Abstract: Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.

Abstract: Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.

Abstract: A dual-cure adhesive composition that exhibits very low visible light reflectance when in a cured condition. The adhesive is curable by electromagnetic radiation and temperature at or above room temperature. Due to the very low visible light reflectance, the adhesive is particularly applicable to optical products that demand minimal interference with visible light transmission.

Abstract: Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.

Abstract: Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.

Abstract: Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.

Abstract: This invention relates to a (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer, preparation method and use thereof. The (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer according to the present invention exhibits outstanding thermal stability and excellent optical properties.

Abstract: The present invention relates to a photo-curable adhesive composition comprising a (meth)acrylate capped aliphatic polyurethane having an average number of ethylenically unsaturated groups less than 1, a mono-functional (meth)acrylate monomer or oligomer and a photoinitiator. The adhesive composition can be used in a method of bonding a substrate to a liquid crystal display. The adhesive composition according to the present invention has improved side curing depth.

Abstract: This invention relates to a (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer, preparation method and use thereof. The (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer according to the present invention exhibits outstanding thermal stability and excellent optical properties.

Abstract: This invention relates to a thioxanthone derivative photoinitiator, a radiation curable composition comprising the same and the use thereof. In particular, the invention relates to thioxanthone derivative photoinitiator suitable to be in one drop filling process for manufacturing liquid crystal display device without the concern of liquid crystal contamination.

Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.

Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Abstract: The present invention relates to a photo-curable adhesive composition comprising a (meth)acrylate capped aliphatic polyurethane having an average number of ethylenically unsaturated groups less than 1, a mono-functional (meth)acrylate monomer or oligomer and a photoinitiator. The adhesive composition can be used in a method of bonding a substrate to a liquid crystal display. The adhesive composition according to the present invention has improved side curing depth.

Abstract: A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

Abstract: The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker.

Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

Abstract: The present invention discloses polymers prepared from polar vinyl monomers and non-polar olefin monomers with the polymers having high olefin content and high weight average molecular weights as well as methods of preparing them. The inventive polymers possess interesting properties that make them particularly attractive in several industrial applications.