Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.

Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.

Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.

Abstract: An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell.

Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.

Abstract: A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves.

Abstract: An exemplary method for sealing a vapor chamber includes, firstly, providing a casing, wherein the casing has an opening. Then a metallic tube is inserted into the opening such that the tube is hermetically engaged in the opening. Next, a pressing mold is provided, wherein the pressing mold includes a positive pole and a negative pole opposite to the positive pole. A free end of the tube is pressed by the positive pole and the negative pole of the pressing mold to form a crimped sealing portion. Then electricity is charged between the positive pole and the negative pole. The electricity passes through the crimped sealing portion and heats an inner face of the crimped sealing portion to weld the crimped sealing portion.

Abstract: A plate-type heat pipe includes a sealed shell containing working liquid therein, and elongated wick structures arranged in the shell in a spaced manner. Channels are formed between the wick structures. The heat pipe has an evaporating section and a condensing section. Two ends of each wick structure are respectively located at the evaporating section and the condensing section. Top and bottom faces of each wick structure respectively contact top and bottom inner faces of the shell.

Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.

Abstract: A loop heat pipe includes an evaporator, a condenser, and a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A predetermined quantity of bi-phase working medium is contained in the closed loop. A separator connects the liquid line. A cross section of the separator is larger than a cross section of the liquid line. The separator separates the liquid state working medium from the vapor state working medium when the working medium flows therethrough.

Abstract: An exemplary plate-type heat pipe includes a condensing plate, an evaporating plate and a spherical supporting. The evaporating plate engages with the condensing plate to define a hermetic container. Working fluid is contained in the container. The supporting portion in the container is sandwiched between the condensing plate and the evaporating plate and abuts against the condensing plate and the evaporating plate.

Abstract: A heat dissipation apparatus includes an evaporator receiving heat from a heat source, a condenser releasing the heat of the heat source, and a pipeline inter connecting the evaporator and the condenser. The condenser defines a flat rectangular chamber therein. A working fluid is contained in the evaporator. The working fluid vaporizes upon receiving the heat of the heat source. The pipeline conducts the vaporized working fluid from the evaporator to the condenser. The vaporized working fluid condenses upon releasing the heat in the chamber.

Abstract: An exemplary plate-type heat pipe includes a hermetic container, working fluid contained in the container, a first wick portion and two second wick portions formed on inner surfaces of the container. The container includes an evaporating plate and a condensing plate facing each other. The evaporating plate includes a heat absorbing portion, two transition portions extending outwardly and upwardly from opposite ends of the heat absorbing portion, respectively, and two extending portions extending outwardly from outer ends of the transition portions, respectively. The first wick portion is formed on an inner surface of the heat absorbing portion. The second wick portions are formed on inner surfaces of the transition portions, respectively. The third wick portions are formed on inner surfaces of the extending portions, respectively. The third wick portions define capillary pores and a plurality of holes therein.

Abstract: A plate-type heat pipe includes a condensing plate, an evaporating plate and a first wick member. The evaporating plate cooperates with the condensing plate to define a hermetic container. Working fluid is contained in the container. The first wick member is formed on an inner surface of the condensing plate. The first wick member defines a plurality of through holes therein.

Abstract: A plate-type heat pipe includes a container, a wick structure and a plurality of supporting plates. The wick structure is adhered to an inner surface of the container. The supporting plates are received in the container and abut against opposite sidewalls of the container. Each of the supporting plates includes a connecting plate and a plurality of protruded portions extending from the connecting portion. A number of through holes are defined in the protruded portion. The supporting plates are arranged in tiers in a manner such that the protrude portions of a lower supporting plate abut against the connecting portion of an upper supporting plate, and the through holes of the supporting plates communicate with each other.

Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.