Patents by Inventor Jiangbo Ouyang

Jiangbo Ouyang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11174419
    Abstract: Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 16, 2021
    Inventors: Puwei Liu, Jiangbo Ouyang, ChunHua Gu
  • Publication number: 20210340398
    Abstract: Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.
    Type: Application
    Filed: July 8, 2021
    Publication date: November 4, 2021
    Inventors: Robert P. CROSS, Wenhua ZHANG, Zhan YANG, Jiangbo OUYANG, Yu CHEN, Lynnette M. HURLBURT, Darel L. GUSTAFSON
  • Publication number: 20210324219
    Abstract: Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Robert P. Cross, Bahram lssari, Wenhua Zhang, Lynnette M. Hurlburt, Jiangbo Ouyang, Rudolf Oldenzijl, Inge van der Meulen
  • Patent number: 11066549
    Abstract: This invention relates to a (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer, preparation method and use thereof. The (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer according to the present invention exhibits outstanding thermal stability and excellent optical properties.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: July 20, 2021
    Assignees: Henkel IP & Holding GmbH, Henkel AG & Co. KGaA
    Inventors: Zhuming Shi, Cheng Lu, Jiangbo Ouyang
  • Patent number: 11015095
    Abstract: The present invention relates to a photo-curable adhesive composition comprising a (meth)acrylate capped aliphatic polyurethane having an average number of ethylenically unsaturated groups less than 1, a mono-functional (meth)acrylate monomer or oligomer and a photoinitiator. The adhesive composition can be used in a method of bonding a substrate to a liquid crystal display. The adhesive composition according to the present invention has improved side curing depth.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: May 25, 2021
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Chao Hu, Jiangbo Ouyang, Junwei Yang
  • Publication number: 20200048451
    Abstract: This invention relates to a (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer, preparation method and use thereof. The (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer according to the present invention exhibits outstanding thermal stability and excellent optical properties.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Zhuming Shi, Cheng Lu, Jiangbo Ouyang
  • Publication number: 20190315891
    Abstract: This invention relates to a thioxanthone derivative photoinitiator, a radiation curable composition comprising the same and the use thereof. In particular, the invention relates to thioxanthone derivative photoinitiator suitable to be in one drop filling process for manufacturing liquid crystal display device without the concern of liquid crystal contamination.
    Type: Application
    Filed: June 26, 2019
    Publication date: October 17, 2019
    Inventors: Zhuming Shi, Zhenhua Ju, Zheng Lu, Jiangbo Ouyang, Jinqian Chen
  • Patent number: 10392543
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 27, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20190218434
    Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
    Type: Application
    Filed: February 27, 2019
    Publication date: July 18, 2019
    Inventors: Puwei Liu, Jiangbo Ouyang, ChunHua Gu
  • Publication number: 20190169478
    Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.
    Type: Application
    Filed: June 5, 2018
    Publication date: June 6, 2019
    Inventors: Shengqian KONG, Yayun LIU, Wenhua ZHANG, Stephen HYNES, John G. WOODS, Jiangbo OUYANG, Chunyu SUN, Bahram ISSARI
  • Patent number: 10280349
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 7, 2019
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram Issari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Publication number: 20190071593
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20180072929
    Abstract: The present invention relates to a photo-curable adhesive composition comprising a (meth)acrylate capped aliphatic polyurethane having an average number of ethylenically unsaturated groups less than 1, a mono-functional (meth)acrylate monomer or oligomer and a photoinitiator. The adhesive composition can be used in a method of bonding a substrate to a liquid crystal display. The adhesive composition according to the present invention has improved side curing depth.
    Type: Application
    Filed: November 21, 2017
    Publication date: March 15, 2018
    Inventors: Chao HU, Jiangbo OUYANG, Junwei YANG
  • Patent number: 9850409
    Abstract: A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: December 26, 2017
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun
  • Publication number: 20170283671
    Abstract: The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 5, 2017
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, JinQian Chen
  • Publication number: 20170081574
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Application
    Filed: December 7, 2016
    Publication date: March 23, 2017
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram lssari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Patent number: 9587054
    Abstract: The present invention discloses polymers prepared from polar vinyl monomers and non-polar olefin monomers with the polymers having high olefin content and high weight average molecular weights as well as methods of preparing them. The inventive polymers possess interesting properties that make them particularly attractive in several industrial applications.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: March 7, 2017
    Assignee: Henkel IP & Holding GmbH
    Inventors: Laxmisha Sridhar, Smita Shah, John G. Woods, Anthony F. Jacobine, Jiangbo Ouyang, Austin Sloan, Swapnali Chaudhari
  • Patent number: 9371473
    Abstract: Benzoylthiourea or benzoylthiourethane derivatives as cure accelerators in primers for two step adhesive systems are provided.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: June 21, 2016
    Assignees: Henkel IP & Holding GmbH, Henkel AG & Co. KGaA
    Inventors: David P. Birkett, Anthony F. Jacobine, Andrew D. Messana, Joel D. Schall, David Mullen, Martin Wyer, Lynnette Hurlburt, Jiangbo Ouyang, Smita Shah
  • Publication number: 20160152746
    Abstract: The present invention discloses polymers prepared from polar vinyl monomers and non-polar olefin monomers with the polymers having high olefin content and high weight average molecular weights as well as methods of preparing them. The inventive polymers possess interesting properties that make them particularly attractive in several industrial applications.
    Type: Application
    Filed: February 8, 2016
    Publication date: June 2, 2016
    Inventors: Laxmisha Sridhar, Smita Shah, John G. Woods, Anthony F. Jacobine, Jiangbo Ouyang, Austin Sloan, Swapnali Chaudhari
  • Publication number: 20160068720
    Abstract: A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetra-siloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300° C. or greater, and is mechanically debondable at room temperature at a force less than 5N/25 mm.
    Type: Application
    Filed: November 13, 2015
    Publication date: March 10, 2016
    Inventors: Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes, Jiangbo Ouyang, Chunyu Sun