Patents by Inventor Jiangoi He

Jiangoi He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic package, method of manufacturing same, and system containing same
    Publication number: 20080067668
    Abstract: A microelectronic package includes a substrate (110), a die (120) electrically connected to the substrate, and a heat dissipation device (130) coupled to the die. The heat dissipation device includes a capacitor (250, 310). In one embodiment the heat dissipation device is a microchannel having a base (131) and a cover plate (132, 300) over the base, and the capacitor is located within the cover plate.
    Type: Application
    Filed: September 15, 2006
    Publication date: March 20, 2008
    Inventors: Wei Shi, Daoqiang Lu, Qing Zhou, Jiangoi He