Patents by Inventor Jiangud Ma

Jiangud Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6998953
    Abstract: A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: February 14, 2006
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Kiat Seng Yeo, Hai Peng Ian, Jiangud Ma, Manh Anh Do, Johnny Kok Wai Chew
  • Publication number: 20050167828
    Abstract: A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.
    Type: Application
    Filed: March 31, 2005
    Publication date: August 4, 2005
    Inventors: Kiat Yeo, Hai Ian, Jiangud Ma, Manh Do, Johnny Chew