Abstract: The present disclosure provides a device (300) for degumming and inserting silicon wafers and method for processing silicon wafers. The device (300) for degumming and inserting silicon wafers includes a material frame (1), a grabbing mechanism (2), a degumming mechanism (3), an unlocking mechanism (8) and an inserting mechanism (4). The material frame (1) is configured for placing and clamping a plurality of silicon wafers (100) bonded with a support (200), the grabbing mechanism (2) is configured for grabbing and transferring the material frame (1) or the support (200), the degumming mechanism (3) is configured for degumming the plurality of silicon wafers (100) from the support (200), the unlocking mechanism (8) is configured for releasing clamping and fixing of the material frame (1) on the plurality of silicon wafers (100), and the inserting mechanism (4) is configured for splitting the degummed plurality of silicon wafers (100).

Abstract: The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end of the conveying component (20) proximal to the spraying component (30) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

Abstract: The present disclosure provides a device (300) for degumming and inserting silicon wafers and method for processing silicon wafers. The device (300) for degumming and inserting silicon wafers includes a material frame (1), a grabbing mechanism (2), a degumming mechanism (3), an unlocking mechanism (8) and an inserting mechanism (4). The material frame (1) is configured for placing and clamping a plurality of silicon wafers (100) bonded with a support (200), the grabbing mechanism (2) is configured for grabbing and transferring the material frame (1) or the support (200), the degumming mechanism (3) is configured for degumming the plurality of silicon wafers (100) from the support (200), the unlocking mechanism (8) is configured for releasing clamping and fixing of the material frame (1) on the plurality of silicon wafers (100), and the inserting mechanism (4) is configured for splitting the degummed plurality of silicon wafers (100).

Abstract: The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end close to the spraying component (30) of the conveying component (20) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

Abstract: A turnaround mechanism of silicon wafers is provided. The turnaround mechanism includes a material frame, a supporting component, a second clamping component. The frame is provided with a material tank. The supporting component includes at least one first clamping component, and each of the at least one first clamping component is configured to clamp or release a support. The second clamping component includes two first rotating shafts disposed oppositely and two second clamping members, the two first rotating shafts are rotatably connected to the material frame, the two second clamping members are correspondingly disposed on the two first rotating shafts respectively, and each of the two second clamping members can rotate with a corresponding first rotating shaft, enabling the two second clamping members to move toward each other to clamp the silicon wafers to be separated.