Patents by Inventor Jiangwei SUI

Jiangwei SUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10727579
    Abstract: Radio frequency antennas sharing a ground plane are largely decoupled using one or more lumped capacitive elements set into holes within the ground plane. The holes, which are precisely placed, can extend to a side of the ground plane. A stub extends from a fringe of the hole either straight or bending in an L shape, and a capacitor connects between an end of the stub and another side of the hole. Capacitive elements can also be supported on raised solder pads above a ground plane or off to one side of the ground plane. Methods for manufacturing the decoupling apparatus are described.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: July 28, 2020
    Assignee: The Chinese University of Hong Kong
    Inventors: Ke-Li Wu, Jiangwei Sui, Dacheng Wei
  • Publication number: 20200044329
    Abstract: Radio frequency antennas sharing a ground plane are largely decoupled using one or more lumped capacitive elements set into holes within the ground plane. The holes, which are precisely placed, can extend to a side of the ground plane. A stub extends from a fringe of the hole either straight or bending in an L shape, and a capacitor connects between an end of the stub and another side of the hole. Capacitive elements can also be supported on raised solder pads above a ground plane or off to one side of the ground plane. Methods for manufacturing the decoupling apparatus are described.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 6, 2020
    Applicant: The Chinese University of Hong Kong
    Inventors: Ke-Li WU, Jiangwei Sui, Dacheng Wei
  • Patent number: 10164330
    Abstract: The disclosure provides antenna assemblies and methods for reducing mutual coupling of coupled antennas. According to an embodiment, the antenna assembly, comprises: a first antenna; and a second antenna coupled with the first antenna; wherein a first capacitive load is provided to the first antenna at a first position of the first antenna so that a mutual coupling between the first antenna and the second antenna is reduced. According to the present disclosure, at least some of the following advantages may be achieved: 1) no any component that connects or structure between coupled antennas is required; 2) the capacitive load is very little frequency dependent so that the method is highly suitable for antenna decoupling at low frequencies; 3) the required capacitive load takes almost no space in the circuit layout; and 4) the load does not noticeably change antenna radiation patterns.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: December 25, 2018
    Assignee: The Chinese University of Hong Kong
    Inventors: Ke-Li Wu, Jiangwei Sui, Dacheng Wei
  • Publication number: 20180108984
    Abstract: The disclosure provides antenna assemblies and methods for reducing mutual coupling of coupled antennas. According to an embodiment, the antenna assembly, comprises: a first antenna; and a second antenna coupled with the first antenna; wherein a first capacitive load is provided to the first antenna at a first position of the first antenna so that a mutual coupling between the first antenna and the second antenna is reduced. According to the present disclosure, at least some of the following advantages may be achieved: 1) no any component that connects or structure between coupled antennas is required; 2) the capacitive load is very little frequency dependent so that the method is highly suitable for antenna decoupling at low frequencies; 3) the required capacitive load takes almost no space in the circuit layout; and 4) the load does not noticeably change antenna radiation patterns.
    Type: Application
    Filed: October 17, 2016
    Publication date: April 19, 2018
    Inventors: Ke-Li Wu, Jiangwei SUI, Dacheng WEI