Abstract: The present disclosure describes methods and/or apparatus for gripping a plurality of types of circuit boards. For example, a method may include: gripping a first circuit board using a first sub-gripper of an integrated mechanical gripper, wherein the integrated mechanical gripper comprises a plurality of sub-grippers; placing the first circuit board into a transfer platform; gripping the first circuit board from the transfer platform using a second sub-gripper of the plurality of sub-grippers, flipping the first circuit board, and placing the flipped first circuit board into a splitter; splitting the first circuit board into at least one second circuit board with a different type or size from the first circuit board; and gripping the second circuit board from the splitter using a third sub-gripper of the plurality of sub-grippers.