: March 14, 2024Inventors: JIANG-JUN WU, YI-DONG JI, SHU-KANG HAN, KE SUN
-
Publication number: 20240074097Abstract: The present disclosure provides a cooling device, including a cooling plate and a mounting cover. A lower flow channel is provided in the cooling plate, a top of the cooling plate is provided with a water outlet and two openings. The water outlet is located between the two openings. The mounting cover is sealed on the top of the cooling plate. The mounting cover comprises a first mounting cover and a second mounting cover. The first mounting cover and the cooling plate form an intermediate flow channel, the second mounting cover and the cooling plate form a branch flow channel. The intermediate flow channel is in communication with the two branch flow channels, The first mounting cover is provided with a water inlet, and the two branch flow channels are in communication with the lower flow channel through the two openings.Type: ApplicationFiled: March 20, 2023Publication date: February 29, 2024Inventors: JIANG-JUN WU, YI-DONG JI, CHENG HAN
-
Patent number: 8659892Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.Type: GrantFiled: August 8, 2011Date of Patent: February 25, 2014Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Qing-Ping Yan, De-Yu Wang, Jiang-Jun Hu, Chuen-Shu Hou
-
Patent number: 8622118Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.Type: GrantFiled: October 31, 2010Date of Patent: January 7, 2014Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: De-Yu Wang, Chao Xu, Jiang-Jun Hu
-
Publication number: 20120307452Abstract: An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell.Type: ApplicationFiled: September 20, 2011Publication date: December 6, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU, CHUEN-SHU HOU
-
Publication number: 20120307453Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.Type: ApplicationFiled: August 8, 2011Publication date: December 6, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU, CHUEN-SHU HOU
-
Patent number: 8316921Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.Type: GrantFiled: September 4, 2009Date of Patent: November 27, 2012Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Jiang-Jun Hu, Min Lu, De-Yu Wang
-
Publication number: 20120241133Abstract: A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves.Type: ApplicationFiled: June 29, 2011Publication date: September 27, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU