Abstract: The present disclosure discloses an organic light-emitting diode package, a display panel and a method for manufacturing the same. The method may include: providing a substrate comprising a baseplate, a pixel-defining layer disposed on the baseplate and a light-emitting layer disposed in an opening of the pixel-defining layer, wherein the light-emitting layer comprises an organic light-emitting diode; forming a first inorganic layer on the substrate; preparing an ultraviolet absorbing layer on the first inorganic layer; and forming a planarization layer and a second inorganic layer in sequence on the ultraviolet absorbing layer. The implementation of the present disclosure may effectively reduce the damage from external ultraviolet light to the organic light-emitting diode.

Abstract: The present invention provides an encapsulation thin-film, including a first inorganic layer composed of a first oxide; a polymer layer disposed on the first inorganic layer, and composed of a polymer bonded to the first oxide by a chemical bond; and a second inorganic layer disposed on the polymer layer, and bonded to the polymer by a chemical bond. The encapsulation thin-film and the display device according to the present invention, the first inorganic layer, the polymer layer and the second inorganic layer are bonded by a chemical bond, thus can prevent external water and oxygen corrosion and improve bending resistance of the display device.

Abstract: An organic light emitting diode display device includes a flexible substrate, a pixel isolation layer, a plurality of pixels, a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer. The pixel isolation layer is disposed on the flexible substrate. The pixels are disposed on the flexible substrate. The first inorganic encapsulation layer is disposed on the pixels and includes at least one stress adjustment layer. The first organic encapsulation layer is disposed on the first inorganic encapsulation layer. The second inorganic encapsulation layer is disposed on the first organic encapsulation layer and covers the first inorganic encapsulation layer.

Abstract: The disclosure discloses an inorganic film applied for thin film encapsulation of an OLED device. The inorganic film includes inorganic layer units including a first inorganic layer, a second inorganic layer, and a third inorganic layer located between the first inorganic layer and the second inorganic layer, and the third inorganic layer is formed by reacting the first inorganic layer with the second inorganic layer. The inorganic film is used in the thin film encapsulation of the OLED device, which can improve the ability of the device to block the water and oxygen and improve the product quality.

Abstract: An organic light-emitting diode display is provided. The organic light-emitting diode display includes an organic light-emitting display layer having red light-emitting units, green light-emitting units, and blue light-emitting units; a first inorganic layer disposed on the organic light-emitting display layer; and a light filter layer including a plurality of light filter units to increase light extraction efficiency of the light filter layer. The light filter units include first light filter units, second light filter units, and third light filter units. The first light filter units are aligned with the red light-emitting units; the second light filter units are aligned with the green light-emitting units; and the third light filter units are aligned with the blue light-emitting units. Material of the light filter layer is ink.

Abstract: An OLED packaging method is provided, in which a first outer bound confinement layer is first formed and then, a first organic layer is formed on the first inorganic layer in an area enclosed by the first outer bound confinement layer so that facilities for forming the first organic layer can be diversified and an organic material used to form the first organic layer is not subjected to constraint in respect of viscosity thereof, whereby using an organic material with a reduced viscosity allows for better homogeneity of the first organic layer, the thickness reduced, and thus helping reduce a curving radius of the OLED package structure to realize rollable displaying with a reduced curving radius. Further, the first outer bound confinement layer helps block external moisture and oxygen from corroding the first organic layer in a sideway direction.

Abstract: An organic light emitting diode display device includes a flexible substrate, a pixel isolation layer, a plurality of pixels, a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer. The pixel isolation layer is disposed on the flexible substrate. The pixels are disposed on the flexible substrate. The first inorganic encapsulation layer is disposed on the pixels and includes at least one stress adjustment layer. The first organic encapsulation layer is disposed on the first inorganic encapsulation layer. The second inorganic encapsulation layer is disposed on the first organic encapsulation layer and covers the first inorganic encapsulation layer.

Abstract: A flexible organic light-emitting diode (OLED) display and a method for manufacturing the same are provided. The method includes: forming an organic light-emitting display layer on a flexible substrate; coating a nanocomposite material on the organic emitting display layer to form a nanocomposite layer; and forming a first inorganic layer on the nanocomposite layer. The nanocomposite material is obtained by modifying surfaces of a plurality of nanoparticles with oleyl phosphate and then dispersing the modified nanoparticles in an organic monomer.

Abstract: The present invention provides an OLED display device, comprising: an OLED display panel, the OLED display panel comprising a display area and non-display areas in the both-ends edges of the display area; a dam unit and a film packaging layer. A part of the film packaging layer corresponding to the display area is disposed on the surface of the OLED display panel; another part of the film packaging layer corresponding to the non-display area is disposed on the surface of the dam unit; wherein, the dam unit comprises a flattening layer, a pixel isolation layer and a pixel support layer stacked-up together.

Abstract: A flexible organic light emitting diode display and a manufacturing method thereof are provided. The manufacturing method includes steps of forming an active array layer and a photoresist layer sequentially on a flexible substrate, patterning the photoresist layer to form a plurality of pixel units, forming a light emitting main layer between two of the pixel units adjacent to each other, removing the pixel units with an organic solvent, forming a conductive transport layer on the light emitting main layer, and forming an encapsulation layer on the conductive transport layer.

Abstract: The present invention provides an encapsulation thin-film, including a first inorganic layer composed of a first oxide; a polymer layer disposed on the first inorganic layer, and composed of a polymer bonded to the first oxide by a chemical bond; and a second inorganic layer disposed on the polymer layer, and bonded to the polymer by a chemical bond. The encapsulation thin-film and the display device according to the present invention, the first inorganic layer, the polymer layer and the second inorganic layer are bonded by a chemical bond, thus can prevent external water and oxygen corrosion and improve bending resistance of the display device.

Abstract: The disclosure discloses an inorganic film applied for thin film encapsulation of an OLED device. The inorganic film includes inorganic layer units including a first inorganic layer, a second inorganic layer, and a third inorganic layer located between the first inorganic layer and the second inorganic layer, and the third inorganic layer is formed by reacting the first inorganic layer with the second inorganic layer. The inorganic film is used in the thin film encapsulation of the OLED device, which can improve the ability of the device to block the water and oxygen and improve the product quality.

Abstract: An OLED package structure includes a first outer bound confinement layer formed on an OLED device, a first outer bound confinement layer arranged on the first inorganic layer and enclosing and delimiting a confinement space, a first organic layer formed on the first inorganic layer in the confinement space, and a second inorganic layer arranged on the first organic layer and the first outer bound confinement layer, such that a peripheral portion of the second inorganic layer is positioned on and supported by the first outer bound confinement layer and a central portion of the second inorganic layer is partly received in the confinement space to have a bottom of the second inorganic layer positioned on and contacting a top of the first organic layer.

Abstract: The present disclosure relates to the field of liquid crystal display technology, and more particularly, to the flexible display panel and the manufacturing method thereof. The method includes forming the polymer on the anode layer from vapor of the organic dimer as the micro-cavity adjusting layer by the chemical vapor deposition method at the controlled temperature between 650° C. to 750° C. The structural formula of the organic dimer is as shown in Formula 1, wherein R is selected from one of H, F, Cl, and Br. The cathodic protective layer and the encapsulation layer can be formed by the same material and processes. The present disclosure discloses preparing the micro-cavity adjustment layer, the cathodic protective layer, and the encapsulation layer of the flexible OLED with the same material, which can simplify the preparation processes.

Abstract: The present disclosure discloses an organic light emitting diode package structure and its method of manufacturing, and a display device. The method of manufacturing includes: preparing an inorganic substrate comprising a hydroxyl group; preparing a first atomic transition layer on the inorganic substrate; coating a first organic layer on the first atomic transition layer, the first organic layer is formed by mixing two epoxy resin monomers; and curing the first organic layer so that the first organic layer is chemically bonded to the inorganic substrate through the first atomic transition layer. In the above manner, the present disclosure can increase the adhesion between the organic layer and the inorganic layer and prevent the display device from package failure caused by peeling between the package layers during bending or folding.

Abstract: The present disclosure discloses an organic light-emitting diode package, a display panel and a method for manufacturing the same. The method may include: providing a substrate comprising a baseplate, a pixel-defining layer disposed on the baseplate and a light-emitting layer disposed in an opening of the pixel-defining layer, wherein the light-emitting layer comprises an organic light-emitting diode; forming a first inorganic layer on the substrate; preparing an ultraviolet absorbing layer on the first inorganic layer; and forming a planarization layer and a second inorganic layer in sequence on the ultraviolet absorbing layer. The implementation of the present disclosure may effectively reduce the damage from external ultraviolet light to the organic light-emitting diode.

Abstract: The present disclosure discloses an organic light emitting diode package structure and its method of manufacturing, and a display device. The method of manufacturing includes: preparing an inorganic substrate comprising a hydroxyl group; preparing a first atomic transition layer on the inorganic substrate; coating a first organic layer on the first atomic transition layer, the first organic layer is formed by mixing two epoxy resin monomers; and curing the first organic layer so that the first organic layer is chemically bonded to the inorganic substrate through the first atomic transition layer. In the above manner, the present disclosure can increase the adhesion between the organic layer and the inorganic layer and prevent the display device from package failure caused by peeling between the package layers during bending or folding.

Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, a display device and an encapsulant, and the display device are arranged on the substrate. The encapsulant covers the edge of the display device and the substrate. The encapsulant includes at least two inorganic encapsulation layers and at least one organic encapsulation layer; the at least two inorganic encapsulating layers and the at least one organic encapsulating layer are alternately stacked with each other and integrated as a whole in a direction perpendicular to the substrate. Thus, the display device in the display panel can be prevented from contacting with water and oxygen.

Abstract: A thin-film packaging method for OLED device and an OLED device are disclosed. The method comprises: providing an OLED device to be packaged, and the OLED device to be packaged includes a light-emitting layer; through a lithography patterning technology to alternately form an inorganic thin film and an organic thin film on the OLED device in order to perform a thin-film packaging for the OLED device; wherein, the step of alternately forming an inorganic thin film and an organic thin film includes: forming a photoresist layer that surrounds the light-emitting layer of the OLED device on the OLED device to be packaged, and forming the inorganic thin film and the organic thin film on an opening region of the photoresist layer. The present invention can avoid a shadow effect of a mask, an overflow problem of ink at the edge, and can achieve a narrow frame requirement of the device.

Abstract: A flexible organic light emitting diode display and a method for manufacturing the same are provided. The flexible organic light emitting diode display includes sequentially forming an organic light emitting display layer, a first inorganic layer, a first dative bond layer, a polymer organic layer, and a second inorganic layer on a flexible substrate; the first dative bond layer is configured to provide an electron-rich group; the polymer organic layer has an electron-deficient group, the electron-deficient group and the electron-rich group commonly form a dative bond.