Patents by Inventor Jiangang G. Sun

Jiangang G. Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6730912
    Abstract: A method and infrared thermal imaging apparatus detects normal and angled cracks on or beneath a sample surface using infrared thermal imaging where the crack plane is perpendicular or angled to an imaged surface of the sample. A constant heating source is used for heating a section of the sample to produce a lateral heat transfer through the sample. An infrared camera is positioned near one side of the sample for receiving thermal image data resulting from the lateral heat transfer through the sample. A data acquisition and processing computer is used for acquiring and differentiation processing thermal image data from the infrared camera for generating two-dimensional first derivative and second derivative images to detect the normal and angled cracks.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: May 4, 2004
    Assignee: The University of Chicago
    Inventors: Jiangang G. Sun, Scott M. Erdman
  • Publication number: 20040041096
    Abstract: A method and infrared thermal imaging apparatus detects normal and angled cracks on or beneath a sample surface using infrared thermal imaging where the crack plane is perpendicular or angled to an imaged surface of the sample. A constant heating source is used for heating a section of the sample to produce a lateral heat transfer through the sample. An infrared camera is positioned near one side of the sample for receiving thermal image data resulting from the lateral heat transfer through the sample. A data acquisition and processing computer is used for acquiring and differentiation processing thermal image data from the infrared camera for generating two-dimensional first derivative and second derivative images to detect the normal and angled cracks.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 4, 2004
    Applicant: THE UNIVERSITY OF CHICAGO
    Inventors: Jiangang G. Sun, Scott M. Erdman