Abstract: The present disclosure relates to engineered RNA m6A demethylases with disrupted low complexity regions (LCRs) for expression in plants, as well as recombinant DNA encoding the engineered RNA m6A demethylases, vectors encoding the recombinant DNA, plants including the engineered RNA m6A demethylases, and method of improving the growth of plants using the engineered RNA m6A demethylases, including increased root growth and elevated photosynthesis. The present disclosure further relates to methods of improving growth of a plant, including increased root growth and elevated photosynthesis, by modifying endogenous ALKBH5 homolog genes to include disrupted LCRs, and plants produced by those methods.

Abstract: N6-methyladenosine (m6A) is the most abundant internal modification on mammalian messenger RNA (mRNA). It is installed by a writer complex and can be reversed by erasers such as the fat mass and obesity-associated protein FTO. Despite extensive research, the primary physiological substrates of FTO in mammalian tissues and development remain elusive. Aspects disclosed show that FTO mediates m6A demethylation of long-interspersed element-1 LINE1 RNA in mouse embryonic stem cells (mESCs), regulating LINE1 RNA abundance and the local chromatin state, which in turn modulates transcription of LINE1-containing genes. FTO-mediated LINE1 RNA m6A demethylation also plays regulatory roles in shaping chromatin state and gene expression during mouse oocyte and embryonic development. FTO overexpression is also disclosed to modulate fertility.

Abstract: An integrated apparatus, a detection apparatus, a terminal, and a manufacturing method are disclosed, relate to the field of electronic technologies, and are used to resolve problems of heat dissipation and proneness to a chip stress of a sensing chip. The integrated apparatus includes a substrate layer, a sensing chip, and a PCB. The sensing chip is disposed on the substrate layer. The PCB is disposed on the substrate layer, the PCB is provided with an opening, the sensing chip is located in the opening, and the sensing chip is connected to the PCB through a transmission line. A difference between a coefficient of thermal expansion CTE of the substrate layer and a CTE of the sensing chip is less than a first preset threshold.

Abstract: The present disclosure provides novel materials and methods related to the treatment of cancer. In particular, the present disclosure provides compositions and methods for treating and/or preventing cancer based on the attenuation of Methyltransferase-like Protein 3 (METTL3) activity in a tumor cell. The compositions and methods disclosed herein include the use of a deubiquitinase inhibitor with or without an agent that modulates chromatin state and/or an agent that modulates DNA damage repair.

Abstract: A patch-type passive acoustic waving sensing device includes a surface acoustic wave sensor and at least a first and second rubber sheets. A cross-section of each of the first and second rubber sheets is larger than that of the surface acoustic wave sensor. A bottom of the surface acoustic wave sensor is on an upper surface of the first rubber sheet, and a first central hole allowing the surface acoustic wave sensor to penetrate therethrough is formed in a center of the second rubber sheet. The surface acoustic wave sensor penetrates the first central hole, and the second rubber sheet is fixedly connected to the upper surface of the first rubber sheet. The surface acoustic wave sensor includes pins at the bottom thereof such that free ends of the pins are connected to an antenna, and the antenna and some of the pins are inside the first rubber sheet.

Abstract: A patch-type passive acoustic waving sensing device includes a surface acoustic wave sensor and at least a first and second rubber sheets. A cross-section of each of the first and second rubber sheets is larger than that of the surface acoustic wave sensor. A bottom of the surface acoustic wave sensor is on an upper surface of the first rubber sheet, and a first central hole allowing the surface acoustic wave sensor to penetrate therethrough is formed in a center of the second rubber sheet. The surface acoustic wave sensor penetrates the first central hole, and the second rubber sheet is fixedly connected to the upper surface of the first rubber sheet. The surface acoustic wave sensor includes pins at the bottom thereof such that free ends of the pins are connected to an antenna, and the antenna and some of the pins are inside the first rubber sheet.