Patents by Inventor Jiang Xiaolan

Jiang Xiaolan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device assembly process
    Patent number: 7960209
    Abstract: A Conductive Epoxy Coating (“CEC”) process is provided for assembling semiconductor devices. The CEC process includes application of a conductive epoxy coating prior to wafer dicing and instead of dispensing epoxy/solder when performing die bonding. The CEC process generally begins with a silicon wafer. Processing of the silicon wafer includes coupling a conductive epoxy layer to a first side of the semiconductor wafer to form a coated wafer. The process cures the coated wafer and forms die from the coated wafer. The process further couples an exposed side of the conductive epoxy layer of the die to a lead frame to form a semiconductor device, and cures the semiconductor device.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: June 14, 2011
    Assignee: Diodes, Inc.
    Inventors: Tan Xiaochun, Jiang Xiaolan
  • Semiconductor device assembly process
    Publication number: 20050189658
    Abstract: A Conductive Epoxy Coating (“CEC”) process is provided for assembling semiconductor devices. The CEC process includes application of a conductive epoxy coating prior to wafer dicing and instead of dispensing epoxy/solder when performing die bonding. The CEC process generally begins with a silicon wafer. Processing of the silicon wafer includes coupling a conductive epoxy layer to a first side of the semiconductor wafer to form a coated wafer. The process cures the coated wafer and forms die from the coated wafer. The process further couples an exposed side of the conductive epoxy layer of the die to a lead frame to form a semiconductor device, and cures the semiconductor device.
    Type: Application
    Filed: January 31, 2005
    Publication date: September 1, 2005
    Inventors: Tan Xiaochun, Jiang Xiaolan