Patents by Inventor Jianglong Gong

Jianglong Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip assembly, camera and electronic device
    Patent number: 11323595
    Abstract: A chip assembly and a mold assembly for fabricating the same, a camera and an electronic device are disclosed. The chip assembly includes a circuit board, a chip and a conductive wire. The chip is provided to the circuit board, and the chip and the circuit board are in a stacked arrangement. One end of the conductive wire is electrically coupled to the circuit board, the other end of the conductive wire is electrically coupled to the chip, and a partial segment of the conductive wire is attached to a side wall face of the chip.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 3, 2022
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Jianglong Gong
  • Chip Assembly, Camera and Electronic Device
    Publication number: 20210185192
    Abstract: A chip assembly and a mold assembly for fabricating the same, a camera and an electronic device are disclosed. The chip assembly includes a circuit board, a chip and a conductive wire. The chip is provided to the circuit board, and the chip and the circuit board are in a stacked arrangement. One end of the conductive wire is electrically coupled to the circuit board, the other end of the conductive wire is electrically coupled to the chip, and a partial segment of the conductive wire is attached to a side wall face of the chip.
    Type: Application
    Filed: November 19, 2018
    Publication date: June 17, 2021
    Inventor: Jianglong Gong